123-100-2-2-09BEN

厂商：
GLENAIR(格伦尔)
封装：
描述：
123-100-2-2-09BEN - Helical Convoluted Tubing (MIL-T-81914) Natural or Black PFA, FEP, PTFE, Tefzel ...

数据手册：

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123-100-2-2-09BEN 数据手册

123-100 - Type G Series 74 Helical Convoluted Tubing (MIL-T-81914) Natural or Black PFA, FEP, PTFE, Tefzel® (ETFE) or PEEK 123-100-1-1-16 B E H Product Series Basic No. Class 1 = Standard Wall 2 = Thin Wall * Convolution 1 = Standard 2 = Close Dash No. (Table I) Material E = ETFE F = FEP K = PEEK *** Color B = Black C = Natural P = PFA T = PTFE** Jacket E = EPDM H = Hypalon® N = Neoprene V = Viton TYPE G EXTERNAL JACKET JACKET TUBING A DIA B DIA LENGTH (AS SPECIFIED IN FEET) TABLE I A INSIDE DIA MIN .181 (4.6) .273 (6.9) .306 (7.8) .359 (9.1) .427 (10.8) .480 (12.2) .603 (15.3) .725 (18.4) .860 (21.8) .970 (24.6) 1.205 (30.6) 1.437 (36.5) 1.688 (42.9) 1.937 (49.2) MINIMUM BEND RADIUS DASH FRACTIONAL NO SIZE REF 06 3/16 09 9/32 10 5/16 12 3/8 14 7/16 16 1/2 20 5/8 24 3/4 28 7/8 32 1 40 1 1/4 48 1 1/2 56 1 3/4 64 2 B DIA MAX .460 (11.7) .554 (14.1) .590 (15.0) .650 (16.5) .711 (18.1) .790 (20.1) .910 (23.1) 1.070 (27.2) 1.213 (30.8) 1.366 (34.7) 1.679 (42.6) 1.972 (50.1) 2.222 (56.4) 2.472 (62.8) MINIMUM BEND RADIUS .50 (12.7) .75 (19.1) .75 (19.1) .88 (22.4) 1.00 (25.4) 1.25 (31.8) 1.50 (38.1) 1.75 (44.5) 1.88 (47.8) 2.25 (57.2) 2.75 (69.9) 3.25 (82.6) 3.63 (92.2) 4.25 (108.0) Metric dimensions (mm) are in parentheses. * Consult factory for thin-wall, close convolution combination. ** For PTFE maximum lengths - consult factory. *** Consult factory for PEEK min/max dimensions. © 2003 Glenair, Inc. CAGE Codes 06324 Printed in U.S.A. GLENAIR, INC. • 1211 AIR WAY • GLENDALE, CA 91201-2497 • 818-247-6000 • FAX 818-500-9912 www.glenair.com E-Mail: sales@glenair.com D-9 Series 74 Convoluted Tubing

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123-100-2-2-09BEN

1. 物料型号：型号为STM32F103C8T6，是一款基于ARM Cortex-M3内核的32位微控制器。

2. 器件简介：STM32F103C8T6具有多种外设和接口，如ADC、定时器、通信接口等，并支持多种工作电压和频率。

3. 引脚分配：该芯片共有64个引脚，包括电源引脚、地引脚、I/O引脚等，具体引脚功能和分配需参考引脚图。

4. 参数特性：工作电压为2.0V至3.6V，工作频率最高72MHz，内置64KB的Flash和20KB的SRAM。

5. 功能详解：详细介绍了各外设的功能和使用方法，如ADC、通信接口等。

6. 应用信息：适用于工业控制、消费电子等多种应用场景。

7. 封装信息：采用LQFP64封装，尺寸为10x10mm。

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