GHB-1206-DR

55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-1206-DR Features ! 3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. ! LOW POWER CONSUMPTION. ! WIDE VIEWING ANGLE. ! IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. ! PACKAGE Description The Super Bright Red source color devices are made with Gallium Aluminum Arsenide Red Light Emitting Diode. 3.2x1.6mm SMD CHIP LED LAMP : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.2 DATE:DEC/05/2002 PAGE: 1 OF 4 Selection Guide Par t No.. Pa No. art No Dic e ic L ens Ty p e ens Ty s Lens Typ d Iv (m c d ) Iv (mcd (mcd) @ 20 mA in. Min . in Ty p.. Typ Ty p yp 80 120° V i ew i n g Viewin Vi iewing Angle GHB-1206-DR SUPER BRIGHT RED(GaAlAs) WATER CLEAR 36 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sy ymbo ymbol peak D 1/2 C VF IR Par am et er Pa aramete P eak Wavelength D ominate Wavelength D ev i c e evic e S uper Bright Red S uper Bright Red Ty p.. Ty p yp 660 640 20 45 1.85 2.5 10 Max .. ax x U n its nit nm nm nm pF V uA Tes t Co n d it io ns Test Conditio s est s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA VR = 5V S pectral Line Half-width S uper Bright Red C apacitance Forward Voltage Reverse Current S uper Bright Red S uper Bright Red S uper Bright Red Absolute Maximum Ratings at TA=25 C P ar a m e t er Paramete Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. S u p er B r i g h t R ed Su uper Br uper Bright Red Bright Re B 100 30 155 5 -40 C To +85 C Un its Unit nit mW mA mA V REV NO: V.2 DATE:DEC/05/2002 PAGE: 2 OF 4 REV NO: V.2 DATE:DEC/05/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.2 DATE:DEC/05/2002 PAGE: 4 OF 4