SC1453
NOT RECOMMENDED FOR NEW DESIGN
150mA Ultra Low Dropout
Regulator with Low Noise Bypass
POWER MANAGEMENT
Description
Features
The SC1453 is a low dropout linear regulator that
operates from a +2.25V to +6.5V input range and
delivers up to 150mA. A PMOS pass transistor allows
the low 75µA supply current to remain independent of
load, making these devices ideal for battery operated
portable equipment such as cellular phones, cordless
phones and personal digital assistants.
“2982/5205” compatible pinout
Guaranteed 150 mA output current
2% output accuracy guaranteed over line, load and
temperature
Very small external components - designed to work
with ceramic capacitors
Low 26µVRMS output noise
(1.5V option, CIN = COUT = 1µF, CBYP = 10nF)
Very low supply current
Thermal overload protection
Reverse battery protection
Low power shutdown
Full industrial temperature range
Very low profile packaging available (1mm max. height)
Surface mount packaging (5 pin SOT-23 and
TSOT-23)
Available in Lead-free packages, fully WEEE and RoHS
compliant
The SC1453 has a bandgap reference bypass pin for
very low noise operation - a 10nF (typ.) capacitor may be
connected between this pin and ground. Other features
include low powered shutdown, short circuit protection,
thermal shutdown protection and reverse battery
protection. The SC1453 comes in the tiny 5 lead SOT-23
package and the ultra-low profile 5 lead TSOT-23.
N
O
FO T R
R EC
N O
EW M
M
D EN
ES D
IG ED
N
Applications
Battery Powered Systems
Cellular Telephones
Cordless Telephones
Personal Digital Assistants
Portable Instrumentation
Modems
PCMCIA cards
Typical Application Circuit
1
VIN
C1
1uF
3
U1
SC1453
IN
OUT
EN
GND BYP
2
Revision: April 21, 2008
5
VOUT
4
C3
1uF
C2
10nF
1
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SC1453
NOT RECOMMENDED FOR NEW DESIGN
POWER MANAGEMENT
Absolute Maximum Ratings
Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified
in the Electrical Characteristics section is not implied.
Symbol
Maximum
Units
Input Supply Voltage
VIN
-0.6 to +7
V
Thermal Resistance Junction to Ambient
θJA
256
°C/W
Thermal Resistance Junction to Case
θJC
81
°C/W
Operating Ambient Temperature Range
TA
-40 to +85
°C
Operating Junction Temperature Range
TJ
-40 to +125
°C
Storage Temperature Range
TSTG
-65 to 150
°C
Lead Temperature (Soldering) 10 Sec.
TLEAD
300
°C
ESD Rating
ESD
2
kV
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N
Parameter
Electrical Characteristics
Unless specified: VIN = VOUT + 1V, VEN = VIN, IOUT = 100µA, CIN = COUT = 1µF, TA = 25°C. Values in bold apply over full operating ambient temperature range.
Parameter
IN
Symbol
Supply Voltage Range
VIN
Supply Current
IQ
Conditions
Min
2.25
IOUT = 0mA to150mA
VIN = 6.5V, VEN = 0V
OUT
Output Voltage (1)
Line Regulation (1)(2)
VOUT
REG(LINE)
Typ
IOUT = 1mA
-1.5%
0mA ≤ IOUT ≤ 150mA, VOUT +1V ≤ VIN ≤ 5.5V
-2.0%
(VOUT(NOM) + 0.1V) ≤ VIN ≤ 5.5V, IOUT = 1mA
75
Max
Units
6.50
V
130
µA
160
0.1
1.0
µA
1.5
VOUT
+1.5%
V
+2.0%
2.5
10
mV
12
Load Regulation (1)
REG(LOAD)
IOUT = 0.1mA to 150mA
-3
-10
mV
-20
2008 Semtech Corp.
2
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SC1453
NOT RECOMMENDED FOR NEW DESIGN
POWER MANAGEMENT
Electrical Characteristics (Cont.)
Unless specified: VIN = VOUT + 1V, VEN = VIN, IOUT = 100µA, CIN = COUT = 1µF, TA = 25°C. Values in bold apply over full operating ambient temperature range.
Parameter
Symbol
Conditions
Min
Typ
Max
Units
OUT (Cont.)
Current Limit
ILIM
Dropout Voltage(1)(3)
VD
400
mA
IOUT = 1mA
1
IOUT = 50mA
50
mV
65
mV
75
IOUT = 100mA
N
O
FO T R
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N O
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ES D
IG ED
N
100
Output Voltage Noise,
COUT = 100µF
Power Supply Rejection Ratio
BYP
Start-up Rise Time
EN
Enable Input Threshold
Enable Input Bias Current (4)
en
mV
155
IOUT = 150mA
Output Voltage Noise,
COUT = 1µF
125
150
190
mV
230
10Hz to 100kHz, IOUT = 1mA
CBYP = 10nF, VOUT = 1.5V
26
10Hz to 100kHz, IOUT = 1mA
CBYP = 10nF, VOUT = 3.3V
54
10Hz to 100kHz, IOUT = 1mA
CBYP = 10nF, VOUT = 1.5V
13
10Hz to 100kHz, IOUT = 1mA
CBYP = 10nF, VOUT = 3.3V
29
PSRR
f = 120Hz, CBYP = 10nF
61
dB
tr
CBYP = 10nF
1.3
ms
VIH
2.25V ≤ VIN ≤ 6.5V
VIL
2.25V ≤ VIN ≤ 6.5V
IEN
0V ≤ VEN ≤ VIN
en
µVRMS
µVRMS
1.6
V
0.4
-0.5
0
+0.5
µA
Over Temperature Protection
High Trip Level
Hysteresis
THI
150
°C
THYST
20
°C
Notes:
(1) Low duty cycle pulse testing with Kelvin connections required.
(2) VIN(MIN) = 2.25V.
(3) Defined as the input to output differential at which the output voltage drops 100mV below the value measured
at a differential of 1V. Not measurable on 1.5V and 1.8V parts due to minimum VIN constraints.
(4) Guaranteed by design.
2008 Semtech Corp.
3
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NOT RECOMMENDED FOR NEW DESIGN
SC1453
POWER MANAGEMENT
Pin Configuration
N
O
FO T R
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N O
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N
Top View
(SOT-23-5 & TSOT-23-5)
Pin Descriptions
Pin #
Pin Name
1
IN
2
GND
3
EN
4
BYP
5
OUT
2008 Semtech Corp.
Pin Function
Input pin.
Ground pin. Can be used for heatsinking if needed.
Active high enable pin. Connect to IN if not being used.
Reference bypass. Connect a 10nF capacitor (typical) between this pin and GND to reduce
output noise.
Regulator output, sourcing up to 150mA.
4
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SC1453
NOT RECOMMENDED FOR NEW DESIGN
POWER MANAGEMENT
Ordering Information
SOT-23-5
Voltage Option
(V)
Part Number
1.5
SC1453ITSK1.5TR
SC1453ISK-1.8TR
1.8
SC1453ITSK1.8TR
2.5
SC1453ISK-2.5TR
2.5
SC1453ITSK2.5TR
2.7
SC1453ISK-2.7TR
2.7
SC1453ITSK2.7TR
2.8
SC1453ISK-2.8TR
2.8
SC1453ITSK2.8TR
2.9
SC1453ISK-2.9TR
2.85
SC1453ITSK285TR
Voltage Option
(V)
Part Number
1.5
SC1453ISK-1.5TR
1.8
(1)
Lead-free
SOT-23-5 (1)(2)
P ackag e
TSOT-23-5
3.0
SC1453ISK-3.0TR
2.9
SC1453ITSK2.9TR
3.1
SC1453ISK-3.1TR
3.0
SC1453ITSK3.0TR
3.2
SC1453ISK-3.2TR
3.1
SC1453ITSK3.1TR
3.3
SC1453ISK-3.3TR
3.2
SC1453ITSK3.2TR
1.5
SC1453ISK1.5TRT
3.3
SC1453ITSK3.3TR
1.8
SC1453ISK18TRT
1.5
SC1453ITSK15TRT
2.5
SC1453ISK2.5TRT
1.8
SC1453ITSK18TRT
2.7
SC1453ISK2.7TRT
2.5
SC1453ITSK25TRT
2.8
SC1453ISK2.8TRT
2.7
SC1453ITSK27TRT
2.9
SC1453ISK2.9TRT
2.8
SC1453ITSK28TRT
3.0
SC1453ISK3.0TRT
2.85
SC1453TSK285TRT
3.1
SC1453ISK3.1TRT
2.9
SC1453ITSK29TRT
3.2
SC1453ISK3.2TRT
3.0
SC1453ITSK30TRT
3.3
SC1453ISK33TRT
3.1
SC1453ITSK31TRT
3.2
SC1453ITSK32TRT
3.3
SC1453ITSK33TRT
Specify
S C 1453E V B
Lead-free
TSOT-23-5 (1)(2)
Notes:
(1) Only available in tape and reel packaging. A reel
contains 3000 devices.
(2) Lead free packaging (ordered with suffix extension
“TRT”) is optional. Consult factory for availability. This
product is fully WEEE and RoHS compliant.
(3) Evaluation board for SC1453. Specify output voltage
option when ordering.
2008 Semtech Corp.
(1)
N
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N O
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N
P ackag e
Evaluation
Board (3)
5
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NOT RECOMMENDED FOR NEW DESIGN
SC1453
POWER MANAGEMENT
Marking Information
Bottom Mark
x3XX
yyww
x = package (5 for SOT-23-5, T for TSOT-23-5)
3 = SC1453
XX = voltage option
(examples: 5331 for 3.1V option in SOT-23-5
yyww = Date code
(example: 0008 for week 8 of 2000)
Top Mark
Bottom Mark
BX00
yyww
For SC1453, 2.85V option:
X = L for SOT-23-5 and N for TSOT-23-5
yyww = Date code
(example: 0008 for week 8 of 2000)
Block Diagram
2008 Semtech Corp.
N
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N O
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D EN
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N
Top Mark
6
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NOT RECOMMENDED FOR NEW DESIGN
SC1453
POWER MANAGEMENT
Applications Information
Theory Of Operation
Component Selection - General
The SC1453 is intended for applications where very low
dropout voltage, low supply current and low output noise
are critical. It provides a very simple, low cost solution
that uses very little pcb real estate. Only three external
capacitors are required for operation (two if a low noise
output is not required).
Output capacitor - Semtech recommends a minimum
capacitance of 1µF at the output with an equivalent
series resistance (ESR) of < 1Ω over temperature. While
the SC1453 has been designed to be used with ceramic
capacitors, it does not have to be used with ceramic
capacitors, allowing the designer a choice. Increasing the
bulk capacitance will further reduce output noise and
improve the overall transient response.
The SC1453 contains a bandgap reference trimmed for
optimal temperature coefficient which is fed into the
inverting input of an error amplifier. The output voltage
of the regulator is divided down internally using a
resistor divider and compared to the bandgap voltage.
The error amplifier drives the gate of a low R DS(ON)
P-channel MOSFET pass device.
N
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N
Input capacitor - Semtech recommends the use of a 1µF
ceramic capacitor at the input. This allows for the device
being some distance from any bulk capacitance on the
rail. Additionally, input droop due to load transients is
reduced, improving overall load transient response.
Bypass capacitor - Semtech recommends the use of a
10nF ceramic capacitor to bypass the bandgap
reference. Increasing this capacitor to 100nF will
further improve power supply rejection and overall
output noise. CBYP may be omitted if low noise operation
is not required.
An active high enable pin (EN) allows the regulator to be
shut down. Pulling this pin low causes the device to
enter a very low power shutdown mode, where it will draw
typically 0.1µA from the input supply.
A bypass pin (BYP) is provided to decouple the bandgap
reference to reduce output noise and also to improve
power supply rejection. This pin can be left open if low
noise operation is not required.
Thermal Considerations
The worst-case power dissipation for this part is given
by:
The regulator has its own current limit circuitry to
ensure that the output current will not damage the
device during output short, overload or start-up. The
current limit is guaranteed to be greater than 400mA to
allow fast charging of the output capacitor and high
initial currents for DSP initialization.
PD(MAX ) = (VIN(MAX) − VOUT(MIN) )• IOUT(MAX ) + VIN(MAX ) • IQ(MAX )
For all practical purposes, equation (1) can be reduced
to the following expression:
PD(MAX) = (VIN(MAX ) − VOUT(MIN) )• IOUT(MAX)
The SC1453 has a fast start-up circuit to speed up the
initial charging time of the bypass capacitor to enable
the output voltage to come up quicker (typically 1.3ms
with CBYP = 10nF).
(2)
Looking at a typical application, 3.3V to 2.8V at 150mA:
VIN(MAX) = 3.3 + 5% = 3.465V
VOUT(MIN) = 2.8V - 2% = 2.744V
IOUT = 150mA
TA = 85°C
The SC1453 includes thermal shutdown circuitry to turn
off the device if T J exceeds 150°C (typical), with the
device remaining off until TJ drops by 20°C (typical).
Reverse battery protection circuitry ensures that the
device cannot be damaged if the input supply is
accidentally reversed, limiting the reverse current to less
than 1.5mA.
2008 Semtech Corp.
(1)
7
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NOT RECOMMENDED FOR NEW DESIGN
SC1453
POWER MANAGEMENT
Applications Information (Cont.)
Inserting these values into equation (2) gives us:
Layout Considerations
PD(MAX ) = (3.465 − 2.744 ) • 0.150 = 108mW
While layout for linear devices is generally not as critical
as for a switching application, careful attention to detail
will ensure reliable operation.
Using this figure, we can calculate the maximum thermal
impedance allowable to maintain TJ ≤ 125°C:
θ JA (MAX ) =
(T
J(MAX )
− TA (MAX ) )
PD(MAX )
=
1) Attaching the part to a larger copper footprint will
enable better heat transfer from the device, especially
on PCBs where there are internal ground and power
planes.
(125 − 85) = 370°C / W
0.108
2) Place the input, output and bypass capacitors close
to the device for optimal transient response and device
behaviour.
N
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N
With the standard SOT-23-5/TSOT-23-5 Land Pattern
shown at the end of this datasheet, and minimum trace
widths, the thermal impedance junction to ambient for
SC1453ISK is 256°C/W. Thus no additional heatsinking
is required for this example.
3) Connect all ground connections directly to the ground
plane. If there is no ground plane, connect to a common
local ground point before connecting to board ground.
The junction temperature can be reduced further (or
higher power dissipation can be allowed) by the use of
larger trace widths and connecting PCB copper to the
GND pin (pin 2), which connects directly to the device
substrate. Adding approximately one square inch of PCB
copper to pin 2 will reduce θ JA to approximately
130°C/W and T J(MAX) for the example above to
approximately 100°C for the SOT-23-5 package. The use
of multi layer boards with internal ground/power planes
will lower the junction temperature and improve overall
output voltage accuracy.
2008 Semtech Corp.
8
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SC1453
NOT RECOMMENDED FOR NEW DESIGN
POWER MANAGEMENT
Typical Characteristics
Quiescent Current vs. Junction Temperature
Off-State Quiescent Current
vs. Input Voltage
vs. Junction Temperature
200
120
IOUT = 150mA
VIN = 6.5V
VIN = 6.5V
VEN = 0V
175
100
150
IQ(OFF) (nA)
IQ (µA)
80
VIN = 3.8V
60
40
125
100
75
50
20
0
N
O
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R EC
N O
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IG ED
N
25
0
-50
-25
0
25
50
75
100
-50
125
-25
0
25
vs. Output Current
vs. Input Voltage Change
12
125
IOUT = 1mA
10
-0.10
IOUT = 50mA
-0.15
REGLINE (mV)
VOUT Deviation (%)
-0.05
100mA ≤ IOUT ≤ 150mA
-0.20
-0.25
8
VIN = VOUT + 1V to 6.5V
6
4
2
VIN = VOUT + 1V
-0.30
VIN = VOUT + 1V to 5.5V
0
-50
-25
0
25
50
75
100
125
-50
-25
0
TJ (°C)
25
50
75
100
125
TJ (°C)
Load Regulation vs.
Current Limit vs. Junction Temperature
Junction Temperature
vs. Input Voltage
0.90
VIN = VOUT + 1V
IOUT = 0.1mA to 150mA
0.85
8
0.80
7
0.75
6
0.70
ILIM (A)
REGLOAD (mV)
100
Line Regulation vs. Junction Temperature
IOUT = 1mA
9
75
Output Voltage vs. Junction Temperature
0.00
10
50
TJ (°C)
TJ (°C)
5
4
0.65
0.60
3
0.55
2
0.50
1
0.45
0
VIN = 6.5V
VIN = 3.8V
0.40
-50
-25
0
25
50
75
100
125
-50
TJ (°C)
2008 Semtech Corp.
-25
0
25
50
75
100
125
TJ (°C)
9
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SC1453
NOT RECOMMENDED FOR NEW DESIGN
POWER MANAGEMENT
Typical Characteristics (Cont.)
Dropout Voltage vs. Junction Temperature
Dropout Voltage vs. Output Current
vs. Output Current
vs. Junction Temperature
200
200
175
175
150
150
IOUT = 150mA
125
VD (mV)
VD (mV)
125
100
75
100
75
50
25
0
N
O
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N O
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ES D
IG ED
N
25
Top to bottom:
TJ = 125°C
TJ = 25°C
TJ = -40°C
50
IOUT = 50mA
0
-50
-25
0
25
50
75
100
125
0
25
50
75
TJ (°C)
100
125
Bypass Start-up Rise Time vs. Junction Temperature
Enable Input Threshold Voltage vs. Junction
vs. Input Voltage
Temperature vs. Input Voltage
1.8
1.7
1.6
CBYP = 10nF
1.6
VIN = 3.8V
1.4
VEN (V)
tr (ms)
1.5
1.3
1.2
1.4
VIH @ VIN = 6.5V
1.2
VIH @ VIN = 3.8V
1.0
VIL @ VIN = 6.5V
0.8
1.1
VIL @ VIN = 3.8V
VIN = 6.5V
1.0
0.6
0.9
0.8
0.4
-50
-25
0
25
50
75
100
125
-50
-25
0
25
TJ (°C)
5.0
4.5
50
75
Output Spectral Noise Density vs. Frequency
Junction Temperature
vs. Output Voltage, COUT = 1µF
VIN = VOUT + 1V
IOUT = 1mA
CIN = 1µF
CBYP = 10nF
TJ = 25°C
1
3.5
en (µV/√Hz)
3.0
2.5
2.0
1.5
0.1
0.01
1.0
0.5
0.0
-25
0
25
50
75
100
Top to bottom:
VOUT = 3.3V
VOUT = 3.0V
VOUT = 2.8V
VOUT = 2.5V
VOUT = 1.8V
VOUT = 1.5V
0.001
0.01
125
TJ (°C)
2008 Semtech Corp.
125
10
VIN = VEN = -6.5V
-50
100
TJ (°C)
Reverse Battery Protection vs.
4.0
I(REV BAT) (mA)
150
IOUT (mA)
0.1
1
10
100
1000
f (kHz)
10
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SC1453
NOT RECOMMENDED FOR NEW DESIGN
POWER MANAGEMENT
Typical Characteristics (Cont.)
Output Spectral Noise Density vs. Frequency
Output Spectral Noise Density vs. Frequency
vs. Output Voltage, COUT = 100µF
vs. Output Capacitance
10
10
VIN = VOUT + 1V
IOUT = 1mA
CIN = 1µF
CBYP = 10nF
TJ = 25°C
0.01
Top to bottom:
VOUT = 3.3V
VOUT = 3.0V
VOUT = 2.8V
VOUT = 2.5V
VOUT = 1.8V
VOUT = 1.5V
0.001
0.01
0.1
en (µV/√Hz)
0.1
1
0.1
0.01
VOUT = 1.5V
VIN = 2.5V
IOUT = 1mA
CBYP = 10nF
CIN = 1µF
TJ = 25°C
N
O
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R EC
N O
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ES D
IG ED
N
en (µV/√Hz)
1
Left to right:
COUT = 100µF
COUT = 44µF
COUT = 22µF
COUT = 10µF
COUT = 1µF
1
10
100
0.001
0.01
1000
0.1
1
f (kHz)
100
Output Spectral Noise Density vs. Frequency
Output Spectral Noise Density vs. Frequency
vs. Bypass Capacitance
vs. Output Current
10
VOUT = 1.5V
VIN = 2.5V
IOUT = 1mA
CIN = 1µF
COUT = 1µF
TJ = 25°C
0.001
0.01
0.1
0.1
0.01
1
10
100
Top to bottom:
IOUT = 150mA
IOUT = 100mA
IOUT = 50mA
IOUT = 1mA
1
en (µV/√Hz)
en (µV/√Hz)
0.1
0.01
VOUT = 1.5V
VIN = 2.5V
CIN = 1µF
CBYP = 10nF
COUT = 1µF
TJ = 25°C
0.001
0.01
1000
0.1
f (kHz)
1
10
100
Power Supply Rejection Ratio vs. Frequency
vs. Output Voltage, CBYP = 10nF
vs. Output Voltage, CBYP = 100nF
80
70
70
60
60
50
50
40
20
10
VIN = VOUT + 1V
CIN = COUT = 1µF
CBYP = 10nF
IOUT = 1mA
TJ = 25°C
0
0.01
0.1
PSRR (dB)
80
Top to bottom:
VOUT = 1.5V
VOUT = 1.8V
VOUT = 2.5V
VOUT = 2.8V
VOUT = 3.0V
VOUT = 3.3V
1
30
20
10
10
100
VIN = VOUT + 1V
CIN = COUT = 1µF
CBYP = 100nF
IOUT = 1mA
TJ = 25°C
0
0.01
1000
f (kHz)
2008 Semtech Corp.
40
0.1
1000
f (kHz)
Power Supply Rejection Ratio vs. Frequency
30
1000
10
CBYP = 1nF
CBYP = 10nF
CBYP = 100nF
CBYP = 1µF
1
PSRR (dB)
10
f (kHz)
Top to bottom:
VOUT = 1.5V
VOUT = 2.5V
VOUT = 1.8V
VOUT = 2.8V
VOUT = 3.0V
VOUT = 3.3V
1
10
100
1000
f (kHz)
11
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SC1453
NOT RECOMMENDED FOR NEW DESIGN
POWER MANAGEMENT
Evaluation Board Schematic
J1
RIPPLE MON
J2
IN MON
J3
1
U1
J4
5
OUT
R1
IN
C1
C2
R4
3
EN
EN
J12
GND
J13
GND
C5
IQ MON
J14
GND
C4
R2
R3
OUT MON
J6
J7
FLG
N
O
FO T R
R EC
N O
EW M
M
D EN
ES D
IG ED
N
1
2
3
J11
GND
C3
1
2
J8
EN
4
BYP
GND
2
J5
J10
GND
SC1453
IN
J9
LOAD DRV
J15
GND
J16
1
2
3
LOAD DRV EN
Q1
1
2
3
4
S
S
S
G
D
D
D
D
8
7
6
5
Si4410
Evaluation Board Bill of Materials
Quantity
2
Reference
Part/Description
Vendor
Notes
C 1, C 4
Not placed
C 2, C 3
1µF ceramic
Murata
C5
10nF ceramic
Various
J1
BNC socket
Various
VOUT ripple monitor
J2 - J4
Test pin
Various
Red
J5
Test pin
Various
White
1
J6
Header, 2 pin
Various
1
J7
Not placed
2
J8 , J1 6
Header, 3 pin
Various
1
J9
Test pin
Various
Orange
6
J1 0 - J1 5
Test pin
Various
Black (J14 not placed)
1
Q1
S i 4410
Vishay
2
R1, R2
Not placed
1
R3
See next page
Various
1
R4
10kΩ, 1/10W
Various
1
U1
SC1453ISK-X.X or
SC1453ITSK-XX
Semtech
2
1
1
3
1
2008 Semtech Corp.
12
GRM42-6X7R105K10
www.semtech.com
SC1453
NOT RECOMMENDED FOR NEW DESIGN
N
O
FO T R
R EC
N O
EW M
M
D EN
ES D
IG ED
N
POWER MANAGEMENT
Evaluation Board Gerber Plots
Top Copper
Bottom Copper
Top Silk Screen
2008 Semtech Corp.
13
Output Voltage Option (V)
R3 Value/Siz e
1.5
10Ω/0.5W
1.8
12Ω/0.5W
2.5
16Ω/0.5W
2.6
16Ω/0.5W
2.7
18Ω/0.5W
2.8
18Ω/0.5W
2.85
18Ω/0.5W
2.9
18Ω/0.5W
3.0
20Ω/0.5W
3.1
20Ω/0.5W
3.2
22Ω/0.5W
3.3
22Ω/0.5W
www.semtech.com
SC1453
NOT RECOMMENDED FOR NEW DESIGN
POWER MANAGEMENT
Outline Drawing - SOT-23-5
DIMENSIONS
INCHES
MILLIMETERS
DIM
MIN NOM MAX MIN NOM MAX
A
e1
2X E/2
D
A
A1
A2
b
c
D
E1
E
e
e1
L
L1
N
01
aaa
bbb
ccc
N
EI
1
E
2
ccc C
2X N/2 TIPS
e
B
-
.045
-
.057
.006
.051
.020
.009
.118
.069
.114
.063
.110 BSC
.037 BSC
.075 BSC
.012 .018 .024
(.024)
5
0°
10°
.004
.008
.008
0.90
0.00
.90
0.25
0.08
2.80
1.50
aaa C
A2
-
1.15
-
1.45
0.15
1.30
0.50
0.22
3.00
1.75
2.90
1.60
2.80 BSC
0.95 BSC
1.90 BSC
0.30 0.45 0.60
(0.60)
5
0°
10°
0.10
0.20
0.20
N
O
FO T R
R EC
N O
EW M
M
D EN
ES D
IG ED
N
D
.035
.000
.035
.010
.003
.110
.060
A
SEATING PLANE
A1
C
H
bxN
bbb
C A-B D
GAGE
PLANE
0.25
L
c
01
(L1)
SEE DETAIL
A
DETAIL
A
SIDE VIEW
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
Land Pattern - SOT-23-5
X
DIM
(C)
G
Z
Y
P
DIMENSIONS
MILLIMETERS
INCHES
(.098)
.055
.037
.024
.043
.141
C
G
P
X
Y
Z
(2.50)
1.40
0.95
0.60
1.10
3.60
NOTES:
1.
2008 Semtech Corp.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
14
www.semtech.com
NOT RECOMMENDED FOR NEW DESIGN
SC1453
POWER MANAGEMENT
Outline Drawing - TSOT-23-5
DIM
A
e1
A
A1
A2
b
c
D
E1
E
e
e1
L
L1
N
01
aaa
bbb
ccc
D
N
2X E/2
E1
1
E
2
ccc C
2X N/2 TIPS
e
B
D
aaa C
A2
-
.000
.028
.012
.003
.110
.060
-
.039
.004
.035
.020
.008
.118
.067
.114
.063
.110 BSC
.037 BSC
.075 BSC
.012 .018 .024
(.024)
5
8°
0°
.004
.008
.010
-
0.00
0.70
0.30
0.08
2.80
1.50
-
1.00
0.10
0.90
0.50
0.20
3.00
1.70
2.90
1.60
2.80 BSC
0.95 BSC
1.90 BSC
0.30 0.45 0.60
(0.60)
5
0°
8°
0.10
0.20
0.25
A
H
N
O
FO T R
R EC
N O
EW M
M
D EN
ES D
IG ED
N
SEATING
PLANE
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
A1
C
bxN
bbb
c
GAGE
PLANE
C A-B D
0.25
L
01
(L1)
DETAIL
SEE DETAIL
A
A
SIDE VIEW
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MO-193, VARIATION AB.
Land Pattern - TSOT-23-5
X
DIM
(C)
G
Z
Y
P
C
G
P
X
Y
Z
DIMENSIONS
MILLIMETERS
INCHES
(.087)
.031
.037
.024
.055
.141
(2.20)
0.80
0.95
0.60
1.40
3.60
NOTES:
1.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
Contact Information
Semtech Corporation
Power Management Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
2008 Semtech Corp.
15
www.semtech.com
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