SM36.TCT

SM05 through SM36 TVS Diode Array PROTECTION PRODUCTS Description Features The SM series of transient voltage suppressors (TVS) are designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD), electrical fast transients (EFT), and lightning. ‹ 300 watts peak pulse power (tp = 8/20µs) ‹ Transient protection for data & power lines to TVS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The dual-junction common-anode design allows the user to protect one bidirectional data line or two unidirectional lines. The low profile SOT23 package allows flexibility in the design of “crowded” circuit boards. ‹ ‹ ‹ ‹ IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20µs) Protects one bidirectional line or two unidirectional lines Working Voltages: 5V, 12V, 15V, 24 and 36V Low clamping voltage Solid-state silicon avalanche technology Mechanical Characteristics ‹ ‹ ‹ ‹ The SM series will meet the surge requirements of IEC 61000-4-2 (Formerly IEC 801-2), Level 4, “Human Body Model” for air and contact discharge. JEDEC SOT23 package Molding compound flammability rating: UL 94V-0 Marking : Marking Code Packaging : Tape and Reel per EIA 481 Applications ‹ ‹ ‹ ‹ ‹ Circuit Diagram Cellular Handsets and Accessories Portable Electronics Industrial Controls Set-Top Box Servers, Notebook, and Desktop PC Schematic & PIN Configuration SOT23 (Top View) Revision 07/12/04 1 www.semtech.com SM05 through SM36 PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 300 Watts Thermal Resistance, Junction to Ambient θJ A 556 °C/W Lead Soldering Temp erature TL 260 (10 sec.) °C Op erating Temp erature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temp erature Electrical Characteristics SM05 Par ame te r Symbo l Co nditio ns Minimum Typical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 20 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 9.8 V Peak Pulse Current IP P tp = 8/20µs 17 A Junction Cap acitance Cj Pi n 1 to 2 VR = 0V, f = 1MHz 350 pF Junction Cap acitance Cj Pin 1 to 3 and Pi n 2 to 3 VR = 0V, f = 1MHz 400 pF Symbo l Co nditio ns Maximum Units 12 V 6 V SM12 Par ame te r Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 19 V Peak Pulse Current IP P tp = 8/20µs 12 A Junction Cap acitance Cj Pi n 1 to 2 VR = 0V, f = 1MHz 120 pF Junction Cap acitance Cj Pin 1 to 3 and Pi n 2 to 3 VR = 0V, f = 1MHz 150 pF  2004 Semtech Corp. 2 13.3 V www.semtech.com SM05 through SM36 PROTECTION PRODUCTS Electrical Characteristics (Continued) SM15 Parameter Symbol Conditions Minimum Typical Maximum Units 15 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 15V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 24 V Peak Pulse Current IP P tp = 8/20µs 10 A Junction Cap acitance Cj Pi n 1 to 2 VR = 0V, f = 1MHz 75 pF Junction Cap acitance Cj Pin 1 to 3 and 2 to 3 VR = 0V, f = 1MHz 100 pF Symbol Conditions Maximum Units 24 V 16.7 V SM24 Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 24V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 43 V Peak Pulse Current IP P tp = 8/20µs 5 A Junction Cap acitance Cj Pi n 1 to 2 VR = 0V, f = 1MHz 50 pF Junction Cap acitance Cj Pin 1 to 3 and 2 to 3 VR = 0V, f = 1MHz 60 pF Symbol Conditions Maximum Units 36 V 26.7 V SM36 Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 36V, T=25°C 1 µA Clamp ing Voltage VC IPP = 1A, tp = 8/20µs 60 V Peak Pulse Current IP P tp = 8/20µs 4 A Junction Cap acitance Cj Pi n 1 to 2 VR = 0V, f = 1MHz 40 pF Junction Cap acitance Cj Pin 1 to 3 and 2 to 3 VR = 0V, f = 1MHz 45 pF  2004 Semtech Corp. 3 40 V www.semtech.com SM05 through SM36 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 110 Peak Pulse Power - Ppk (kW) 100 % of Rated Power or IPP 90 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0 0.1 1 10 100 25 1000 50 75 100 125 150 o Ambient Temperature - TA ( C) Pulse Duration - tp (µs) Pulse Waveform 110 W aveform Parameters: tr = 8µs td = 20µs 100 90 Percent of IPP 80 70 e -t 60 50 40 td = I PP /2 30 20 10 0 0 5 10 15 20 25 30 T im e (µs) ESD Pulse Waveform (Per IEC 61000-4-2) IEC 61000-4-2 Discharge Parameters Level  2004 Semtech Corp. 4 First Peak Current Peak Current at 30 ns Peak Current at 60 ns Test Test Voltage Voltage (Contact (A ir Discharge) Discharge) ( kV ) (kV) (A ) (A ) (A ) 1 7.5 4 8 2 2 2 15 8 4 4 4 3 22.5 12 6 6 8 4 30 16 8 8 15 www.semtech.com SM05 through SM36 PROTECTION PRODUCTS Applications Information Device Connection Options Device Schematic & Pin Configuration The SM series is designed to protect one bidirectional or two unidirectional data or I/O lines operating at 5 to 36 volts. Connection options are as follows: z Bidirectional: Pin 1 is connected to the data line and pin 2 is connected to ground (Since the device is symmetrical, these connections may be reversed). The ground connection should be made directly to a ground plane. The path length should be kept as short as possible to minimize parasitic inductance. Pin 3 is not connected. z Unidirectional: Data lines are connected to pin 1 and pin 2. Pin 3 is connected to ground. For best results, this pin should be connected directly to a ground plane on the board. The path length should be kept as short as possible to minimize parasitic inductance. RS-232 Transceiver Protection Example Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information): z Place the TVS near the input terminals or connectors to restrict transient coupling. z Minimize the path length between the TVS and the protected line. z Minimize all conductive loops including power and ground loops. z The ESD transient return path to ground should be kept as short as possible. z Never run critical signals near board edges. z Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.  2004 Semtech Corp. 5 www.semtech.com SM05 through SM36 PROTECTION PRODUCTS Outline Drawing - SOT23 D A DIM e1 A A1 A2 b c D E E1 e e1 L L1 N 0 aaa bbb H 3 B E1 GAUGE PLANE SEATING PLANE E 0 c 0.25 C L L1 DETAIL A 1 2 bxN bbb e A2 A .035 .000 .035 .012 .003 .110 .082 .047 .015 0° .037 .114 .093 .051 .075 .037 .020 .022 3 .004 .008 .044 .004 .040 .020 .007 .120 .104 .055 .024 8° 0.89 1.12 0.01 0.10 0.88 0.95 1.02 0.30 0.51 0.08 0.18 2.80 2.90 3.04 2.10 2.37 2.64 1.20 1.30 1.40 1.90 BSC 0.95 BSC 0.40 0.50 0.60 (0.55) 3 0° 8° 0.10 0.20 C A B 3X aaa C SEE DETAIL A SIDE VIEW SEATING PLANE A1 DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX C NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H- 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern - SOT23 X Y DIM Z G Y C C E E1 G X Y Z DIMENSIONS INCHES MILLIMETERS (.087) .037 .075 .031 .039 .055 .141 (2.20) 0.95 1.90 0.80 1.00 1.40 3.60 E E1 NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A.  2004 Semtech Corp. 6 www.semtech.com SM05 through SM36 PROTECTION PRODUCTS Marking Codes Part Number Marking Code SM05 M05 SM12 M12 SM15 M15 SM24 M24 SM36 M36 Ordering Information Part Number Lead Finish Qty per Reel R eel Size SM05.TC SnPb 3,000 7 Inch SM12.TC SnPb 3,000 7 Inch SM15.TC SnPb 3,000 7 Inch SM24.TC SnPb 3,000 7 Inch SM36.TC SnPb 3,000 7 Inch SM05.TCT Pb Free 3,000 7 Inch SM12.TCT Pb Free 3,000 7 Inch SM15.TCT Pb Free 3,000 7 Inch SM24.TCT Pb Free 3,000 7 Inch SM36.TCT Pb Free 3,000 7 Inch Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2004 Semtech Corp. 7 www.semtech.com