G2053FC1U

G2053 Global Mixed-mode Technology Dual H-Bridge Motor Driver Features General Description „ Dual H-Bridge Motor Driver With Current Control The G2053 provides a dual-bridge motor driver solution for toys, printers, and other mechatronic applications. - „ „ „ „ „ „ „ 1 or 2 DC Motors or 1 Stepper Motor Low On-Resistance: HS + LS = 1735mΩ (Typical, 25°C) Output Current Capability (at VM = 5V, 25°C) - TSSOP-16 (FD) Package – 0.7A RMS, 1A Peak per H-Bridge – 1.4A RMS in Parallel Mode - TQFN3X3-16 and TQFN4X4-16 Package – 0.6A RMS, 1A Peak per H-Bridge – 1.2A RMS in Parallel Mode Wide Power Supply Voltage Range 2.7 to 10.8V Integrated Current Regulation Easy Pulse-Width-Modulation (PWM) Interface 1.6µA Low-Current Sleep Mode (at 5V) TSSOP-16 (FD), TQFN3X3-16 and TQFN4X4-16 Package ProtectionFeatures - VM Undervoltage Lockout (UVLO) - Overcurrent Protection (OCP) - Thermal Shutdown (TSD) - Fault Indication Pin (nFAULT) The device has two H-bridges and can drive two DC brushed motors, a bipolar stepper motor, solenoids, or other inductive loads. Each H-bridge output consists of a pair of N-channel and P-channel MOSFETs, with circuitry that regulates the winding current. With proper PCB design, each H-bridge of the G2053 can drive up to 700mA RMS (or DC) continuously, at 25°C with a VM supply of 5V. The device can support peak currents of up to 1 A per bridge. Current capability is reduced slightly at lower VM voltages. Internal shutdown functions with a fault output pin are provided for overcurrent protection, short-circuit protection, UVLO, and overtemperature. A low-power sleep mode is also provided. Applications „ „ „ „ „ „ Ordering Information Point-of-Sale Printers Video Security Cameras Office Automation Machines Gaming Machines Robotics Battery-Powered Toys ORDER NUMBER MARKING G2053FC1U G2053R41U G2053R81U G2053 2053 2053 TEMP. RANGE -40°C to +85°C TSSOP-16 (FD) -40°C to +85°C TQFN3X3-16 -40°C to +85°C TQFN4X4-16 Note: FC: TSSOP-16 (FD) R4: TQFN3X3-16 R8: TQFN4X4-16 1: Bonding Code U : Tape & Reel Green: Lead Free / Halogen Free 12 VM BISEN 6 11 NC BOUT1 7 10 BIN2 nFAULT 8 9 BIN1 TSSOP-16 (FD) BOUT2 3 BISEN 4 AIN2 5 13 BOUT2 Thermal Pad 8 GND BIN2 13 Thermal Pad AIN1 2 4 nSLEEP AOUT2 AOUT2 15 VINT 14 1 14 7 AISEN 3 6 AIN2 AISEN BIN1 AOUT1 nFAULT AIN1 15 AOUT1 16 2 5 1 BOUT1 nSLEEP 16 Pin Configuration G2053 12 VINT 11 GND 10 VM 9 NC G2053 TQFN3X3-16/TQFN4X4-16 Note: Recommend connecting the Thermal Pad to the Ground for excellent power dissipation. Ver: 0.1 Jan 19, 2018 1 PACKAGE (Green) G2053 Global Mixed-mode Technology Absolute Maximum Ratings Thermal Resistance of Junction to Ambient, (θJC) TSSOP-16 (FD). . . . . . . . . . . . . .. . . . . . . . . .TBD°C/W TQFN3X3-16 . . . . . . . . . . . . . . .. . . . . . . . . .TBD°C/W TQFN4X4-16 . . . . . . . . . . . . . . .. . . . . . . . . .TBD°C/W Operating junction temperature (TJ) . . .-40°C to 150°C Storage Temperature (Tstg) . . . . . . . . -65°C to 150°C Reflow Temperature (soldering, 10sec) . . . . . . 260°C ESD (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±2KV ESD (CDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±1KV Power supply (VM). . . . . . . . . .. . . . . . . . -0.3V to 11.8V Internal regulator (VINT). . . . . . . . . . . . . .-0.3V to 3.8V Control pins (AIN1, AIN2, BIN1, BIN2, nSLEEP, nFAULT) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Continuous phase node pins (AOUT1, AOUT2, BOUT1, BOUT2). . . . . . . . . . . . . . . -0.3V to VM+0.5V Pulsed 10µs phase node pins (AOUT1, AOUT2, BOUT1, BOUT2). . . . . . . . . . . . . . . . . . . .-1V to VM+1V Continuous shunt amplifier input pins (AISEN, BISEN). . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.5V Pulsed 10µs shunt amplifier input pins (AISEN, BISEN). . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1V to +1V Peak drive current (AOUT1, AOUT2, BOUT1, BOUT2, AISEN, BISEN) . . . . . . . . . . . . . . . . Internally limited A Thermal Resistance of Junction to Ambient, (θJA) TSSOP-16 (FD). . . . . . . . . . . . . .. . . . . . . . . .TBD°C/W TQFN3X3-16 . . . . . . . . . . . . . . .. . . . . . . . . .TBD°C/W TQFN4X4-16 . . . . . . . . . . . . . . .. . . . . . . . . .TBD°C/W Continuous Power Dissipation (TA = +25°C) TSSOP-16 (FD). . . . . . . . . . . . . . . . . . . . . . . .TBDmW TQFN3X3-16. . . . . . . . . . . . . . . . . . . . . . . . . .TBDmW TQFN4X4-16. . . . . . . . . . . . . . . . . . . . . . . . . .TBDmW Recommended Operating Conditions Power supply voltage (VM)(1). . . . . . . . . . 2.7V to 10.8V Logic level input voltage (VI). . . . . . . . . . . . .0V to 5.5V Motor RMS current (IRMS)(2) TSSOP-16 (FD). . . . . . . . . . . . . . . . . . . . . . .0 to 0.7A TQFN3X3-16/TQFN4X4-16. . . . . . . . . . . . .0 to 0.6A Applied PWM signal to AIN1, AIN2, BIN1, or BIN2 (fPWM) . . . . . . . . . . . . . . . . . . . . . . . . .0 to 200KHz Operating ambient temperature (TA) . . .-40°C to 85°C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (1) Note that when VM is below 5V, RDS(ON) increases and maximum output current is reduced. (2) Power dissipation and thermal limits must be observed. Electrical Characteristics (TA=25°C) The device is not guaranteed to function outside its operating conditions. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. PARAMETER POWER SUPPLIES (VM, VINT) VM operating voltage VM operating supply current VM sleep mode supply current SYMBOL CONDITIONS VM IVM IVMQ VM = 5V, xINx low, nSLEEP high VM = 5V, nSLEEP low Sleep time tSLEEP nSLEEP low to sleep mode Wake-up time tWAKE nSLEEP high to output transition Turn-on time tON VM > VUVLO to output transition Internal regulator voltage VINT VM > VUVLO to output transition CONTROL INPUTS (AIN1, AIN2, BIN1, BIN2, nSLEEP) xINx Input logic low voltage VIL nSLEEP xINx Input logic high voltage VIH nSLEEP Input logic hysteresis VHYS Input logic low current Input logic high current IIL IIH Pulldown resistance RPD Input deglitch time Propagation delay INx to OUTx tDEG tPROP VIN = 0V VIN = 5V xINx nSLEEP VIN = 5V Ver: 0.1 Jan 19, 2018 2 MIN TYP MAX UNIT 2.7 --- 10.8 V ----- 1.7 1.6 3 2.7 mA µA ------3 10 155 25 3.3 ------3.6 µs µs µs V 0 0 2 2.5 350 --------400 0.7 0.5 5.5 5.5 650 -1 --100 380 ----- ----150 500 575 1.2 1 50 250 750 ----- V V mV µA µA kΩ ns µs G2053 Global Mixed-mode Technology Electrical Characteristics (Continued) PARAMETER SYMBOL CONDITIONS MIN TYP MAX --- --- 0.5 V -1 --- 1 µA VM = 5V, I = 0.2A, TA = 25°C --- 817 --- VM = 2.7V, I = 0.2A, TA = 25°C --- 1140 --- VM = 5V, I = 0.2A, TA = 25°C --- 285 --- VM = 2.7V, I = 0.2A, TA = 25°C --- 382 --- -1 ------- --70 80 450 1 ------- µA ns ns ns 160 --- 200 20 240 --- mV µs ------- ----90 2.6 2.7 --- mV 1 --- --2.3 ----- A µs --150 --- 1.4 --20 ------- ms °C °C CONTROL OUTPUTS (nFAULT) Output logic low voltage VOL IO = 5mA RPULLUP = 1kΩ to 5V Output logic high leakage IOH MOTOR DRIVER OUTPUTS (AOUT1, AOUT2, BOUT1, BOUT2) High-side FET on-resistance RDS(ON) Low-side FET on-resistance RDS(ON) Off-state leakage current IOFF Output rise time tRISE Output fall time tFALL Output dead time tDEAD PWM CURRENT CONTROL (AISEN, BISEN) xISEN trip voltage Current control constant off time PROTECTION CIRCUITS VTRIP tOFF VM undervoltage lockout VUVLO VM undervoltage hysteresis VUVLO,HYS Overcurrent protection trip level Overcurrent deglitch time IOCP tDEG Overcurrent protection period Thermal shutdown temperature tOCP TTSD (1) THYS Thermal shutdown hysteresis VM = 5V VM = 5V; RL = 16Ω to GND VM = 5V; RL = 16Ω to VM Internal dead time Internal PWM constant off time VM falling; UVLO report VM rising; UVLO recovery Rising to falling threshold Die temperature, TJ Die temperature, TJ 2.7 to 10.8V PWM G2053 0.7A nSLEEP nFAULT Stepper or Brushed DC Motor Driver Mo iver Ver: 0.1 Jan 19, 2018 3 0.7A M UNIT mΩ mΩ V G2053 Global Mixed-mode Technology Pin Description PIN NAME TSSOP TQFN POWER AND GROUND TYPE FUNCTION GND 13 11 VINT 14 12 PWR Device ground Both the GND pin and device PowerPAD must be connected to ground Internal regulator (3.3 V) Internal supply voltage; bypass to GND with 2.2μF, 6.3V capacitor - VM 12 10 PWR Power supply AIN1 AIN2 16 15 14 13 I H-bridge A PWM input Controls the state of AOUT1 and AOUT2; internal pulldown BIN1 BIN2 9 10 7 8 I H-bridge B PWM input Controls the state of BOUT1 and BOUT2; internal pulldown nSLEEP 1 15 I Sleep mode input 8 6 OD Fault indication pin AISEN 3 1 O Bridge A sense AOUT1 AOUT2 2 16 4 2 O Bridge A output BISEN 6 4 O Bridge B sense BOUT1 7 5 BOUT2 5 3 O Bridge B output Connect to motor supply voltage; bypass to GND with a 10µF (minimum) capacitor rated for VM CONTROL Logic high to enable device; logic low to enter low-power sleep mode; internal pulldown STATUS nFAULT Pulled logic low with fault condition; open-drain output requires an external pullup OUTPUT Sense resistor to GND sets PWM current regulation level (see PWM Motor Drivers) Positive current is AOUT1 → AOUT2 Sense resistor to GND sets PWM current regulation level (see PWM Motor Drivers) Positive current is BOUT1 → BOUT2 Ver: 0.1 Jan 19, 2018 4 G2053 Global Mixed-mode Technology Detailed Description Overview The G2053 device is an integrated motor driver solution for brushed DC or bipolar stepper motors. The device integrates two PMOS + NMOS H-bridges and current regulation circuitry. The G2053 can be powered with a supply voltage from 2.7 to 10.8V and can provide an output current up to 700mA RMS. A simple PWM interface allows easy interfacing to the controller circuit. The current regulation is a 20µs fixed off-time slow decay. The device includes a low-power sleep mode, which lets the system save power when not driving the motor. Functional Block Diagram VM VM 10 µF Internal Reference and Regulators VINT 2.2µF VM AOUT1 Gate Drive And OCP AIN1 AIN2 BDC VM AOUT2 BIN1 BIN2 AISEN ISEN Logic VM BOUT1 Gate Drive And OCP nSLEEP BDC VM nFAULT BOUT2 OverTemp BISEN ISEN GND Ver: 0.1 Jan 19, 2018 5 Step Motor G2053 Global Mixed-mode Technology Feature Description PWM Motor Drivers The G2053 contains drivers for two full H-bridges. Figure 6 shows a block diagram of the circuitry. Figure 6. H-Bridge and Current-Chopping Circuitry Bridge Control and Decay Modes The AIN1 and AIN2 input pins control the state of the AOUT1 and AOUT2 outputs; similarly, the BIN1 and BIN2 input pins control the state of the BOUT1 and BOUT2 outputs (see Table 1). Table 1. H-Bridge Logic xIN1 xIN2 xOUT1 xOUT2 0 0 Z Z Coast / fast decay FUNCTION 0 1 L H Reverse 1 0 H L Forward 1 1 L L Brake / slow decay The inputs can also be used for PWM control of the motor speed. When controlling a winding with PWM and the drive current is interrupted, the inductive nature of the motor requires that the current must continue to flow (called recirculation current). To handle this recirculation current, the H-bridge can operate in two different states, fast decay or slow decay. In fast-decay mode, the H-bridge is disabled and recirculation current flows through the body diodes. In slow-decay mode, the motor winding is shorted by enabling both low-side FETs. To externally pulse-width modulate the bridge in fast-decay mode, the PWM signal is applied to one xIN pin while the other is held low; to use slow-decay mode, one xIN pin is held high. See Table 2 for more information. Ver: 0.1 Jan 19, 2018 6 G2053 Global Mixed-mode Technology Table 2. PWM Control of Motor Speed xIN1 xIN2 PWM 0 FUNCTION 1 PWM Forward PWM, slow decay 0 PWM Reverse PWM, fast decay PWM 1 Reverse PWM, slow decay Forward PWM, fast decay The internal current control is still enabled when applying external PWM to xIN. To disable the current control when applying external PWM, the xISEN pins should be connected directly to ground. Figure 7 show the current paths in different drive and decay modes. Figure 7. Drive and Decay Modes Current Control The current through the motor windings may be limited, or controlled, by a 20µs constant off-time PWM current regulation, or current chopping. For DC motors, current control is used to limit the start-up and stall current of the motor. For stepper motors, current control is often used at all times. When an H-bridge is enabled, current rises through the winding at a rate dependent on the DC voltage and inductance of the winding. If the current reaches the current chopping threshold, the bridge disables the current until the beginning of the next PWM cycle. Note that immediately after the output is enabled, the voltage on the xISEN pin is ignored for a fixed period of time before enabling the current sense circuitry. This blanking time is fixed at 3.75μs. The PWM chopping current is set by a comparator that compares the voltage across a current sense resistor connected to the xISEN pins with a reference voltage. The reference voltage, VTRIP, is is fixed at 200mV nominally. The chopping current is calculated as in Equation 1. ICHOP = 200mV R XISEN (1) Example: If a 1Ω sense resistor is used, the chopping current will be 200 mV / 1Ω = 200mA. Ver: 0.1 Jan 19, 2018 7 G2053 Global Mixed-mode Technology Decay Mode After the chopping current threshold is reached, the H-bridge switches to slow-decay mode. This state is held for toff (20µs) until the next cycle to turn on the high-side MOSFETs. xOUT1 xIN2 xIN1 Slow Decay In slow-decay mode, the high-side MOSFETs are turned off and both of the low-side MOSFETs are turned on. The motor current decreases while flowing in the two low-side MOSFETs until reaching its fixed off time (typically 20µs). After that, the high-side MOSFETs are enabled to increase the winding current again. Drive Current (A) I CHOP Drive Brake / Slow Decay Drive Brake / Slow Decay tDRIVE tOFF tDRIVE tOFF Figure 8. Current Chopping Operation Sleep Mode Driving nSLEEP low puts the device into a low-power sleep state. In this state, the H-bridges are disabled, all internal logic is reset, and all internal clocks are stopped. All inputs are ignored until nSLEEP returns inactive high. When returning from sleep mode, some time, tWAKE, needs to pass before the motor driver becomes fully operational. To make the board design simple, the nSLEEP can be pulled up to the supply (VM). GMT recommends to use a pullup resistor when this is done. This resistor limits the current to the input in case VM is higher than 6.5V. Internally, the nSLEEP pin has a 500kΩ resistor to GND. It also has a clamping Zener diode that clamps the voltage at the pin at 6.5V. Currents greater than 250µA can cause damage to the input structure. Therefore, GMT recommends a pullup resistor between 20 to 75kΩ. Ver: 0.1 Jan 19, 2018 8 G2053 Global Mixed-mode Technology Parallel Mode The two H-bridges in the G2053 can be connected in parallel for double the current of a single H-bridge. The internal dead time in the G2053 prevents any risk of cross-conduction (shoot-through) between the two bridges due to timing differences between the two bridges. Figure 9 shows the connections. VM 12 10µF 16 AIN1 15 AIN2 9 BIN1 10 BIN2 IN1 IN2 VM AOUT1 AOUT2 BOUT1 BOUT2 PPAD GND 1 nSLEEP 8 nFAULT 14 VINT nSLEEP nFAULT NC 11 2 4 7 5 BDC 3 6 13 2.2µF AISEN BISEN + Figure 9. Parallel Mode Schematic Protection Circuits The G2053 is fully protected against overcurrent, overtemperature, and undervoltage events. Overcurrent Protection (OCP) An analog current limit (IOCP) circuit on each FET limits the current through the FET by limiting the gate drive. If this analog current limit persists for longer than the OCP deglitch time (tDEG), all FETs in the H-bridge are disabled and the nFAULT pin is driven low. The driver is re-enabled after the OCP retry period (tOCP) has passed. nFAULT becomes high again after the retry time. If the fault condition is still present, the cycle repeats. If the fault is no longer present, normal operation resumes and nFAULT remains deasserted. Note that only the H-bridge in which the OCP is detected will be disabled while the other bridge functions normally. Overcurrent conditions are detected independently on both high-side and low-side devices; a short to ground, supply, or across the motor winding all result in an overcurrent shutdown. Note that overcurrent protection does not use the current sense circuitry used for PWM current control, so it functions even without presence of the xISEN resistors. Thermal Shutdown (TSD) If the die temperature exceeds safe limits, all FETs in the H-bridge are disabled and the nFAULT pin is driven low. After the die temperature has fallen below the specified hysteresis (THYS), operation automatically resumes. The nFAULT pin is released after operation has resumed. UVLO If at any time the voltage on the VM pin falls below the UVLO threshold voltage, VUVLO, all circuitry in the device is disabled, and all internal logic is reset. Operation resumes when VM rises above the UVLO threshold. The nFAULT pin is not driven low during an undervoltage condition. Ver: 0.1 Jan 19, 2018 9 G2053 Global Mixed-mode Technology Table 3. Device Protection Fault VM undervoltage (UVLO) Overcurrent (OCP) Thermal Shutdown (TSD) Condition Error Report H-Bridge Internal Circuits Recovery VM < 2.6 V IOUT > IOCP None Disabled Disabled VM > 2.7 V FAULTn Disabled Operating OCP TJ > TTSD FAULTn Disabled Operating TJ < TTSD – THYS Device Functional Modes The G2053 is active unless the nSLEEP pin is brought logic low. In sleep mode, the H-bridge FETs are disabled (Hi-Z). Note that tSLEEP must elapse after a falling edge on the nSLEEP pin before the device is in sleep mode. The G2053 is brought out of sleep mode automatically if nSLEEP is brought logic high. Note that tWAKE must elapse before the outputs change state after wake-up. Table 4. Modes of Operation Fault Operating Sleep mode Fault encountered Condition H-Bridge Internal Circuits nSLEEP pin high Operating Operating nSLEEP pin low Disabled Disabled Any fault condition met Disabled See Table 3 Ver: 0.1 Jan 19, 2018 10 G2053 Global Mixed-mode Technology Application and Implementation Application Information The G2053 is used in stepper or brushed DC motor control. The following design procedure can be used to configure the G2053 in a bipolar stepper motor application. Typical Application G2053 Step Motor 1Ω 1 nSLEEP 2 AOUT1 AIN2 3 AISEN VINT AIN1 4 AOUT2 5 BOUT2 6 BISEN 7 BOUT1 + 1Ω GND VM NC BIN2 8 nFAULT BIN1 15 14 13 12 2.2µF 11 10µF 10 VM 9 8 10kΩ VCC, logic supply Design Requirements Table 5 gives design input parameters for system design. Table 5. Design Parameters Design Parameter Reference Example Value Supply voltage VM 9V Motor winding resistance RL 12Ω/phase LL 10 mH/phase Motor full step angle θstep 1.8 °/step Target stepping level nm v 2 (half-stepping) Target chopping current ICHOP 200 mA Sense resistor RISEN 1Ω Motor winding inductance Target motor speed 120 rpm Detailed Design Procedure Stepper Motor Speed The first step in configuring the G2053 requires the desired motor speed and stepping level. The G2053 can support full- and half-stepping modes using the PWM interface. If the target motor speed is too high, the motor does not spin. Ensure that the motor can support the target speed. For a desired motor speed (v), microstepping level (nm), and motor full step angle (θstep), f step (step / s) = v(rpm)xn m (steps )x360° / rot Q step (° / step )x 60s / min (2) Ver: 0.1 Jan 19, 2018 11 G2053 Global Mixed-mode Technology Figure 10. Full-Step Mode Figure 11. Half-Step Mode Current Regulation The chopping current (ICHOP) is the maximum current driven through either winding. This quantity depends on the sense resistor value (RXISEN). I CHOP = 200mV R XISEN (3) Ver: 0.1 Jan 19, 2018 12 G2053 Global Mixed-mode Technology ICHOP is set by a comparator which compares the voltage across RXISEN to a reference voltage. Note that ICHOP must follow Equation 4 to avoid saturating the motor. IFS ( A ) < VM ( V ) RL (Ω) + RDS(ON) HS(Ω) + RDS( ON) LS(Ω) (4) Where VM is the motor supply voltage. RL is the motor winding resistance „ „ Power Supply Recommendations The G2053 is designed to operate from an input voltage supply (VM) range between 2.7 to 10.8V. A 10µF ceramic capacitor rated for VM must be placed as close to the G2053 as possible. Sizing Bulk Capacitance for Motor Drive Systems Bulk capacitance sizing is an important factor in motor drive system design. It depends on a variety of factors including: „ Type of power supply „ Acceptable supply voltage ripple „ Parasitic inductance in the power supply wiring „ Type of motor (brushed DC, brushless DC, stepper) „ Motor startup current „ Motor braking method The inductance between the power supply and motor drive system limits the rate current can change from the power supply. If the local bulk capacitance is too small, the system responds to excessive current demands or dumps from the motor with a change in voltage. Size the bulk capacitance to meet acceptable voltage ripple levels. The data sheet generally provides a recommended value, but system-level testing is required to determine the appropriate-sized bulk capacitor. Figure 13. Setup of Motor Drive System With External Power Supply Ver: 0.1 Jan 19, 2018 13 G2053 Global Mixed-mode Technology Layout Guidelines Bypass the VM terminal to GND using a low-ESR ceramic bypass capacitor with a recommended value of 10µF rated for VM. This capacitor should be placed as close to the VM pin as possible with a thick trace or ground plane connection to the device GND pin and PowerPAD. Bypass VINT to ground with a ceramic capacitor rated 6.3V. Place this bypassing capacitor as close to the pin as possible. Ver: 0.1 Jan 19, 2018 14 G2053 Global Mixed-mode Technology Package Information TSSOP-16 (FD) Package Taping Specification PACKAGE TSSOP-16 (FD) Ver: 0.1 Jan 19, 2018 15 Q’TY/BY REEL 3,000 ea G2053 Global Mixed-mode Technology TQFN3X3-16 Package Taping Specification PACKAGE TQFN3X3-16 Ver: 0.1 Jan 19, 2018 16 Q’TY/BY REEL 3,000 ea G2053 Global Mixed-mode Technology TQFN4X4-16 Package Taping Specification PACKAGE TQFN4X4-16 Q’TY/BY REEL 3,000 ea GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications. Ver: 0.1 Jan 19, 2018 17