SC2604
Simple PWM Boost Controller
with Input Disconnect FET Drive
POWER MANAGEMENT
Features
Description
Input Voltage Range: 4.5V to 16V
1% Voltage Reference Accuracy
Up to 95% Efficiency
Input Disconnect FET Drive
In-rush Current Control
Internal Compensation
Programmable Current Limit
Programmable Soft Start
800mA Typical PWM Gate Drive
400kHz Switching Frequency
Under Voltage Lockout
O U T IN
on the OCP/EN pin 0and
pin can trigger a
.625the SS/VREF
750
hiccup event because of the charging current demanded
by the boost regulator output capacitor.
72mV Voltage
SettingRthe =Output
CS
IPEAK
In Figure 1, an external resistive divider R3 and R5 with its
center tap tied to the FB pin sets the output voltage.
V
R3 = R 5 OUT − 1
1
.
25
V
In some applications, a RC branch (R6, C12 in the Typical
Schematic on page 12) will be needed for loop stability.
Maximum Duty Cycle
The maximum duty cycle, Dmax defines the upper limit of
VO U T
1ratio
power conversion
=
VIN
1 − DMA X
VO U T
1
=
VIN
1 − DMA X
Calculating Current Sense Resistor
C ( V − Vd ) R C S
C O C P/ E N > O U T IN
0.625
750
Current sense resistor
is placed
at the input to sense
C
(
V
V
)
R
−
O
U
T
IN
d
C
inductor
current of the boostSregulator. The value of
C Opeak
C P/ E N >
0.625 by750
the resistor can be calculated
72mV
IPEAK
72mV
R CSis=the allowed boost inductor peak current.
where IPEAK
IPEAK
R CS =
In many applications,
V a noise
filter circuit (R1=200, C10=10nF
R3 = R 5 OUT − 1
in the Typical Schematic
1.25 V on
page 12) may be needed for
the input current
sensing.
V
R3 = R 5 OUT − 1
1.25 V
© 2010 Semtech Corp.
C O C P/ E N >
C O U T( VIN − Vd ) R C S
0.625
750
Disconnect FET Selection
72mV
IPEAK voltage of DRV pin drops slightly as
The floating driving
R CS =
the supply voltage VIN is below 7.5V (Typical Characteristics
on page 8), where a FET with low gate threshold voltage
(VGS(TH)) has to be used for the disconnect FET. In a 5V input
VOUT
R3 = Ra5FET
−GS(TH)
1 =2V, such as FDD6672A from
with V
application,
1.25 V
Fairchild, is needed.
Layout Guidelines
Careful attentions to layout requirements are necessary
for successful implementation of the SC2604 PWM
controller. High currents switching at 400kHz are present
in the application and their effect on ground plane voltage
differentials must be understood and minimized.
1) The high power parts of the circuit should be laid out
first. A ground plane should be used, the number and
position of ground plane interruptions should be such as
to not unnecessarily compromise ground plane integrity.
Isolated or semi-isolated areas of the ground plane may
be deliberately introduced to constrain ground currents
to particular areas, for example the input capacitor and
bottom Schottky ground.
2) The loop formed by the output Capacitor(s) (COUT ), the
FET (Q1), the current sensing resistor, and the Schottky
(D1) must be kept as small as possible, as shown on the
layout diagram in Figure 4. This loop contains all the high
current, fast transition switching. Connections should
be as wide and as short as possible to minimize loop
inductance. Minimizing this loop area will reduce EMI,
www.semtech.com 10
yout
SC2604
Applications Information (Cont.)
lower ground injection currents, resulting in electrically
“cleaner” grounds for the rest of the system and minimize
source ringing, resulting in more reliable gate switching
signals.
5) The SC2604 is best placed over an isolated ground
plane area. The soft-start capacitor and the Vin decoupling
capacitor should also connected to this ground pad
area. This isolated ground area should be connected to
the main ground by a trace that runs from the GND pin
to the ground side of the output capacitor. If this is not
possible, the GND pin may be connected to the ground
path between the Output Capacitor and the CIN, Q1, D1
loop. Under no circumstances should GND be returned to
a ground inside the CIN, Q1, D1 loop.
3) The connection between the junction of Q1, D1 and the
output capacitor should be a wide trace or copper region.
It should be as short as practical. Since this connection
has fast voltage transitions, keeping this connection short
will minimize EMI.
4) The Output Capacitor(s) (COUT ) should be located as
close to the load as possible, fast transient load currents
are supplied by COUT only, and connections between COUT
and the load must be short, wide copper areas to minimize
diagram
inductance and resistance.
6) Input voltage of the SC2604 should be supplied from
the power rail through a 1Ω resistor, the Vin pin should
be decoupled directly to GND by a 0.1µF~1µF ceramic
capacitor, trace lengths should be as short as possible.
Vout
VIN
Ra
D1
4.7uH
Rcs
Cin
1
+
SC2604
2
5
1uF
0.1uF
1
3
VIN
SS/VREF
CS
DRV
FB
GATE
OCP/EN
GND
6
Rb
Cout
8
7
4
0.1uF
Note: Heavy lines indicate the critical loop carrying high pulsating current.
The inductance of the loop needs to be minimized.
Figure 4. SC2604 Layout Diagram
© 2010 Semtech Corp.
www.semtech.com 11
SC2604
Applications Information (Cont.)
Typical application schematic with 12V input and 25V/1.5A output
Rs
10m, Sen. Res.
12V INPUT
+ C1
220uF
C3
1uF
Rcc
1R0
Q1
IRF7821
C11
1uF
Da
MA729
1
D1
2
C4 15uH
1uF
R1
200
C10
10nF
L1(CD1-150)
A
25V/1.5A OUTPUT
C
C6
4.7uF
CMSH2-40L
Q2
AO4412
+
C7
220uF
U1
1
CS
DRV
8
2
VIN
OCP/EN
7
3
GATE
FB
6
SS/VREF
5
4
GND
SC2604
R3
499k
C12
C13
0.33uF
C14
0.1uF
0.33uF
R6
1.43k
R5
26.3k
Note: A small Schottky diode (Da) may be required in some applications to clamp negative spike at the GATE pin.
Bill of materials
5
Item Quantity Reference
1
1
C1
2
3
C3,C4,C11
3
1
C6
4
1
C7
5
1
C10
6
1
C12
7
1
C13
8
1
C14
9
1
D1
10
1
Da
11
1
L1
12
1
Q1
13
1
Q2
14
1
Rs
15
1
R1
16
1
Rcc
17
1
R3
18
1
R5
19
1
R6
20
1
U1
© 2010 Semtech Corp.
Part (P/N of Vender)
220uF/10V
1uF/16V
4.7uF/50V
220uF/35V/160m
10nF
0.33uF
0.33uF
0.1uF
CMSH2-40L (Schottky diode)
MA729 (Schottky diode)
15uH/3.5A (CD1-150)
4
IRF7821
AO4412
15m(Sensing Res.)
200
1R0
499k
26.1k
1.43k
SC2604
Vendor
Rubycon, ZL
Vishay
Murata
Rubycon, YXF
Vishay
Vishay
Vishay
Vishay
Central Semi
Panasonic
Coiltronics
3
IR
Alpha & Omega Semi.
Vishay
Vishay
Vishay
Vishay
Vishay
Vishay
Semtech
Title
Size
A
Date:
SEMTECH CORPORATIO
SC2604 (MSOP-8) EVB Sc
Document Number
12V Input, 25V/1.5A Output, 4
Tuesday, October 23, 2007
2
www.semtech.com 12
Sheet
SC2604
12V Input (5V/DIV)
Applications
Information (Cont.)
Start up
12V Input (5V/DIV)
25V output (10V/DIV)
SS/VREF (1V/DIV)
OCP/EN (1V/DIV)
X=5ms/DIV
Inductor current and DRV pin voltage at OCP
25V Output (1V/DIV)
OCP/EN (1V/DIV)
Inductor Current (5A/DIV)
DRV Voltage (5V/DIV)
© 2010 Semtech Corp.
X=10ms/DIV
www.semtech.com 13
SC2604
MSOP-8 Outline
Outline Drawing - MSOP-8
ü
DIM
A
A
A1
A2
b
c
D
E1
E
e
L
L1
N
01
aaa
bbb
ccc
D
N
2X E/2
E1
PIN 1
INDICATOR
ü
C
E
1 2
2X N/2 TIPS
e
B
ü
D
C
A
.043
.006
.037
.015
.009
.118 .122
.118 .122
.193 BSC
.026 BSC
.016 .024 .032
(.037)
8
8°
0°
.004
.005
.010
1.10
0.00
0.15
0.75
0.95
0.22
0.38
0.08
0.23
2.90 3.00 3.10
2.90 3.00 3.10
4.90 BSC
0.65 BSC
0.40 0.60 0.80
(.95)
8
0°
8°
0.10
0.13
0.25
ü
ü
c
GAGE
PLANE
A1
C
.000
.030
.009
.003
.114
.114
H
A2
SEATING
PLANE
DIMENSIONS
INCHES
üüüüü
MIN NOM MAX MIN NOM MAX
0.25
C A-B D
L
(L1)
DETAIL
SEE DETAIL
SIDE VIEW
01
A
A
MSOP-8 Landing Pattern
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2.
DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE ü
3.
DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4.
REFERENCE JEDEC STD MO-187, VARIATION AA.
Land Pattern - MSOP-8
X
DIM
ü
G
Y
Z
C
G
P
X
Y
Z
DIMENSIONS
INCHES
üüüüü
(.161)
.098
.026
.016
.063
.224
(4.10)
2.50
0.65
0.40
1.60
5.70
P
NOTES:
1.
© 2010 Semtech Corp.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
www.semtech.com 14
SC2604
Outline Drawing - 2x3 MLPD-UT8
A
B
D
DIM
E
PIN 1
INDICATOR
(LASER MARK)
A
ü
C
A2
A1
SEATING
PLANE
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
DIMENSIONS
üüüüü
INCHES
MIN NOM MAX MIN NOM MAX
- .024
.002
(.006)
.007 .010 .012
.075 .079 .083
.059 .065 .069
.114 .118 .122
.065 .071 .075
.020 BSC
.012 .016 .020
8
.003
.003
.020
.000
0.50
0.60
0.00
0.05
(0.1524)
0.18 0.25 0.30
1.90 2.00 2.10
1.50 1.65 1.75
2.90 3.00 3.10
1.65 1.80 1.90
0.50 BSC
0.30 0.40 0.50
8
0.08
0.08
C
D1
1 2
ü
ü
E1
N
ü
e
ü
C A B
ü
ü
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - 2x3 MLPD-UT8
K
DIM
ü
G
H
Y
X
Z
C
G
H
K
P
X
Y
Z
DIMENSIONS
INCHES
üüüüü
(.116)
.087
.071
.069
.020
.012
.030
.146
(2.95)
2.20
1.80
1.75
0.50
0.30
0.75
3.70
P
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
© 2010 Semtech Corp.
www.semtech.com 15
SC2604
© Semtech 2010
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Contact Information
Semtech Corporation
Power Mangement Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111 Fax: (805) 498-3804
www.semtech.com
© 2010 Semtech Corp.
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