GHB-1206L-O

55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-1206L-O Features ! 3.2mmx1.6mm ! LOW ! WIDE Description SMT LED, 1.8mm THICKNESS. The Super Bright Orange source color devices are made with DH InGaAlP Emitting Diode. on GaAs substrate Light POWER CONSUMPTION. VIEWING ANGLE. FOR BACKLIGHT AND INDICATOR. 2000PCS / REEL. ! IDEAL ! PACKAGE : 3.2x1.6mm SMD CHIP LED LAMP Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. R EV NO: V.1 DATE:DEC/05/2002 PAGE: 1 OF 4 Selection Guide Par t No.. Pa No. art No Dic e ic L ens Typ e Lens Typ ens T p sy Iv (m c d ) Iv (mcd d (mcd) @ 20 mA in. Min . in Ty p.. Typ Ty p yp 700 50 ° V i ew i n g Viewin Vi iewing Angle GHB-1206L-O SUPER BRIGHT ORANGE (InGaAlP) WATER CLEAR 280 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sym ymbo ymbol peak D 1/2 C VF IR Par am et er Pa aramete P eak Wavelength D ominate Wavelength D ev i c e evic e S uper Bright Orange S uper Bright Orange Ty p.. Ty p yp 610 601 29 15 2.1 2.5 10 Max.. ax x. U n its nits nm nm nm pF V uA Tes t Co n d it io ns Test Conditio s est st s I F =20mA I F =20mA I F =20mA VF =0V;f=1MHz I F =20mA VR = 5V S pectral Line Half-width S uper Bright Orange C apacitance Forward Voltage Reverse Current S uper Bright Orange S uper Bright Orange S uper Bright Orange Absolute Maximum Ratings at TA=25 C P ar am e t er Paramet Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Sup er Briigh t Orang e Su p er B r g h Or an g u uper Bright Orang B Br 75 30 1 95 5 -40 C To +85 C Un its Unit s nit mW mA mA V R EV NO: V.1 DATE:DEC/05/2002 PAGE: 2 OF 4 R EV NO: V.1 DATE:DEC/05/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) R EV NO: V.1 DATE:DEC/05/2002 PAGE: 4 OF 4