GHB-1104R-DR

55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-1104R-DR Features ! 3.0mmx1.0mm ! LOW ! WIDE ! IDEAL Description SMT LED, 2.0mm THICKNESS. The Super Bright Red source color devices are made with Gallium Aluminum Arsenide Red Light Emitting Diode. POWER CONSUMPTION. VIEWING ANGLE. FOR BACKLIGHT AND INDICATOR. COLORS AND LENS TYPES AVAILABLE. 3.0x1.0 mm SMD CHIP LED LAMP ! VARIOUS ! PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.15(0.006") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.2 DATE: DEC/11/2002 PAGE: 1 OF 4 Selection Guide P ar t No.. Pa No. art No D ic e ic Lens Typ L ens Ty p e ens Ty s Iv (m c d ) Iv (mc d (mcd) @ 20 mA in. Min . in Ty p.. Typ Ty p yp 60 120° Viiew in g Viewin View in Angle GHB-1104R-DR ) SUPER BRIGHT RED(GaAIAs WATER CLEAR 18 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sy ymbo ymbol peak D 1/2 C VF IR Par am et er Pa aramete P eak Wavelength D ominate Wavelength D ev i c e evic e S uper Bright Red S uper Bright Red Ty p.. Ty p yp 660 640 20 45 1.85 2.5 10 Max .. ax x U n its nit nm nm nm pF V uA Tes t Co n d it io ns Test Conditio s est s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA VR = 5V S pectral Line Half-width S uper Bright Red C apacitance Forward Voltage Reverse Current S uper Bright Red S uper Bright Red S uper Bright Red Absolute Maximum Ratings at TA=25 C P a r a m e t er Paramete Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. B S u p e r B r i g h t R ed Su uper Br ht Re uper Bright Red Brig 100 30 155 5 -40 C To +85 C Un its Unit nit mW mA mA V REV NO: V.2 DATE: DEC/11/2002 PAGE: 2 OF 4 REV NO: V.2 DATE: DEC/11/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.2 DATE: DEC/11/2002 PAGE: 4 OF 4