GS9062

GO1525 HD-LINX™II Voltage Controlled Oscillator GO1525 Data Sheet Key Features • • • • • • generates 1.485GHz or 1.485/1.001GHz signal for HD-LINX™II ICs low current consumption 50Ω output impedance operates from a single 2.5V supply 8 pin tape on reel Pb-free and RoHS Compliant 1.485GHz reference clock signal for the GS1560 and GS9060 deserializers, and for the GS1532 and GS9062 serializers. The control voltage range is from 1.0 volts to 1.5 volts and is derived from the on-chip PLLs. The GO1525 frequency can be pulled approximately 32MHz for every one volt of control. The output level is typically -9.0dBm with low spurious and noise content. It is designed to drive 50Ω strip lines. The VCO requires a single 2.5V supply and draws a maximum of 15mA of current. It is packaged in a miniature 8-pin proprietary surface mount package and operates over the normal commercial temperature range of 0°C to +70°C. This component and all homogeneous subcomponents are RoHS compliant. Applications • VCO for the GS1560, GS1559 and GS9060 Deserializers, and the GS1532, GS1531 and GS9062 Serializers Description The GO1525 is a self contained, miniature Voltage Controlled Oscillator (VCO). It produces a clean VCTR VCC STRIPLINE STRIPLINE OUT OSCILLATOR CIRCUIT GND GO1525 Functional Block Diagram 21969 - 8 July 2005 1 of 9 www.gennum.com GO1525 Data Sheet Contents Key Features .................................................................................................................1 Applications...................................................................................................................1 Description ....................................................................................................................1 1. Pin Out ......................................................................................................................3 1.1 Pin Assignment ...............................................................................................3 1.2 Pin Descriptions ..............................................................................................3 2. Electrical Characteristics ...........................................................................................4 3. Soldering Recommendations ....................................................................................5 3.1 Reflow Conditions ...........................................................................................6 3.2 Soldering Flux .................................................................................................6 3.3 Rework or Repair ............................................................................................6 3.4 Endurance To Warp ........................................................................................6 4. Handling Recommendations .....................................................................................7 4.1 Cleaning ..........................................................................................................7 4.2 Storage ...........................................................................................................7 4.3 Transport .........................................................................................................7 4.4 ESD Warning ..................................................................................................7 5. Package & Ordering Information ...............................................................................8 5.1 Package Dimensions ......................................................................................8 5.2 Packaging Data ...............................................................................................8 5.3 Ordering Information .......................................................................................8 6. Revision History ........................................................................................................9 21969 - 8 July 2005 2 of 9 GO1525 Data Sheet 1. Pin Out 1.1 Pin Assignment NC GND O/P 3 2 1 GND 4 GO1525 TOP VIEW 8 GND 5 6 7 VCTR GND VCC NOTE: Pin numbers are arbitrary There are no pin markings on the device itself 1.2 Pin Descriptions Table 1-1: Pin Descriptions Pin Number 2, 4, 6, 8 5 7 1 3 Name GND VCTR VCC O/P NC Type Power Input Power Output – Description Most negative power supply connections. Control voltage for the VCO. Most positive power supply connection. VCO signal output. No connection. Note: Pin numbering different from GO1515 21969 - 8 July 2005 3 of 9 GO1525 Data Sheet 2. Electrical Characteristics Table 2-1: Electrical Characteristics VCC = 2.5V ±0.25V, Temperature = 0°C to 70°C, unless otherwise shown Parameter Supply Voltage Supply Current Control Voltage Range Control Voltage Sensitivity Operating Frequency Range Output Signal Level Pushing Figure Symbol VCC ΙS VCTR df/dV ƒVCO Conditions – – – – VCTR = 1.0V VCTR = 1.5V Min 2.25 – 1.0 25 1483.5 – -12 – Typ 2.5 – – 32 – – -9 1.5 Max 2.75 15 1.5 39 – 1485.0 -6 – Units V mA V MHz/V MHz MHz dBm MHz Notes Supply Voltage Supply Current Control Voltage Range Control Voltage Sensitivity Operating Frequency Range Output Signal Level Pushing Figure VOUT – – VCC = 2.5V ± 0.25V, ref: VCC = 2.5V VSWR = 2.0 for all phase, ref: 50Ω 0°C to 70°C, ref. = 25°C – – Pulling Figure Temperature Stability Spurious Response Output Impedance – TCOEF – ZO – – – – 1.0 – – 50 – ±3 -10 – MHz MHz dBc Ω Pulling Figure Temperature Stability Spurious Response Output Impedance 21969 - 8 July 2005 4 of 9 GO1525 Data Sheet 3. Soldering Recommendations The device is manufactured with Matte-Sn terminations and is compatible with both standard eutectic and Pb-free solder reflow profiles. The recommended standard eutectic reflow profile is shown in Figure 3-1. The maximum recommended Pb-free reflow profile is shown in Figure 3-2. Temperature 60-150 sec. 10-20 sec. 230˚C 220˚C 3 ˚C/sec max 183˚C 6˚C/sec max 150˚C 100˚C 25˚C Time 120 sec. max 6 min. max Figure 3-1: Standard Eutectic Solder Reflow Profile Temperature 60-150 sec. 20-40 sec. 260˚C 250˚C 3 ˚C/sec max 217˚C 6˚C/sec max 200˚C 150˚C 25˚C Time 60-180 sec. max 8 min. max Figure 3-2: Maximum Pb-free Solder Reflow Profile 21969 - 8 July 2005 5 of 9 GO1525 Data Sheet 3.1 Reflow Conditions The device will meet the data sheet specifications after completing the reflow process according to the profile shown in Figure 3-1 or Figure 3-2. Recommended soldering conditions are as follows: Preheating Soldering 150±10°C, 60 to 120 sec. Peak 260°C Over 200°C within 30 sec. 3.2 Soldering Flux Do not use cleaning type flux. Washing the devices after using cleaning type flux may damage inner parts and affect performance. 3.3 Rework or Repair Rework or repair must only be done once. Do not reflow the device more than twice; once for initial soldering and once for remounting after rework. Do not vibrate the VCO during reflow soldering. 3.4 Endurance To Warp When the device is soldered on a printed circuit board (dimension: 100mm x 100mm; thickness: 1.6mm) and the PCB is warped as shown in Figure 3-2, the device will not be cracked or damaged. VCO PCB MAX 2mm Figure 3-3: PCB Warp 21969 - 8 July 2005 6 of 9 GO1525 Data Sheet 4. Handling Recommendations 4.1 Cleaning There are two options for cleaning the devices. Option 1: 1. Clean but do not use solvent cleaners. 2. Thoroughly dry assemblies afterwards. Option 2: 1. Mount device after board is cleaned. 4.2 Storage Store the devices out of direct sunlight, at a stable temperature and humidity. Avoid extreme temperatures, high humidity and wide temperature fluctuations. Condensation on the devices may result in reduced quality and lowered solderability. Avoid dust, sea breezes and corrosive gases (Cl2, NH3, SO2, NOX, etc.). Use within 6 months after delivery. If the devices are stored for more than one year, solderability may be degraded. 4.3 Transport Package the devices for transportation to avoid mechanical vibration or shock. 4.4 ESD Warning Avoid poor ground connections and electrostatic discharge or induction in production. 21969 - 8 July 2005 7 of 9 GO1525 Data Sheet 5. Package & Ordering Information 5.1 Package Dimensions Recommended Footprint for PCB Layout 2.20 0.7 ± 0.15 0.7 ± 0.15 1.40 NC GND OUT 1.10 GND GO1525 TOP VIEW GND 2.2 ±0.1 4.2 ±0.1 5.8 ±0.2 2.00 VCTR 0.8 ± 0.15 GND VCC 2.30 3.40 0.8±0.15 2.0±0.1 2.0 MAX 1.3±0.1 2.20 1.3±0.1 3.40 4.30 7.6±0.2 All dimensions in millimetres All dimensions in millimetres 5.2 Packaging Data Parameter Package Type Package Drawing Reference Pb-free and RoHS Compliant Value 8L Proprietary Surface Mount 21307 rev.0 Yes 5.3 Ordering Information Part Number GO1525-CTAE3 Package 8-pin tape on reel Temperature Range 0°C to 70°C Pb-Free Yes RoHS Compliant Yes 21969 - 8 July 2005 8 of 9 GO1525 Data Sheet 6. Revision History Version 0 1 ECR 120395 125583 Date January 2002 July 2002 Changes/Modification New Document Update Document from AIN to Data Sheet. Changed Supply Voltage Range in Electrical Characteristics Table. More detailed information added to the soldering and handling recommendations sections. Document reformatted. Corrected package dimensions and added new footprint. Added ‘Pb-free’ bullet. Added Pb-free solder reflow profile. Adding Pb-Free and Green Ordering Information. Converting to new document template. Adding packaging data information. Adding Solder Reflow Profile description. Updating product cleaning information. Changed ‘Green’ references to RoHS Compliant. Rephrased RoHS compliance statement. Corrected packages list in Ordering Information on page 8. Corrected description of Pb-free profile in Soldering Recommendations on page 5 2 127841 February 2003 3 4 5 133240 133445 134964 March 2004 July 2004 November 2004 6 7 8 136564 137164 137624 April 2005 June 2005 July 2005 CAUTION ELECTROSTATIC SENSITIVE DEVICES DO NOT OPEN PACKAGES OR HANDLE EXCEPT AT A STATIC-FREE WORKSTATION DOCUMENT IDENTIFICATION DATA SHEET The product is in production. Gennum reserves the right to make changes to the product at any time without notice to improve reliability, function or design, in order to provide the best product possible. GENNUM CORPORATION Mailing Address: P.O. Box 489, Stn. A, Burlington, Ontario, Canada L7R 3Y3 Shipping Address: 970 Fraser Drive, Burlington, Ontario, Canada L7L 5P5 Tel. +1 (905) 632-2996 Fax. +1 (905) 632-5946 GENNUM JAPAN CORPORATION Shinjuku Green Tower Building 27F, 6-14-1, Nishi Shinjuku, Shinjuku-ku, Tokyo, 160-0023 Japan Tel. +81 (03) 3349-5501, Fax. +81 (03) 3349-5505 GENNUM UK LIMITED 25 Long Garden Walk, Farnham, Surrey, England GU9 7HX Tel. +44 (0)1252 747 000 Fax +44 (0)1252 726 523 Gennum Corporation assumes no liability for any errors or omissions in this document, or for the use of the circuits or devices described herein. The sale of the circuit or device described herein does not imply any patent license, and Gennum makes no representation that the circuit or device is free from patent infringement. GENNUM and the G logo are registered trademarks of Gennum Corporation. © Copyright 2002 Gennum Corporation. All rights reserved. Printed in Canada. www.gennum.com 21969 - 8 July 2005 9 9 of 9