RCLAMP3346P.TNT

RClamp3346P Low Capacitance RClamp® 6-Line ESD Protection PROTECTION PRODUCTS Description Features The RClamp®3346P provides ESD protection for highspeed data interfaces. It features a high maximum ESD withstand voltage of ±17kV contact and ±20kV air discharge per IEC 61000-4-2. RClamp3346P is designed to minimize both the ESD peak clamping and the TLP clamping. Package inductance is reduced at each pin resulting in lower peak ESD clamping voltage. The dynamic resistance is among the industry’s lowest at 0.15 Ohms (typical). Maximum capacitance on each line to ground is 0.65pF allowing the RClamp3346P to be used in applications operating in excess of 5GHz without signal attenuation. Each device will protect up to six lines (three high-speed pairs). • ESD protection for high-speed data lines to The RClamp3346P is in a 7-pin SGP2708N7 package measuring 2.7 x 0.8mm with a nominal height of 0.50mm. The leads have a nominal pin-to-pin pitch of 0.40mm. Flow- through package design simplifies PCB layout and maintains signal integrity on high-speed lines. ŒŒ IEC 61000-4-2 (ESD) +/-17kV (Contact), +/- 20 kV (Air) ŒŒ IEC 61000-4-5 (Lightning) 5A (8/20 μs) ŒŒ IEC 61000-4-4 (EFT) 40A (5/50ns) • • • • • • • Package design optimized for high speed lines Flow-Through design Protects six high-speed lines Low capacitance: 0.65pF Maximum (I/O to Ground) Low ESD clamping voltage Low dynamic resistance: 0.15 Ohms (Typical) Solid-state silicon-avalanche technology Mechanical Characteristics • • • • • • SGP2708N7 7-pin package (2.7 x 0.8 x 0.50mm) Pb-Free, Halogen Free, RoHS/WEEE compliant Lead Pitch: 0.4mm (intra-pair) Lead Finish: NiPdAu Marking: Marking code Packaging: Tape and Reel Applications The combination of low peak ESD clamping, low dynamic resistance, and innovative package design enables this device to provide the highest level of ESD protection for applications such as USB 3.0, eSATA, and DisplayPort. • • • • Package Dimension Schematic & Pin Configuration USB 3.0 eSATA Display Port LVDS 0.80 BSC 0.40 BSC 0.80 1 3 4 5 6 7 2.70 2 0.50 6-Line protection RClamp3346P Final Datasheet Revision date Rev 5.0 10/5/2016 www.semtech.com 1 of 9 Semtech Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Current (tp = 8/20µs) IPP 4.5 A ESD per IEC 61000-4-2 (Air)(1) ESD per IEC 61000-4-2 (Contact)(1) VESD ±20 ±17 kV Operating Temperature TJ -40 to +125 O Storage Temperature TSTG -55 to +150 O C C Electrical Characteristics (T=25OC unless otherwise specified) Parameter Symbol Conditions Min. Typ. Reverse Stand-Off Voltage VRWM Any I/O to GND Reverse Breakdown Voltage VBR IBR = 10μA Reverse Leakage Current IR VRWM = 3.3V Any I/O to GND T = 25OC Clamping Voltage VC tp = 8/20μs Any I/O to GND IPP = 1A 2.5 3.5 IPP = 4.5A 3.5 4.5 ESD Clamping Voltage2 VC tp = 0.2/100ns IPP = 16A 5.5 IPP = -16A -3 Dynamic Resistance (positive)2,3 RDYN tp = 0.2/100ns 0.15 Dynamic Resistance (negative)2,3 RDYN tp = 0.2/100ns 0.14 Junction Capacitance CJ VR = 0V, f = 1MHz, Any I/O to GND 0.60 0.65 VR = 0V, f = 1MHz, Between I/O pins 0.30 0.40 7 Max. Units 3.3 V 8 9 V 0.01 0.05 T = 125 C 0.150 O μA V V Ω pF Notes 1) Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. 2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A RClamp3346P Final Datasheet Revision Date Rev 5.0 10/5/2016 www.semtech.com 2 of 9 Semtech Typical Characteristics Clamping Voltage vs. Peak Pulse Current (Between any I/O and Ground) Junction Capacitance vs. Reverse Voltage (Between any I/O and Ground) 1 4.0 0.9 3.0 Capacitance - CJ (pF) Clamping Voltage - VC (V) 3.5 2.5 2.0 1.5 1.0 Waveform Parameters: tr = 8µs td = 20µs 0.5 0.0 0 1 2 3 Peak Pulse Current - IPP (A) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 4 0 5 ESD Clamping (+8kV Contact per IEC 61000-4-2) (Between any I/O and Ground) 90 70 1.0 40 30 3.5 -20 -30 -40 -50 20 -60 10 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground -70 0 -80 -10 0 10 20 30 40 50 60 70 80 -10 0 10 TLP Characteristic (Positive) 0 Transmission Line Pulse Test (TLP) Settings: tp=100ns, tr=0.2ns, ITLP and VTLP averaging window: t1=70ns to t2=90ns 40 50 60 70 80 Transmission Line Pulse Test (TLP) Settings: tp=100ns, tr=0.2ns, ITLP and VTLP averaging window: t1=70ns to t2=90ns -5 TLP Current (A) 20 30 TLP Characteristic (Negative) 30 25 20 Time (ns) Time (ns) TLP Current (A) 3.0 -10 50 15 10 5 -10 -15 -20 -25 0 -5 1.5 2.0 2.5 Reverse Voltage - VR (V) 0 Voltage (V) Voltage (V) 0.5 10 60 -10 0.0 ESD Clamping (-8kV Contact per IEC 61000-4-2) (Between any I/O and Ground) Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane. 80 f = 1 MHz T=25oC -30 0 RClamp3346P Final Datasheet Revision Date 2 4 6 Clamping Voltage (V) Rev 5.0 10/5/2016 8 10 -10 www.semtech.com -8 -6 -4 Clamping Voltage (V) -2 0 3 of 9 Semtech Typical Characteristics (Continued) Insertion Loss - S21 Analog Crosstalk 0 -1 -10 -2 -20 -3 -30 Cross Talk (dB) Insertion Loss - (IL) dB 0 -4 -5 -6 -7 -40 Pin 4 to Pin 5 -50 -60 Pin 5 to Pin 7 -70 -8 -80 -9 -10 Pin 1 to Pin 7 -90 0 1 Frequency (GHz) RClamp3346P Final Datasheet Revision Date Rev 5.0 10/5/2016 10 -100 1.00E+07 www.semtech.com 1.00E+08 Frequency (Hz) 1.00E+09 4 of 9 Semtech Application Information Protecting USB 3.0 Ports RClamp3346P is designed to protect all six USB 3.0 SuperSpeed and high speed differential lines. PCB traces enter and exit each I/O pin and ground is connected at pin 2. For best results, it is recommended that the ground connection be made using a filled via-in-pad. The via should be filled with a conductive paste. This technique saves board space and reduces parasitic inductance in the ground path. Figures 2 and 3 are examples of how to route high speed differential traces through the RClamp3346P. Differential impedance of each pair can easily be controlled for USB 3.0 (85 Ohms +/-15%). Figure 1 - USB 3.0 Eye Diagram with RClamp3346P The RClamp3346P should be placed as close to the connector as possible for optimum ESD performance. Internal construction of the RClamp3346P has been optimized to minimize series inductance within the package. This helps to reduce the ESD peak clamping voltage. Dynamic resistance is extremely low (typically 0.15 Ohms) further reducing the ESD clamping voltage. USB 3.0 - Type B Device Connector USB 3.0 - Type A Device Connector SSRX- SSTXGND SSTX+ D+ D- GND SSRX+ GND SSRX- VBus RClamp3346P SSTX- D- RClamp3346P SSRX+ µClamp0541T µClamp0541T Figure 2 - Example USB 3.0 Layout (Type B Device Connector) RClamp3346P Final Datasheet Revision Date D+ GND Rev 5.0 10/5/2016 SSTX+ VBus Figure 3 - Example USB 3.0 Layout (Type A Device Connector) www.semtech.com 5 of 9 Semtech Application Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. Semtech’s recommended assembly guidelines for mounting this device are shown in the Table 1. Figure 4 details Semtech’s recommended aperture. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. 0.200 Assembly Parameter Recommendation Solder Stencil Design Laser cut, Electro-Polished Aperture shape Rectangular with rounded corners Solder Stencil Thickness 0.100 mm (0.004”) Solder Paste Type Type 4 size sphere or smaller Solder Reflow Profile Per JEDEC J-STD-020 PCB Solder Pad Design Non-Solder mask defined PCB Pad Finish OSP OR NiAu 0.400 0.025 0.700 0.800 0.350 0.025 0.200 2.700 All Dimensions are in mm. Land Pad. RClamp3346P Final Datasheet Revision Date Rev 5.0 10/5/2016 Stencil opening Component www.semtech.com 6 of 9 Semtech Outline Drawing - SGP2708N7 D A B PIN 1 INDICATOR (LASER MARK) DIM A A1 b D E e L N aaa bbb E DIMENSIONS MILLIMETERS MIN NOM MAX 0.47 0.50 0.53 0.00 0.03 0.05 0.15 0.20 0.25 2.65 2.70 2.775 0.75 0.80 0.875 0.80 BSC 0.30 0.35 0.40 7 0.08 0.10 SEATING PLANE C e e/2 LxN E/2 (0.025-0.075) D/2 bxN bbb C A B NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SGP2708N7 DIMENSIONS Z 0.625 Y P/2 DIM P X Y Z MILLIMETERS 0.80 0.20 0.65 1.25 X P NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. RClamp3346P Final Datasheet Revision Date Rev 5.0 10/5/2016 www.semtech.com 7 of 9 Semtech Marking Code 3346P PIN1 INDICATOR YYWW YYWW = Date Code Tape and Reel Specification YYWW 3346P YYWW 3346P YYWW 3346P YYWW 3346P YYWW 3346P YYWW 3346P Pin 1 Location (Towards Sprocket Holes) User Direction of feed Ordering Information Part Number Qty per Reel Reel Size RClamp3346P.TNT 10,000 7” RClamp3346P Final Datasheet Revision Date Rev 5.0 10/5/2016 www.semtech.com 8 of 9 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale. SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. © Semtech 2015 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com RClamp3346P Final Datasheet Revision date 5.0 10/5/2016 9 of 9 Semtech