PCLAMP1211P.TGT

PClamp1211P Power MicroClampTM High-Surge TVS Diode PROTECTION PRODUCTS Description Features PClamp TVS diodes are designed for use in harsh transient environments to protect sensitive electronics from damage or latch-up due to EOS, lightning, CDE, and ESD. They feature large cross-sectional area junctions for conducting high transient currents. These devices offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. • Transient Protection to ŒŒ IEC 61000-4-2 (ESD) 30kV (Air), 30kV (Contact) ŒŒ IEC 61000-4-4 (EFT) 4kV (5/50ns) ŒŒ IEC 61000-4-5 (Lightning) 180A (8/20µs) ŒŒ ISO-10605 (ESD) 30kV (Air), 30kV (Contact) • Protects power line • Working Voltage: 13.5V • Low leakage current • Solid-state silicon-avalanche technology They feature extremely good protection characteristics highlighted by high surge current capability (180A, tp = 8/20μs), low peak ESD clamping voltage, and high ESD withstand voltage (+/- 30kV per IEC 61000-4-2). Each device will protect power line operating up to 13.5V. Mechanical Characteristics PClamp1211P is in a 6-pin SLP2018P6 package measuring 2.0 x 1.8 mm with a nominal height of 0.57mm. The leads are finished with lead-free NiPdAu. High surge current capability and low clamping voltage making them ideal for protecting VBus, battery, and other power lines in portable electronics, industrial, and automotive applications. Schematic • • • • • • SLP2018P6 package Pb-Free, Halogen Free, RoHS/WEEE compliant Nominal Dimensions: 2.0 x 1.8 x 0.57 mm Lead Finish: NiPdAu Marking: Marking code Packaging: Tape and Reel Applications • • • • • Cellular Handsets & Accessories Industrial Equipment Voltage Supply Lines Battery protection USB VBus Pin Configuration 1 VBus NC NC NC 5, 6, Tabs GND GND GND GND SLP2018P6 (Top View) PClamp1211P Final Datasheet Revision Date Rev 3.0 5/11/2016 www.semtech.com 1 of 8 Semtech Absolute Maximum Ratings Rating Symbol Value Units Peak Pulse Power (tp = 8/20µs) PPK 5000 W Peak Pulse Current (tp = 8/20µs) IPP 180 A Peak Pulse Current (tp = 10/1000µs) IPP 15 A ESD per IEC 61000-4-2 (Contact) ESD per IEC 61000-4-2 (Air)(1) VESD ±30 ±30 kV Operating Temperature TJ -40 to +125 O Storage Temperature TSTG -55 to +150 O (1) C C Electrical Characteristics (T=25OC unless otherwise specified) PClamp1211P Parameter Symbol Conditions Reverse Stand-Off Voltage VRWM Pin 1 to Pin 5, 6(5) VBR It = 1mA, Pin 1 to Pin 5, 6(5) Reverse Leakage Current IR VRWM = 13.5V Pin 1 to Pin 5, 6(5) Clamping Voltage(2) VC Clamping Voltage(2) VC Reverse Breakdown Voltage Dynamic Resistance(3), (4) Junction Capacitance RDYN CJ Min. Typ. Max. Units 13.5 V 15 17.5 V 0.300 0.350 μA IPP = 100A, tp = 8/20µs, Pin 1 to Pin 5, 6(5) 18 25 V IPP = 180A, tp = 8/20µs, Pin 1 to Pin 5, 6(5) 23.5 28 V tp = 0.2/100ns (TLP) Pin 1 to Pin 5, 6(5) 0.01 VR = 0V, f = 1MHz Pin 1 to Pin 5, 6(5) 1500 14.5 Ohms 2500 pF Notes: (1): ESD Gun return path to Ground Reference Plane (GRP) (2):Tested using a constant current source (3): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns. (4): Dynamic resistance calculated from ITLP = 4A to ITLP = 16A (5) Pins 5 and 6 are electrically connected to the center tabs PClamp1211P Final Datasheet Revision Date Rev 3.0 5/11/2016 www.semtech.com 2 of 8 Semtech Typical Characteristics Power Derating Curve Non-Repetitive Peak Pulse Power vs. Pulse Time 120 TA = 25OC 100 10 % of Rated Power or IPP Peak Pulse Power ‐ PPP (kW) 100 1 80 60 40 20 DR040512:25:125:150 DR040412-4kW 0.1 0.1 1 10 Pulse Duration ‐ tp (µs) 100 0 1000 0 Clamping Voltage vs. Peak Pulse Current (tp=8/20μs) 125 150 10 TA = 25OC 26 8 24 22 6 Forward Voltage (V) Clamping Voltage - VC (V) 50 75 100 Ambient Temperature - TA (OC) Forward Voltage vs. Peak Pulse Current (tp=8/20μs) 28 20 18 16 14 4 2 Waveform Parameters: tr = 8µs td = 20µs 12 10 25 0 20 40 60 80 100 120 140 160 180 0 200 PC1211P_AR_8_20 Surge 0 25 50 Peak Pulse Current - IPP (A) Breakdown Voltage (VBR) vs. Temperature 75 100 125 150 Peak Pulse Current - IPP (A) 175 200 225 TLP Characteristic 30 17.0 TA = 25OC tP = 100ns, tR = 0.2ns tMEAS = 70‐90ns 25 20 TLP Current (A) Breakdown Voltage - VBR (V) 16.0 15.0 15 10 14.0 5 13.0 PC1211P_TLP_POS PC1211P_AR_VBRvT -25 PClamp1211P Final Datasheet Revision Date 0 Rev 3.0 5/11/2016 25 50 Temperature (OC) 75 100 0 0 2 4 6 8 10 12 14 16 Clamping Voltage (V) www.semtech.com 3 of 8 Semtech Typical Characteristics ESD Clamping (-8kV Contact per IEC 61000-4-2) ESD Clamping (8kV Contact per IEC 61000-4-2) 40 0 TA = 25OC. Waveform IEC61000‐4‐2 +8kV. Measured with and corrected for 50Ω, 20dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Ground Reference Plane. 30 -5 Clamping Voltage - VC (V) Clamping Voltage - VC (V) 35 25 20 15 10 -10 -15 TA = 25OC. Waveform IEC61000‐4‐2 ‐8kV. Measured with and corrected for 50Ω, 20dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to ESD Ground Plane. -20 5 0 PC1211P_AR_P8_ESD -10 10 30 Time (ns) 50 70 -25 90 ESD Clamping (30kV Contact per IEC 61000-4-2) 10 30 Time (ns) 50 70 90 0 TA = 25OC. Waveform IEC61000‐4‐2 +30kV. Measured with and corrected for 50Ω, 20dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to Ground Reference Plane. 90 80 -10 -20 70 Clamping Voltage - VC (V) Clamping Voltage - VC (V) -10 ESD Clamping (-30kV Contact per IEC 61000-4-2) 100 60 50 40 30 20 -30 -40 -50 -60 TA = 25OC. Waveform IEC61000‐4‐2 ‐30kV. Measured with and corrected for 50Ω, 20dB Attenuator. 50Ω Scope Input Impedance, ≥2GHz BW. ESD Gun Return connected to ESD Ground Plane. -70 -80 10 0 PC1211P_AR_IEC_N8_ESD PC1211P_AR_P8_ESD -10 PClamp1211P Final Datasheet Revision Date 10 Rev 3.0 5/11/2016 30 Time (ns) 50 70 90 -90 PC1211P_AR_IEC_N8_ESD -10 www.semtech.com 10 30 Time (ns) 50 70 90 4 of 8 Semtech Application Information Assembly Guidelines The figure at the right details Semtech’s recommended mounting pattern. Recommended assembly guidelines are shown in Table 1. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Semtech’s recommended mounting pattern is based on the following design guidelines: Recommended Mounting Pattern Stencil Opening Land Pad ( Follow drawing ) .45 2.00 .84 Land Pattern The recommended land pattern follows IPC standards and is designed for maximum solder coverage. Detailed dimensions are shown elsewhere in this document. .70 .25 Solder Stencil Stencil design is one of the key factors which will determine the volume of solder paste deposited onto the land pad. The area ratio of the stencil aperture will determine how well the stencil will print. The area ratio takes into account the aperture shape, aperture size, and stencil thickness. An area ratio of 0.70 – 0.75 is preferred for the subject package. The area ratio of a rectangular aperture is given as: Area Ratio = (L * W )/ (2 * (L + W) * T) Where: L = Aperture Length W = Aperture Width T = Stencil Thickness 1.80 All Dimensions are in mm. Land Pad. Stencil opening Component Table 1 - Recommended Assembly Guidelines Assembly Parameter Recommendation Solder Stencil Design Laser Cut, Electro-Polished Aperture Shape Rectangular Solder Stencil Thickness 0.125mm (0.005”) Solder Paste Type Type 3 size sphere or smaller Solder Reflow Profile Per JEDEC J-STD-020 PCB Solder pad Design Non-Solder Mask Defined PCB Pad Finish OSP or NiAu Semtech recommends a stencil thickness of 0.125mm for this device. The stencil should be laser cut with electropolished finish. The stencil should have a positive taper of approximately 5 degrees. Electro polishing and tapering the walls results in reduced surface friction and better paste release. Solder paste with Type 3 or smaller particles are recommended. Assuming a 125μm thick stencil, the aperture dimensions shown will yield an area ratio of approximately 0.75. PClamp1211P Final Datasheet Revision Date Rev 3.0 5/11/2016 www.semtech.com 5 of 8 Semtech Outline Drawing - SLP2018P6 D A B A A1 A2 b D E D1 E1 e e1 L N aaa bbb E PIN 1 INDICATOR (LASER MARK) A aaa C A1 A2 DIMENSIONS MILLIMETERS MIN NOM MAX DIM SEATING PLANE 0.50 0.575 0.65 0.00 0.03 0.05 (0.127) 0.15 0.20 0.25 1.70 1.80 1.90 1.90 2.00 2.10 0.30 0.45 0.55 0.69 0.84 0.94 0.40 BSC 0.80 BSC 0.25 0.30 0.35 6 0.08 0.10 C D/2 e D1 e/2 R0.20 E1 LxN E1/2 bxN e1/2 e1 E/2 bbb C A B 0.70 1.40 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP2018P6 DIMENSIONS 1.40 0.70 H DIM C G H K P P1 X Y Z P1 P1/2 (C) K K/2 G MILLIMETERS (1.95) 1.35 0.45 0.84 0.40 0.80 0.20 0.60 2.55 Z Y X P/2 P NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. PClamp1211P Final Datasheet Revision Date Rev 3.0 5/11/2016 www.semtech.com 6 of 8 Semtech Marking Example P12 YW PIN 1 INDICATOR (LASER MARK) Tape and Reel Specification P12 YW P12 YW P12 YW Pin 1 Located Towards Sprocket Holes Ordering Information Part Number Working Voltage Qty per Reel Reel Size PClamp1211P. TGT 12V 10,000 13” PClamp and MicroClamp are trademarks of Semtech Corporation PClamp1211P Final Datasheet Revision Date Rev 3.0 5/11/2016 www.semtech.com 7 of 8 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. 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Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com PClamp1211P Final Datasheet Revision Date Rev 3.0 5/11/2016 8 of 8 Semtech