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GHB-PLCC-YG

GHB-PLCC-YG

  • 厂商:

    GILWAY

  • 封装:

  • 描述:

    GHB-PLCC-YG - 3.5x2.8 mm SMD CHIP LED LAMP - Gilway Technical Lamp

  • 数据手册
  • 价格&库存
GHB-PLCC-YG 数据手册
55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-PLCC-YG Features ! SINGLE COLOR. ! SUITABLE FOR ALL SMT ASSEMBLY AND Description The Mega Green source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. S OLDER PROCESS. ! AVAILABLE 3.5x2.8 mm SMD CHIP LED LAMP ON TAPE AND REEL. ! IDEAL FOR BACKLIGHTING. ! PACKAGE : 1500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0 .25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.3 DATE: DEC/13/2002 PAGE: 1 OF 4 Selection Guide Par t No.. Pa No. art No Dic e ic Lens Typ L ens Ty p e ens Ty s Iv (m c d ) Iv (mc d (mcd) @ 20 mA Miin. in . n Ty p.. Typ Ty p yp 150 120° V i ew i n g Viewin Vi in iew Angle GHB-PLCC-YG MEGA GREEN (InGaAlP) WATER CLEAR 70 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C Sy m b o l Sy ymbo ymbol peak D 1/2 C VF IR P ar am e t er Pa aramete Peak Wavelength Dominate Wavelength Spectral Line Half-width C apacitance Forward Voltage Reverse Current D ev i c e evic e Mega Green Mega Green Mega Green Mega Green Mega Green Mega Green Ty p.. Ty p yp 574 568 26 20 2.1 2.5 10 Max .. ax x Un its nit nm nm nm pF V uA Tes t C o n d it io ns Test Conditions est s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA VR = 5V Absolute Maximum Ratings at TA=25 C P a r a m e t er Paramet Pa arameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating / Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Mega Green eg a Gr een Gree 1 05 30 1 50 5 -40 C To +85 C Un its Unit nit mW mA mA V REV NO: V.3 DATE: DEC/13/2002 PAGE: 2 OF 4 REV NO: V.3 DATE: DEC/13/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.3 DATE: DEC/13/2002 PAGE: 4 OF 4
GHB-PLCC-YG 价格&库存

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