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GHB-1206-YG

GHB-1206-YG

  • 厂商:

    GILWAY

  • 封装:

  • 描述:

    GHB-1206-YG - 3.2x1.6mm SMD CHIP LED LAMP - Gilway Technical Lamp

  • 数据手册
  • 价格&库存
GHB-1206-YG 数据手册
55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-1206-YG Features ! 3.2mmx1.6mm SMT LED, 1.1mm THICKNESS. ! LOW ! WIDE ! IDEAL Description The Green source color devices are made with InGaAlP on GaAs substrate Light Emitting Diode. POWER CONSUMPTION. VIEWING ANGLE. FOR BACKLIGHT AND INDICATOR. COLORS AND LENS TYPES 3.2x1.6mm SMD CHIP LED LAMP ! VARIOUS AVAILABLE. ! PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.3 DATE:OCT/16/2002 PAGE: 1 OF 4 Selection Guide Par t No.. Pa No art No. Dic e ic Lens Typ L ens Ty p e ens Ty s Iv (mcd) Iv (m c d ) (mcd d @ 20 mA Miin. in . n Ty p.. Typ Ty p yp 50 120° V i ew i n g Viewin Vi iewing Angle GHB-1206-YG GREEN(InGaAlP ) WATER CLE AR 18 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sy ymbo ymbol peak D 1/2 C VF IR P a r a m e t er Pa aramete Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current Green Green Green Green Green Green D ev i c e evic e Ty p.. Ty p yp 574 570 20 15 2.1 2.5 10 Max .. ax x Un its nit nm nm nm pF V uA Tes t Co n d it io ns Test Cond ition s est s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA VR = 5V Absolute Maximum Ratings at TA=25 C P a r a m e t er Paramete Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Gr een ree reen 105 30 150 5 -40 C To +85 C Un its Unit nit mW mA mA V REV NO: V.3 DATE:OCT/16/2002 PAGE: 2 OF 4 REV NO: V.3 DATE:OCT/16/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process." Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.3 DATE:OCT/16/2002 PAGE: 4 OF 4
GHB-1206-YG 价格&库存

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