GO1555IXTE3

GO1555 Voltage Controlled Oscillator GO1555 Data Sheet Key Features Description • Generates 1.485GHz or 1.485/1.001GHz signal for Gennum ICs • Low power — 20mW less than GO1525 • 50Ω output impedance The GO1555 is a self contained, miniature Voltage Controlled Oscillator (VCO). It produces a clean 1.485GHz reference clock signal with low spurious noise content. It is designed to drive 50Ω strip lines. • Operates from a single 2.5V supply • 8 pin tape on reel • Pb-free and RoHS Compliant The VCO requires a single 2.5V supply and draws a maximum of 8mA of current. It is packaged in a miniature 8-pin proprietary surface mount package and operates over the temperature range of -40°C to +85°C. The GO1555 can be used in place of the older GO1525 VCO. Compared to the GO1525, the GO1555 saves space, consumes less power and achieves better jitter performance. Applications Other Products: • GS4915 ClockCleaner™ Deserializers: • Note: Optimal performance of the GO1555 is achieved using slightly different loop bandwidth component values than those used with the GO1525. GS1559, GS1560A, GS1561, GS9060 Serializers: • GS1531, GS1532, GS9062 This component and all homogeneous subcomponents are RoHS compliant. VCTR VCC STRIPLINE STRIPLINE OUT OSCILLATOR CIRCUIT GND GO1555 Functional Block Diagram 40746 - 1 November 2006 1 of 12 www.gennum.com GO1555 Data Sheet Contents Key Features .................................................................................................................1 Applications...................................................................................................................1 Description ....................................................................................................................1 1. Pin Out ......................................................................................................................3 1.1 Pin Assignment ...............................................................................................3 1.2 Pin Descriptions ..............................................................................................3 2. Electrical Characteristics ...........................................................................................4 3. Soldering Recommendations ....................................................................................5 3.1 Reflow Conditions ...........................................................................................6 3.2 Soldering Flux .................................................................................................6 3.3 Rework or Repair ............................................................................................6 3.4 Endurance To Warp ........................................................................................6 4. Handling Recommendations .....................................................................................7 4.1 Cleaning ..........................................................................................................7 4.2 Storage ...........................................................................................................7 4.3 Transport .........................................................................................................7 4.4 ESD Warning ..................................................................................................7 5. Package & Ordering Information ...............................................................................8 5.1 Package Dimensions ......................................................................................8 5.2 Packaging Data ...............................................................................................8 5.3 Tape and Reel Specification ...........................................................................9 5.4 PCB Footprint ...............................................................................................11 5.5 Marking Diagram ...........................................................................................11 5.6 Ordering Information .....................................................................................11 6. Revision History ......................................................................................................12 40746 - 1 November 2006 2 of 12 GO1555 Data Sheet 1. Pin Out 1.1 Pin Assignment NC GND O/P 3 2 1 GO1555 4 GND 8 GND TOP VIEW 5 6 7 VCTR GND VCC NOTE: Pin numbers are arbitrary There are no pin markings on the device itself 1.2 Pin Descriptions Table 1-1: Pin Descriptions Pin Number Name Type Description 2, 4, 6, 8 GND Power Most negative power supply connections. 5 VCTR Input Control voltage for the VCO. 7 VCC Power Most positive power supply connection. 1 O/P Output VCO signal output. 3 NC – No connection. 40746 - 1 November 2006 3 of 12 GO1555 Data Sheet 2. Electrical Characteristics Table 2-1: Electrical Characteristics VCC = 2.5V ±0.25V, Temperature = -40°C to +85°C, unless otherwise shown Parameter Symbol Conditions Min Typ Max Units Notes Supply Voltage VCC – 2.25 2.5 2.75 V – Supply Current ΙS – – – 8 mA – Control Voltage Range VCTR – 1.0 1.25 1.5 V – Control Voltage Sensitivity df/dV VCTR = 1.0V - 1.5V 35.5 – 48.5 MHz/V – Operating Frequency Range ƒVCO VCTR = 1.0V – – 1483.5 MHz – VCTR = 1.5V 1485.0 – – MHz Output Signal Level VOUT – -10.5 – -3 dBm – Pushing Figure – VCC = 2.5V ± 0.25V, ref: VCC = 2.5V -1.5 – +1.5 MHz – Pulling Figure – VSWR = 2.0 for all phase, ref: 50Ω -3 – +3 MHz – Temperature Stability TCOEF -40°C to +85°C, ref. = 25°C -3 – 4 MHz – Spurious Response – – – – -10 dBc – Output Impedance ZO – – 50 – Ω – 40746 - 1 November 2006 4 of 12 GO1555 Data Sheet 3. Soldering Recommendations The device is manufactured with Matte-Sn terminations and is compatible with both standard eutectic and Pb-free solder reflow profiles. The recommended standard eutectic reflow profile is shown in Figure 3-1. The maximum recommended Pb-free reflow profile is shown in Figure 3-2. 60-150 sec. Temperature 10-20 sec. 230˚C 220˚C 3˚C/sec max 183˚C 6˚C/sec max 150˚C 100˚C 25˚C Time 120 sec. max 6 min. max Figure 3-1: Standard Eutectic Solder Reflow Profile Temperature Max 80 sec. Max 10 sec. 260˚C 250˚C 3˚C/sec max 220˚C 6˚C/sec max 200˚C 150˚C 25˚C Time 60-120 sec. max 8 min. max Figure 3-2: Maximum Pb-free Solder Reflow Profile (Preferred) 40746 - 1 November 2006 5 of 12 GO1555 Data Sheet 3.1 Reflow Conditions The device will meet the data sheet specifications after completing the reflow process according to the profile shown in Figure 3-1 or Figure 3-2. Recommended soldering conditions are as follows: Preheating 150±10°C, 60 to 120 sec. Soldering Peak 260°C Over 220°C within 80 sec. 3.2 Soldering Flux Do not use cleaning type flux. Washing the devices after using cleaning type flux may damage inner parts and affect performance. 3.3 Rework or Repair Rework or repair must only be done once. Do not reflow the device more than twice; once for initial soldering and once for remounting after rework. Do not vibrate the VCO during reflow soldering. 3.4 Endurance To Warp When the device is soldered on a printed circuit board (dimension: 100mm x 100mm; thickness: 1.6mm) and the PCB is warped as shown in Figure 3-3, the device will not be cracked or damaged. VCO PCB MAX 2mm Figure 3-3: PCB Warp 40746 - 1 November 2006 6 of 12 GO1555 Data Sheet 4. Handling Recommendations 4.1 Cleaning There are two options for cleaning the devices. Option 1: 1. Clean but do not use solvent cleaners. 2. Thoroughly dry assemblies afterwards. Option 2: 1. Mount device after board is cleaned. 4.2 Storage Store the devices out of direct sunlight, at a stable temperature and humidity. Avoid extreme temperatures, high humidity and wide temperature fluctuations. Condensation on the devices may result in reduced quality and lowered solderability. Avoid dust, sea breezes and corrosive gases (Cl2, NH3, SO2, NOX, etc.). Use within 6 months after delivery. If the devices are stored for more than one year, solderability may be degraded. 4.3 Transport Package the devices for transportation to avoid mechanical vibration or shock. 4.4 ESD Warning Avoid poor ground connections and electrostatic discharge or induction in production. 40746 - 1 November 2006 7 of 12 GO1555 Data Sheet 5. Package & Ordering Information 5.1 Package Dimensions 3 2 1 NC GND OUT 5 6 7 0.45+/-0.15 0.45+/-0.15 G55 4 GND GND M 8 4 3.20+/-0.20 8 1.10+/-0.10 2.30+/-0.10 D 1 2 3 VCTR GND VCC 5 6 7 0.45+/-0.15 3 2 1 0.30+/-0.15 0.90+/-0.10 1.10+/-0.10 0.90+/-0.10 2.10+/-0.10 4.50+/-0.20 NOTE: The terminals are not marked on the case. Terminals : Gold plating Solder plating 1.50 max. Resist : Cover of resist spreading Unit (mm) 5.2 Packaging Data Parameter Value Package Type 8L Proprietary Surface Mount Package Drawing Reference 40567 rev.0 Pb-free and RoHS Compliant Yes 40746 - 1 November 2006 8 of 12 GO1555 Data Sheet 5.3 Tape and Reel Specification Trailer A Leader B 4.0+/-0.1 Direction to pull VCO (DIMENSION) 8.0+/-0.1 3.6+/-0.1 1.55+/-0.05 4.9+/-0.1 G55 M D123 G55 M D123 G55 M D123 VCO (DIMENSION) 0 12.0+/-0.2 2.00+/-0.05 1.5 +0.1 - 5.50+/-0.05 1.75+/-0.10 Packaging units 3.6+/-0.1 Unit [mm] (DIMENSION) Figure 5-1: Tape Specification The dimensions of A (trailer of tape) include the one inserted in the reel core. Table 5-1: Tape Dimensions Trailer A Empty cavities >= 40mm Leader B Empty cavities, Cover tape leader >= 400mm Packaging Units 3000pcs Partial absence in carrier tape More than two successive empty cavities will not occur. Minimum order quantity 3000pcs / Reel 40746 - 1 November 2006 9 of 12 GO1555 Data Sheet R80 10 100 +/- 1 330 +/- 2 PS 6 0.6 22 13 +/- 0.2 R135 R55 120 W1 W2 Reel Internal : W1 13.5 +/- 0.5 Reel External : W2 17.5 +/- 1.0 Unit : mm Figure 5-2: Reel Specification 40746 - 1 November 2006 10 of 12 GO1555 Data Sheet 5.4 PCB Footprint Recommended Footprint for PCB Layout 8 B 1.90 ~ 4 1.05 1 0.80 2 0.55 3 0.8 0.85 5 6 7 0.55 0.75 1.05 1.70 A 1.9 ~ C 2.55 ~ Unit [mm] NOTE: Please make the GND pattern under the VCO and coat the painted part with solder resist. Please decide the dimensions of A, B and C as per the mounting accuracy of the chip mounter. 5.5 Marking Diagram 3 NC 2 1 GND OUT Date Code G55 1 : Last digit of the year 4 8 GND GND M 2,3: Week No. D 1 2 3 VCTR GND VCC 5 6 7 5.6 Ordering Information Part Number Package Pb-free Temperature Range GO1555-IXTE3 8-pin tape on reel Yes -40°C to +85°C 40746 - 1 November 2006 11 of 12 GO1555 Data Sheet 6. Revision History Version ECR PCN Date Changes/Modification 0 141912 – September 2006 New Document. 1 142967 – November 2006 Converting to Data Sheet. Added section 5.3 Tape and Reel Specification. Modified minimum output signal level to -10.5dBm in Electrical Characteristics. CAUTION ELECTROSTATIC SENSITIVE DEVICES DO NOT OPEN PACKAGES OR HANDLE EXCEPT AT A STATIC-FREE WORKSTATION DOCUMENT IDENTIFICATION DATA SHEET The product is in production. Gennum reserves the right to make changes to the product at any time without notice to improve reliability, function or design, in order to provide the best product possible. GENNUM CORPORATION Mailing Address: P.O. Box 489, Stn. A, Burlington, Ontario, Canada L7R 3Y3 Shipping Address: 970 Fraser Drive, Burlington, Ontario, Canada L7L 5P5 Tel. +1 (905) 632-2996 Fax. +1 (905) 632-5946 GENNUM JAPAN CORPORATION Shinjuku Green Tower Building 27F, 6-14-1, Nishi Shinjuku, Shinjuku-ku, Tokyo, 160-0023 Japan Tel. +81 (03) 3349-5501, Fax. +81 (03) 3349-5505 GENNUM UK LIMITED 25 Long Garden Walk, Farnham, Surrey, England GU9 7HX Tel. +44 (0)1252 747 000 Fax +44 (0)1252 726 523 Gennum Corporation assumes no liability for any errors or omissions in this document, or for the use of the circuits or devices described herein. The sale of the circuit or device described herein does not imply any patent license, and Gennum makes no representation that the circuit or device is free from patent infringement. GENNUM and the G logo are registered trademarks of Gennum Corporation. © Copyright September 2006 Gennum Corporation. All rights reserved. Printed in Canada. www.gennum.com 40746 - 1 November 2006 12 of 12 12