RClamp3552T
Low Voltage RailClamp®
2-Line ESD Protection
PROTECTION PRODUCTS
Description
Features
RClamp®3552T is a low voltage RailClamp which can
provide ESD protection to IEC 61000-4-2 on highspeed
ports. It is manufactured using Semtech’s proprietary
low voltage technology, designed to minimize both the
ESD peak clamping and TLP clampingvoltage. These
devices “snap-back” to a low on-state voltage when the
breakdown voltage of the device is exceeded. This has
the advantage of lowering the overall ESD clamping
voltage. When the device is in the on-state, the dynamic
resistance is typically 0.30 Ohms, further minimizing
the ESD clamping. Maximum capacitance is only 0.40pF
allowing the RClamp3552T to be used in applications
operating in excess of 6GHz without appreciable signal
attenuation. Each device will protect two lines operating
at 3.5 volts.
• High ESD withstand Voltage: +/-17kV (Contact) &
+/-20kV(Air) per IEC 61000-4-2
• Very small PCB area: 0.6 mm2
• Protects up to two data lines
• Low ESD clamping voltage
• Working voltage: 3.5 V
• Low capacitance: 0.40pF Maximum
• Low dynamic resistance: 0.30 Ohms Typical
• Solid-state silicon-avalanche technology
RClamp3552T is in a 3-pin SLP1006N3T package. It
measures 1.0 x 0.6 mm with a nominal height of only
0.4mm. The leads are finished with lead-free NiPdAu.
Mechanical Characteristics
•
•
•
•
•
•
•
SLP1006N3T package
Pb-Free, Halogen Free, RoHS/WEEE compliant
Nominal Dimensions: 1.0 x 0.6 x 0.40 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking: Marking code + dot matrix date code
Packaging: Tape and Reel
Applications
The combination of low peak ESD clamping, low
dynamic resistance, and low capacitance makes this
device suitable for applications such as USB 3.0, LVDS,
audio, and V-By-One interfaces.
•
•
•
•
•
•
USB 3.0
V-By-One
LVDS
MIPI/MDDI
MyDP
Audio Ports
Package Dimension
Schematic & Pin Configuration
1.00
1
1
2
2
0.60
3
0.40
3
SLP1006N3T (Bottom View)
RClamp3552T
Final Datasheet
Revision date
Rev 4.1
5/8/2019
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Absolute Maximum Rating
Rating
Symbol
Value
Units
Peak Pulse Current (tp = 8/20µs)
IPP
4
A
ESD per IEC 61000-4-2 (Air)(1)
ESD per IEC 61000-4-2 (Contact)(1)
VESD
±20
±17
kV
Operating Temperature
TJ
-40 to +125
O
Storage Temperature
TSTG
-55 to +150
O
C
C
Electrical Characteristics (T=25OC unless otherwise specified)
Parameter
Symbol Conditions
Reverse Stand-Off Voltage
VRWM
Pin 1 or 2 to Pin3
Reverse Breakdown Voltage
VBR
IBR = 10μA, Pin 1 or 2 to Pin3
Reverse Leakage Current
IR
VRWM = 3.5V, Pin 1 or 2 to Pin3
Clamping Voltage
VC
tp = 8/20μs, Pin 1 or 2 to Pin3
ESD Clamping Voltage2
VC
tp = 0.2/100ns,
Pin 1 or 2 to Pin3
Dynamic Resistance2,3 (Positive)
RDYN
tp = 0.2/100ns, Pin 1 or 2 to Pin3
0.30
Dynamic Resistance2,3 (Negative) RDYN
tp = 0.2/100ns, Pin 1 or 2 to Pin3
0.30
Junction Capacitance
VR = 0V, f = 1MHz, Pin 1 or 2 to Pin3
0.30
CJ
Min. Typ. Max. Units
3.5
V
8.8
9.8
V
0.01
0.05
μA
IPP = 1A
3.5
5
IPP = 4A
5
6.5
IPP = 16A
9.5
IPP = -16A
-9.5
7.5
V
V
Ω
0.40
pF
Notes
1) ESD gun return path connected to ESD ground plane.
2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
RClamp3552T
Final Datasheet
Revision Date
Rev 4.1
5/8/2019
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Typical Characteristics
Junction Capacitance vs. Reverse Voltage
(Between any I/O and Ground)
7.0
0.6
6.0
0.5
Capacitance - CJ (pF)
Clamping Voltage - VC (V)
Clamping Voltage vs. Peak Pulse Current (tp=8/20μs)
(Between any I/O and Ground)
5.0
4.0
3.0
2.0
Waveform
Parameters:
tr = 8µs
td = 20µs
1.0
0.0
0.0
1.0
2.0
3.0
Peak Pulse Current - IPP (A)
4.0
0.3
0.2
f = 1 MHz
T=25oC
0.1
0
5.0
0.0
1.0
4.0
80
10
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
0
Clamping Voltage - VC (V)
50
40
30
20
10
-10
-10
-20
-30
-40
-50
-60
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground plane.
-70
0
-10
0
10
20
30
40
50
60
70
80
-80
90
-10
0
10
Time (ns)
30
5
Transmission Line Pulse Test (TLP)
Settings:
tp=100ns, tr=0.2ns,
ITLP and VTLP averaging window:
t1=70ns to t2=90ns
25
30
40
50
Time (ns)
60
70
80
90
Transmission Line Pulse Test (TLP)
Settings:
tp=100ns, tr=0.2ns,
ITLP and VTLP averaging window:
t1=70ns to t2=90ns
0
-5
TLP Current (A)
20
20
TLP Characteristic (Negative)
TLP Characteristic (Positive)
TLP Current (A)
3.0
ESD Clamping (-8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
60
15
10
5
-10
-15
-20
-25
0
-5
2.0
Reverse Voltage - VR (V)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
70
Clamping Voltage - VC (V)
0.4
-30
0
RClamp3552T
Final Datasheet
Revision Date
5
Rev 4.1
5/8/2019
10
TLP Voltage (V)
15
20
-20
www.semtech.com
-15
-10
TLP Voltage (V)
-5
0
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Typical Characteristics (Continued)
Typical Insertion Loss - S21
Analog Crosstalk
0
0
-10
-20
-30
-4
Cross Talk (dB)
Insertion Loss (dB)
-2
-6
-8
RClamp3552T
Final Datasheet
Revision Date
-50
-60
-70
-80
-10
-12
0.01
-40
-90
0.1
Rev 4.1
5/8/2019
1
Frequency (GHz)
10
-100
1.00E+07
www.semtech.com
1.00E+08
Frequency (Hz)
1.00E+09
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Applications Information
Device Operation
This device utilizes a multi-junction structure that is
designed to switch to a low voltage state when triggered
by ESD, EOS, or other transient events. During normal
operation, the device will present a high impedance to
the circuit for voltage up to the working voltage (VRWM) of
the device. When the voltage across the device terminals
exceeds the breakdown voltage(VBR), avalanche
breakdown occurs in the blocking junction causing the
device to “snap-back” or switch to a low impedance
on-state. This has the advantage of lowering the overall
clamping voltage (VC) as ESD peak pulse current (IPP)
flows through the device. Once the current subsides, the
device will return to a highimpedance off-state. Since
this device is bidirectional, it will behave the same way
for positive or negative polarity transient events.
IPP
Symbol
Parameter
VRWM
Maximum Working Voltage
VBR
Breakdown Voltage
VC
Clamping Voltage
IR
Reverse Leakage Current
IPP
Peak Pulse Currrent
“Snap-Back”
IR
VC
VRWM
VBR
Characterisitic Curve
RClamp3552T
Final Datasheet
Revision Date
Rev 4.1
5/8/2019
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Applications Information
Assembly Guidelines
Recommended Mounting Pattern
The small size of this device means that some care must
be taken during the mounting process to insure reliable
solder joints. The figure at the right details Semtech’s
recommended mounting pattern. Recommended
assembly guidelines are shown in Table 2. Note that
these are only recommendations and should serve only
as a starting point for design since there are many factors
that affect the assembly process. Exact manufacturing
parameters will require some experimentation to get the
desired solder application. Semtech’s recommended
mounting pattern is based on the following design
guidelines:
Land Pattern
The recommended land pattern follows IPC standards
and is designed for maximum solder coverage. Detailed
dimensions are shown elsewhere in this document.
Solder Stencil
Stencil design is one of the key factors which will
determine the volume of solder paste which is deposited
onto the land pad. The area ratio of the stencil aperture
will determine how well the stencil will print. The area
ratio takes into account the aperture shape, aperture
size, and stencil thickness. An area ratio of 0.70 – 0.75
is preferred for the subject package. The area ratio of a
rectangular aperture is given as:
Stencil Opening (220x460 mm)
Land Pad (200x400 mm)
.850
1.000
All Dimensions are in mm.
Land Pad.
Stencil opening
Component
Table 2 - Recommended Assembly Guidelines
Assembly Parameter
Recommendation
Solder Stencil Design
Laser Cut, Electro-Polished
Aperture Shape
Rectangular
Solder Stencil Thickness
0.100mm (0.004”)
Solder Paste Type
Type 4 size sphere or
smaller
Solder Reflow Profile
Per JEDEC J-STD-020
PCB Solder pad Design
Non-Solder Mask Defined
PCB Pad Finish
OSP or NiAu
Area Ratio = (L * W )/ (2 * (L + W) * T)
Where:
L = Aperture Length
W = Aperture Width
T = Stencil Thickness
Semtech recommends a stencil thickness of 0.100mm for
this device. The stencil should be laser cut with electropolished finish. The stencil should have a positive taper
of approximately 5 degrees. Electro polishing and
tapering the walls results in reduced surface friction
and better paste release. Due to the small aperture
size, a solder paste with Type 4 or smaller particles are
recommended. Assuming a 100um thick stencil, the
aperture dimensions shown will yield an area ratio of
approximately 0.75.
RClamp3552T
Final Datasheet
Revision Date
Rev 4.1
5/8/2019
www.semtech.com
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Outline Drawing - SLP1006N3T
A
D
DIMENSIONS
MILLIMETERS
MIN NOM MAX
B
PIN 1
INDICATOR
(LASER MARK)
DIM
E
A
SEATING
PLANE
aaa C
C
A1
A2
e
2
LxN
E/2
bbb
N
b1xN
C A B
bxN
D/2
NOTES:
1.
0.37 0.40 0.43
0.00 0.02 0.05
(0.13)
0.145 0.17 0.195
0.175 0.20 0.225
0.90 1.00 1.10
0.50 0.60 0.70
0.68 BSC
0.225 0.25 0.275
3
0.08
0.10
R0.05
e/2
1
A
A1
A2
b
b1
D
E
e
L
N
aaa
bbb
bbb
C A B
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
Land Pattern - SLP1006N3T
X
R0.05
(C)
Y
G
P/2
Z
DIMENSIONS
DIM MILLIMETERS
(0.45)
C
0.05
G
0.68
P
0.20
X
0.40
Y
0.85
Z
P
NOTES:
RClamp3552T
Final Datasheet
Revision Date
Rev 4.1
5/8/2019
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
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Marking Code
35
Tape and Reel Specification
35
35
35
35
35
Pin 1 Location
(Towards Sprocket Holes)
Ordering Information
Part Number
Qty per Reel
Reel Size
RClamp3552T.TNT
10,000
7”
RClamp3552T
Final Datasheet
Revision Date
Rev 4.1
5/8/2019
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Important Notice
Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided
as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves
the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before
placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications
applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS,
DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY,
LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD
TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized
application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against
all claims, costs damages and attorney fees which could arise.
The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be
marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described
in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of
its products for any particular purpose. All rights reserved.
© Semtech 2019
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
RClamp3552T
Final Datasheet
Revision date
4.1
5/8/2019
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