GHB-GW40D-DR

55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-GW40D-DR Features ? SUBMINIATURE PACKAGE. ?WIDE VIEWING ANGLE. ?LONG Description The Super Bright Red source color devices are made with Gallium Aluminum Arsenide Red Light Emitting Diode. LIFE - SOLID STATE RELIABILITY. ?LOW PACKAGE PROFILE. ?PACKAGE : SUBMINIATURE SOLID STATE LAMP 1000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. REV NO: V.2 DATE: NOV/13/2002 PAGE: 1 OF 4 Selection Guide Par t No.. Pa No. art No Dic e ic Lens Typ L ens Ty p e ens Ty s Iv (m c d ) Iv (mcd) (mc d @ 20 mA Miin. in . n Ty p.. Typ Ty p yp 150 40 ° V i ew i n g Viewin Vi in iew Angle GHB-GW40D-DR SUPER BRIGHT RED (InGaAIP) RED DIFFUSED 50 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sy ymbo ymbol peak D 1/2 C VF IR P a r a m e t er Pa aramete Peak Wavelength Dominate Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current e D ev i c e evic Ty p.. Ty p yp x Max .. ax Un its nit nm nm nm pF 2 .5 10 V uA Tes t Co n d it io ns Test Cond ition s est s I F =20mA I F =20mA I F =20mA V F =0V;f =1MHz I F =20mA V R = 5V Super Bright Red Super Bright Red Super Bright Red Super Bright Red Super Bright Red Super Bright Red 660 640 20 45 1.85 Absolute Maximum Ratings at TA=25 C P ar am e t er Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Super Bright Red 100 30 155 Un its nit mW mA mA V 5 -40 C To +85 C REV NO: V.2 DATE: NOV/13/2002 PAGE: 2 OF 4 REV NO: V.2 DATE: NOV/13/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.2 DATE: NOV/13/2002 PAGE: 4 OF 4