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GHB-1206-R

GHB-1206-R

  • 厂商:

    GILWAY

  • 封装:

  • 描述:

    GHB-1206-R - 3.2x1.6mm SMD CHIP LED LAMP - Gilway Technical Lamp

  • 数据手册
  • 价格&库存
GHB-1206-R 数据手册
55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-1206-R Features ! 3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. ! LOW POWER CONSUMPTION. ! WIDE VIEWING ANGLE. ! IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS COLORS AND LENS TYPES AVAILABLE. ! PACKAGE Description The Hyper Red source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. 3.2x1.6mm SMD CHIP LED LAMP : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.2 DATE: DEC/05/2002 PAGE: 1 OF4 Selection Guide d Iv (m c d ) Iv (mcd (mcd) @ 20 mA in. Min . in Ty p.. Typ Ty p yp 180 120° V i ew i n g Viewin Vi iewing Angle Par t No.. Pa No. art No Dic e ic L ens Ty p e ens Ty s Lens Typ GHB-1206-R HYPERRED( InGaAlP) WATER CLEAR 70 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sy ymbo ymbol peak D 1/2 C VF IR Par am et er Pa aramete P eak Wavelength D ominate Wavelength S pectral Line Half-width C apacitance Forward Voltage Reverse Current D ev i c e evic e Hyper Red Hyper Red Hyper Red Hyper Red Hyper Red Hyper Red Ty p.. Ty p yp 640 628 27 45 1.9 2.5 10 Max .. ax x U n its nit nm nm nm pF V uA Tes t Co n d it io ns Test Conditio s est s I F =20mA I F =20mA I F =20mA VF = 0V;f=1MHz I F =20mA VR = 5V Absolute Maximum Ratings at TA=25 C P ar am e t er Paramet Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Hy p er Red yper Red y yper Re 1 70 30 1 85 5 -40 C To +85 C Un its Unit nit mW mA mA V REV NO: V.2 DATE: DEC/05/2002 PAGE: 2 OF4 REV NO: V.2 DATE: DEC/05/2002 PAGE: 3 OF4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.2 DATE: DEC/05/2002 PAGE: 4 OF4
GHB-1206-R 价格&库存

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