SC4211HSTRT

SC4211H Very Low Input /Very Low Dropout 1 Amp Regulator With Enable POWER MANAGEMENT Description Features u u u u u u u u The SC4211H is a high performance positive voltage regulator designed for use in applications requiring very low Input voltage and very low dropout voltage at up to 1 amperes. It operates with a Vin as low as 1.4V, with output voltage programmable as low as 0.5V. The SC4211H features ultra low dropout, ideal for applications where Vout is very close to Vin. Additionally, the SC4211H has an enable pin to further reduce power dissipation while shutdown. The SC4211H provides excellent regulation over variations in line, load and temperature. Input Voltage as low as 1.4V 400mV dropout @ 1A Adjustable output from 0.5V Over current and over temperature protection Enable pin 10µA quiescent current in shutdown Full industrial temperature range Available in SOIC-8-EDP Lead-free package, fully WEEE and RoHS compliant Applications u u u u u u u u The SC4211H is available in the SOIC-8-EDP (Exposed Die Pad) package. Depending on how the FB pin is configured, the output voltage can be either externally adjusted or fixed to 0.5V. Typical Application Circuits Telecom/Networking cards Motherboards/Peripheral cards Industrial Applications Wireless infrastructure Set top boxes Medical equipment Notebook computers Battery powered systems SC4211H 4 5 NC 3 VIN 2 ENABLE NC VIN VO EN FB NC GND 1 6 VO 7 8 R1 VO = 0.5 (R1 + R2) Volts R2 U1 C1 C2 R2 SC4211H 5 4 3 VIN 2 ENABLE NC NC VIN VO 6 EN FB NC GND 1 VO = 0.5V 7 8 U1 C1 Rev. 2.1 C2 1 www.semtech.com SC4211H POWER MANAGEMENT Absolute Maximum Ratings Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. Parameter Symbol Max Units 7 V PD Internally Limited W θJA 36 °C/W θJC 5.5 °C/W Operating Ambient Temperature Range TA -40 to +85 °C Operating Junction Temperature Range TJ -40 to +125 °C TSTG -65 to +150 °C TP 260 °C V ESD 2 kV Vin, EN, Vo, FB to GND Power Dissipation Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case (1) (1) Storage Temperature Range Peak IR Reflow Temperature (10s to 30s) ESD Rating (Human Body Model) (2) Notes: (1) Calculated from package in still air, mounted to 3” x 4.5”, 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards, (2) Tested according to JEDEC standard JESD22-A114-B. Electrical Characteristics Unless specified: VEN = VIN, VFB = VO, VIN = 1.40V to 6.0V, IO = 8mA to 1A. Values in bold apply over the full operating temperature range. Parameter Symbol Test Conditions Min Typ Max Units 6.0 V 3 mA VIN Supply Voltage Range VIN Quiescent Current IQ 1.40 VIN = 3.3V, IO = 0A VIN = 6.0V, VEN = 0V 10 50 µA VO Line Regulation(1) REG(LINE) IO = 10mA 0.2 0.4 %/V Load Regulation(1) REG(LOAD) IO = 10mA to 1A 0.5 1.5 % VDO IO = 500mA 100 250 mV Dropout Voltage(1)(2) 300  2013 Semtech Corp. 2 www.semtech.com SC4211H POWER MANAGEMENT Electrical Characteristics (Cont.) Unless specified: VEN = VIN, VFB = VO, VIN = 1.40V to 6.0V, IO = 8mA to 1A. Values in bold apply over the full operating temperature range. Parameter Symbol Test Conditions VDO IO = 1A Minimum Load Current(3) IO VIN = VO + 0.5V Current Limit(4) ICL Min Typ Max 200 400 Units VO (Cont.) Dropout Voltage(1)(2) mV 500 8 mA 1.1 1.5 2.0 A VIN = 3.3V, VFB = VOUT, IO = 10mA 0.495 0.5 0.505 V Full IOUT , and VIN Range 0.490 F eed b ack Reference Voltage(1) Feedback Pin Current(4) VREF 0.510 IADJ VFB = VREF 80 200 nA Enable Pin Current IEN VEN = 0V, VIN = 3.3V 1.5 10 µA Enable Pin Threshold VIH VIN = 3.3V VIL VIN = 3.3V EN 1.6 V 0.4 Over Temperature Protection High Trip level Hysteresis Notes: (1) (2) (3) (4) THI 160 °C THYST 10 °C Low duty cycle pulse testing with Kelvin connections required. VDO = VIN -VO when VO decreases by 1.5% of its nominal output voltage with VIN = VO +0.8V. Required to maintain regulation. Voltage set resistors R1 and R2 are usually utilized to meet this requirement. Guaranteed by design.  2013 Semtech Corp. 3 www.semtech.com SC4211H POWER MANAGEMENT Ordering Information Part Number P ackag e Temp. Range (TJ) SC4211HSTRT(1)(2) SOIC-8-EDP -40 to +125 OC SC4211HEVB Evaluation Board Notes: (1) Only available in tape and reel packaging. A reel contains 2500 devices. (2) Lead-free product. This product is fully WEEE and RoHS compliant. Pin Configuration Pin Descriptions Pin # Pin Name Pin Description 2 EN Enable Input. Pulling this pin below 0.4V turns the regulator off, reducing the quiescent current to a fraction of its operating value. The device will be enabled if this pin is left open. Connect to VIN if not being used. 3 VIN Input voltage. For regulation at full load, the input to this pin must be between (VO + 0.5V) and 5.5V. Minimum VIN=1.4V. A large bulk capacitance should be placed closely to this pin to ensure that the input supply does not sag below 1.4V. Also a minimum of 4.7uF ceramic capacitor should be placed directly at this pin. 6 VO The pin is the power output of the device. A minimum of 10uF capacitor should be placed directly at this pin. 7 FB Output voltage feedback pin. If connected to the VO pin, the output voltage will be set at 0.5V. If external feedback resistors are used, the output voltage will be (See Application Circuits on page 1): VO = [0.5 (R1+R2)] / R2 Volts 8 GND Reference ground. The GND pin and the exposed die pad must be connected together at the IC pin. 1, 4, 5 NC No connection. THERMAL PAD Pad for heatsinking purposes. Connect to ground plane using multiple vias. Not electrically connected internally.  2013 Semtech Corp. 4 www.semtech.com SC4211H POWER MANAGEMENT Block Diagram Marking Information Top View SC4211H yyww xxxxx yyww = Datecode (Example: 0015) xxxxx = Semtech Lot No. (Example: 00101)  2013 Semtech Corp. 5 www.semtech.com SC4211H POWER MANAGEMENT Typical Characteristics Region of Instability Stable Region Region of Instability Region of Instability Stable Region Region of Instability  2013 Semtech Corp. 6 www.semtech.com SC4211H POWER MANAGEMENT Applications Information Introduction operating value. A pull up resistor up to 400kOhms should be connected from this pin to the VIN pin in application where supply voltages of Vin < 1.9V is required. For applications with higher voltages than 1.9V, EN pin could be left open or connected to VIN. The SC4211H is intended for applications where high current capability and very low dropout voltage are required. It provides a very simple, low cost solution that uses very little PCB real estate. Additional features include an enable pin to allow for a very low power consumption standby mode, and a fully adjustable output. Thermal Considerations The power dissipation in the SC4211H is approximately equal to the product of the output current and the input to output voltage differential: Component Selection Input capacitor: A large bulk capacitance of about ≥ 10uF/A (output load) should be closely placed to the input supply pin of the SC4211H to ensure that Vin does not sag below 1.4V. Also a minimum of 4.7µF ceramic capacitor is recommended to be placed directly next to the Vin pin. This allows for the device being some distance from any bulk capacitance on the rail. Additionally, input droop due to load transients is reduced, improving load transient response. Additional capacitance may be added if required by the application. PD ≈ (VIN − VOUT )• I O The absolute worst-case dissipation is given by: PD(MAX) = (VIN (MAX) − VOUT (MIN) )• I O(MAX) + VIN (MAX) • I Q(MAX) For a typical scenario, VIN = 3.3V ± 5%, VOUT = 2.8V and IO = 1A, therefore: VIN(MAX) = 3.465V, VOUT(MIN) = 2.744V and IQ(MAX) = 1.75mA, Output capacitor: A minimum bulk capacitance of ≥ 10µF/A (output load), along with a 0.1µF ceramic decoupling capacitor is recommended. Increasing the bulk capacitance will improve the overall transient response. The use of multiple lower value ceramic capacitors in parallel to achieve the desired bulk capacitance will not cause stability issues. Although designed for use with ceramic output capacitors, the SC4211H is extremely tolerant of output capacitor ESR values and thus will also work comfortably with tantalum output capacitors. Thus PD(MAX) = .722W. Using this figure, and assuming TA(MAX) = 70°C, we can calculate the maximum thermal impedance allowable to maintain TJ ≤ 150°C: R TH(J −A)(MAX) = Noise immunity: In very electrically noisy environments, it is recommended that 0.1µF ceramic capacitors be placed from IN to GND and OUT to GND as close to the device pins as possible. (T J(MAX) − TA(MAX) ) PD(MAX) = (150 − 70) = 110°C/W .722 This should be achievable for the SOIC-8-EDP package using PCB copper area to aid in conducting the heat away, such as one square inch of copper connected to the ground pins of the device. Internal ground/power planes and air flow will also assist in removing heat. For higher ambient temperatures it may be necessary to use additional copper area. Internal voltage selection: By connecting the FB pin directly to the VO pin, the output voltage will be regulated to the 0.5V internal reference. External voltage selection resistors: The use of 1% resistors, and designing for a current flow ≥ 8mA is recommended to ensure a well regulated output (thus R2 ≤ 62.5Ω). Enable: Pulling this pin below 0.4V turns the regulator off, reducing the quiescent current to a fraction of its  2013 Semtech Corp. 7 www.semtech.com SC4211H POWER MANAGEMENT Outline Drawing - SOIC-8-EDP A D e DIMENSIONS MILLIMETERS DIM MIN NOM MAX N E1 E 1 2 ccc C 2X N/2 TIPS e/2 B D aaa C A2 A SEATING PLANE C 1.35 1.75 0.13 0.00 1.25 1.65 0.31 0.51 0.17 0.25 4.80 4.90 5.00 3.80 3.90 4.00 6.00 BSC 1.27 BSC 2.95 3.50 2.15 2.60 0.25 0.50 0.40 0.72 1.04 (1.05) 8 0° 8° 0.10 0.25 0.20 A A1 A2 b c D E1 E e F H h L L1 N 01 aaa bbb ccc E/2 A1 bxN bbb C A-B D h F h EXPOSED PAD H H c GAUGE PLANE L (L1) 0.25 DETAIL SEE DETAIL 01 A A SIDE VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H- . 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 4. THE MEASUREMENT OF DIMENSION "F" DOES NOT INCLUDE EXPOSED TIE BAR.  2013 Semtech Corp. 8 www.semtech.com SC4211H POWER MANAGEMENT Land Pattern - SOIC-8-EDP E SOLDER MASK D (C) F G Z Y THERMAL VIA Ø 0.36mm P DIMENSIONS DIM MILLIMETERS (5.30) C D 3.50 E 5.10 F 2.60 3.20 G P 1.27 X 0.60 Y 2.10 Z 7.40 X NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSE ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. 4. REFERENCE IPC-SM-782A, SECTION 9.1, RLP NO. 300A. Contact Information Semtech Corporation Power Management Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2013 Semtech Corp. 9 www.semtech.com