SMS3.3.TCT

SMS3.3 3.3 Volt TVS Array For ESD and Latch-Up Protection PROTECTION PRODUCTS Description Features The SMS series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD, lightning, and other voltage induces transient events. Each device will protect up to four lines operating at 3.3 volts. • Transient Protection to ŒŒ IEC 61000-4-2 (ESD):15kV (Air), 8kV (Contact) ŒŒ IEC 61000-4-4 (EFT): 40A (5/50ns) ŒŒ IEC 61000-4-5 (Lightning): 12A (8/20µs) • Protects four I/O lines • Working voltage: 3.3V • Low leakage current (25 >15 kV Soldering Temperature TL 260 (10 seconds) O Operating Temperature TJ -55to +125 O Storage Temperature TSTG -55 to +150 O C C C Electrical Characteristics (T=25OC unless otherwise specified) Parameter Symbol Conditions Reverse Stand-Off Voltage Min. Typ. Max. VRWM 3.3 Units V Punch-Through Voltage VPT IPT = 2μA 3.5 V Snap-Back Voltage VSB ISB = 50mA 2.8 V Reverse Leakage Current IR Clamping Voltage VC VRWM = 3.3V, T = 25OC 0.05 0.5 μA IPP = 1A, tp = 8/20µs Any I/O to GND 4.5 IPP = 5A, tp = 8/20µs Any I/O to GND 6.8 IPP = 12A, tp = 8/20µs Any I/O to GND 8.7 1.7 V 40 pF Steering Diode Forward Voltage (Reverse Clamping Voltage) VF IPP = 1A, tp = 8/20µs Any I/O to GND Junction Capacitance CJ Each I/O pin and Ground VR = 0V, f = 1MHz 35 V Notes: (1): ESD Gun return path to Ground Reference Plane (GRP) SMS3.3 Final Datasheet 3/26/2019 Rev 6.0 www.semtech.com Page 2 of 7 Semtech Proprietary and Confidential Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 120 10 TA = 25OC Peak Pulse Power - PPP (kW) 100 % of Rated Power or IPP 1 0.1 80 60 40 20 DR040512:25:125:150 DR040412-200 0.01 0.1 1 10 Pulse Duration - tp (µs) 100 0 1000 Pulse Waveform 0 70 8 Clamping Voltage - VC (V) 80 e-t 60 50 40 td = IPP/2 30 20 10 7 6 5 4 3 2 Waveform Parameters: tr = 8µs td = 20µs 1 0 5 10 15 20 25 0 30 SMS3.3_8x20Surge 0 2 4 Time (µs) 6 8 10 12 14 Peak Pulse Current - IPP (A) Forward Voltage vs. Peak Pulse Current (8/20µs Pulse) Capacitance vs. Reverse Voltage 10 40 9 35 Capacitance - CJ (pF) 8 Forward Voltage - VF (V) 150 9 Waveform Parameters: tr = 8µs td = 20µs 90 7 6 5 4 3 30 25 20 15 10 2 Waveform Parameters: tr = 8µs td = 20µs 1 0 125 10 100 Percent of IPP 50 75 100 Ambient Temperature - TA (OC) Clamping Voltage vs. Peak Pulse Current (8/20µs Pulse) 110 0 25 SMS3.3_VF_8x20Surge 0 2 4 6 8 10 12 TA = 25OC. f = 1 MHz. 5 14 0 SMS3.3_CAPvV 0 Peak Pulse Current - IPP (A) SMS3.3 Final Datasheet 3/26/2019 Rev 6.0 www.semtech.com 0.5 1 1.5 2 2.5 3 Reverse Voltage - VR (V) 3.5 4 Page 3 of 7 Semtech Proprietary and Confidential Application Information Device Connection for Protection of Four Data Lines SMS3.3 Circuit Diagram The SMS3.3 is designed to protect up to four unidirectional data lines. The device is connected as follows: 1 1. Unidirectional protection of four I/O lines is achieved by connecting pins 1, 3, 4 and 6 to the data lines. Pin 2 and 5 are connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for suppression of ESD Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: • Place the TVS near the input terminals or connectors to restrict transient coupling. • Minimize the path length between the TVS and the protected line. • Minimize all conductive loops including power and ground loops. • The ESD transient return path to ground should be kept as short as possible. • Never run critical signals near board edges. • Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. SMS3.3 Final Datasheet 3/26/2019 Rev 6.0 3 4 2 5 6 Protection of Four Unidirectional Lines I/O 1 I/O 2 1 6 2 5 GND GND 3 4 I/O 3 I/O 4 www.semtech.com Page 4 of 7 Semtech Proprietary and Confidential Outline Drawing - SOT23-6L Land Pattern - SOT23-6L SMS3.3 Final Datasheet 3/26/2019 Rev 6.0 www.semtech.com Page 5 of 7 Semtech Proprietary and Confidential Marking Code 03 03 \ Tape and Reel Specification 03\ 03\ 03 03 03\ 03 User Direction of feed Ordering Information Part Number SMS3.3.TCT SMS3.3 Final Datasheet 3/26/2019 Qty per Reel 3000 Rev 6.0 Reel Size Pitch 7 Inch 4mm www.semtech.com Page 6 of 7 Semtech Proprietary and Confidential Important Notice Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. 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All rights reserved. © Semtech 2019 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com SMS3.3 Final Datasheet 3/26/2019 Rev 6.0 Page 7 of 7 Semtech Proprietary and Confidential