G926AF1U

Global Mixed-mode Technology Inc. G926 Dual 500mA LDO Regulator Features Wide Input Voltage Range: 4.3V~6.5V IO = 500mA, VOUT1 and VOUT2 Dropout Voltage Typically 1V Output Current in Excess of 500mA Output Voltage Accuracy ±2% Quiescent Current, Typically 200µA Internal Short Circuit Current Limit Internal Over Temperature Protection General Description The G926A is a dual low dropout regulator with VOUT1 2.5V/500mA and VOUT2 3.3V/500mA, G926B is with VOUT1 1.8V/500mA and VOUT2 3.3V/500mA, G926C is with VOUT1 3.3V/500mA and VOUT2 2.5V/ 500mA and G926D is with VOUT1 3.3V/500mA and VOUT2 1.8V/500mA. The dropout voltage is typically 1V with 500mA load. A low quiescent current is typical 200µA. Familiar regulator features such as over temperature and current limit protection circuits are provided to prevent it from being damaged by abnormal operating conditions. The G926 comes in a SOP-8 and SOP-8 (FD) with power-pad package. Applications CD/DVD-ROM, CD/RW Wireless LAN Card/Keyboard/Mouse Battery-Powered Equipment XDSL Router Ordering Information ORDER NUMBER G926AP1U G926BP1U G926CP1U G926DP1U G926AF1U G926BF1U G926CF1U G926DF1U MARKING G926A G926B G926C G926D G926A G926B G926C G926D VOUT1 2.5V 1.8V 3.3V 3.3V 2.5V 1.8V 3.3V 3.3V VOUT2 3.3V 3.3V 2.5V 1.8V 3.3V 3.3V 2.5V 1.8V TEMP. RANGE -40°C~ +85°C -40°C~ +85°C -40°C~ +85°C -40°C~ +85°C -40°C~ +85°C -40°C~ +85°C -40°C~ +85°C -40°C~ +85°C PACKAGE (Pb free) SOP-8 SOP-8 SOP-8 SOP-8 SOP-8 (FD) SOP-8 (FD) SOP-8 (FD) SOP-8 (FD) Note: P1: SOP-8 F1: SOP-8 (FD) U: Tape & Reel Pin Configuration Typical Application Circuit G926 VOUT1 1 VIN VIN VIN VOUT2 2 3 4 8 7 6 5 GND GND GND GND VOUT1 1 VIN VIN VOUT2 2 3 4 G926 8 7 6 5 NC GND NC NC VIN VIN VOUT1 VOUT1 10µF 10µF G926 VOUT2 GND VOUT2 10µF SOP-8 SOP-8 (FD) Ver: 0.3 Preliminary Oct 19, 2006 TEL: 886-3-5788833 http://www.gmt.com.tw 1 Global Mixed-mode Technology Inc. Absolute Maximum Ratings (Note 1) Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Power Dissipation Internally Limited (Note2) Maximum Junction Temperature . . . . . . . . . . . .150°C Storage Temperature Range . . . .-65°C ≤ TJ ≤+150°C Reflow Temperature (soldering, 10sec) . . . . . . 260°C Thermal Resistance Junction to Ambient SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .162°C/W SOP-8(FD) . . . . . . . . . . . . . . . . . . . . . . . . . . .75°C/W Thermal Resistance Junction to Case SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31°C/W SOP-8(FD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .5°C/W Electrical Characteristics VIN =5V, IO = 500mA, CIN=1µF, COUT =1µF. All specifications apply for TA = TJ = 25°C. [Note 3] PARAMETER Input Voltage G926 Operating Conditions (Note 1) Input Voltage. . . . . . . . . . . . . . . . . . . . . . . .4.3V ~ 6.5V Temperature Range. . . . . . . . . . . . . .-40°C ≤ TA ≤85°C SYMBOL VIN G926A G926B G926C G926D G926A CONDITION MIN 4.3 2.450 1.764 3.234 3.234 3.234 3.234 2.450 1.764 ------------------550 550 ----- TYP --2.5 1.8 3.3 3.3 3.3 3.3 2.5 1.8 0.3 0.5 200 53 53 53 1 650 650 800 800 150 25 MAX 6.5 2.550 1.836 3.366 3.366 3.366 3.366 2.550 1.836 1 1 500 ------1.2 ------------- UNIT V IO = 50mA 10mA < IO < 500mA 10mA < IO < 500mA IO = 50mA Output Voltage1 VOUT1 V Output Voltage 2 VOUT2 G926B G926C V Line Regulation Load Regulation Quiescent Current Ripple Rejection Dropout Voltage Short Circuit Current Current Limit Over Temperature Threshold Over Temperature Hysterisis Vline Vload IQ PSRR VD Ishort Ilim TOT Thys G926D 4V < VIN < 6.5V, IO = 10mA 10mA < IO < 500mA VIN = 5V fi=120Hz, VP-P = 1V, VO = 3.3V fi=120Hz, VP-P = 1V, VO = 2.5V fi=120Hz, VP-P = 1V, VO = 1.8V IO=500mA VOUT1 VOUT2 VOUT1 VOUT2 % % µA dB V mA mA °C °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the G926 in SOP-8 package, θJA is 162°C/W. For in SOP-8 (FD) with power-pad package, θJA is 75°C/W. Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum, aluminum or ceramic. Ver: 0.3 Preliminary Oct 19, 2006 TEL: 886-3-5788833 http://www.gmt.com.tw 2 Global Mixed-mode Technology Inc. Pin Description PIN SOP-8 1 2,3 4 SOP-8(FD) 1 2,3 4 5,6,8 7 G926 FUNCTION NAME VOUT1 VIN VOUT2 NC GND I/O O I O I I VOUT1 output voltage 2.5V in G926A, 1.8V in G926B or 3.3V in G926C and G926D, and source up to 500mA. Input voltage VOUT2 output voltage 3.3V in G926A and G926B, 2.5V in G926C or 1.8V in G926D, and source up to 500mA. No Connection Ground also function as heat-sink. 5,6,7,8 Definitions Dropout Voltage The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. Ver: 0.3 Preliminary Oct 19, 2006 TEL: 886-3-5788833 http://www.gmt.com.tw 3 Global Mixed-mode Technology Inc. Typical Performance Characteristics (VIN=5V, CIN=1µF, COUT =1µF, TA=25°C, unless otherwise noted.) G926 Line Transient Response Line Transient Response Load Transient Response Load Transient Response Short Circuit Current 60 Ripple Rejection IL=10mA 50 Ripply Rejection(dB) 40 IL=500mA 30 20 10 0 10 100 1000 Frequency (Hz) 10000 100000 CIN=10µF; COUT =10µF IL=100mA Ver: 0.3 Preliminary Oct 19, 2006 TEL: 886-3-5788833 http://www.gmt.com.tw 4 Global Mixed-mode Technology Inc. Typical Performance Characteristics (continued) Overcurrent Protection Characteristics G926 Overcurrent Protection Characteristics Start-up Start-up Output Voltage vs. VIN 1.809 1.807 Outpur Voltage (V) 1.805 1.803 1.801 1.799 1.797 1.795 2.5 3 3.5 4 4.5 V IN ( V) 5 5.5 6 V O2 V O1 TA =25°C ; IL=10mA 3.312 3.31 3.308 3.306 3.304 3.302 3.3 3.298 3.296 3.294 Output Voltage (V) 1.802 1.801 1.800 1.799 1.798 1.797 1.796 1.795 1.794 1.793 1.792 0 100 Output Voltage vs. IL 3.31 V IN=4.0V;V O1 3.30 V IN=5.0V;V O2 3.30 V IN=4.0V;V O2 V IN=3.3V;V O1 3.29 3.29 200 300 IL ( mA) 400 3.28 500 Ver: 0.3 Preliminary Oct 19, 2006 TEL: 886-3-5788833 http://www.gmt.com.tw 5 Global Mixed-mode Technology Inc. Typical Performance Characteristics (continued) Quiescent Current vs. VIN 250 1.0 0.9 Quiescent Current (µA) 200 Dropout Voltage (V) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 2.5 3 3.5 4 4.5 VIN (V) 5 5.5 6 0.0 0 100 200 300 IL (mA) V O2 VO1 TA=25°C G926 Dropout Voltage vs. IL 150 100 TA=25°C 50 400 500 Output Voltage vs. Temperature 3.324 1.809 1.807 Output Voltage (V) 1.805 1.803 1.801 1.799 1.797 1.795 -25 -15 -5 5 15 25 35 45 55 65 75 85 G926 Max. Power Dissipation vs. PCB Top Copper Area 2.5 Max. Dissipation Power (W) 3.314 3.304 2 1.5 VIN=5V;VO2 VIN=4V;VO1 3.294 3.284 3.274 3.264 3.254 1 0.5 0 0 1 2 3 2 IL=10mA 3.244 3.234 Temperature (°C) 4 5 PCB Top Copper Area (in ) G926 Max. Power Dissipation vs. TAMB (still air) 2.5 SOP-8 Package Max. Dissipation Power (W) 2 Unit:in2 A=0.1 A=0.2 A=0.3 A=0.4 A=0.5 Recommended Minimum Footprint SOP-8/SOP-8 (FD) 1.5 A=1.0 A=1.5 A=2.0 1 A=2.5 A=3.0 A=3.5 0.5 A=4.0 A=4.5 A=5.0 0 25 35 45 55 65 TAMB (°C) 75 85 Ver: 0.3 Preliminary Oct 19, 2006 TEL: 886-3-5788833 http://www.gmt.com.tw 6 Global Mixed-mode Technology Inc. Package Information C G926 E H L D θ 7 °(4X) A2 A1 e B A y SOP-8 Package Note: 1. Package body sizes exclude mold flash and gate burrs 2. Dimension L is measured in gage plane 3. Tolerance 0.10mm unless otherwise specified 4. Controlling dimension is millimeter converted inch dimensions are not necessarily exact. 5. Followed from JEDEC MS-012 SYMBOL A A1 A2 B C D E e H L y θ MIN. 1.35 0.10 ----0.33 0.19 4.80 3.80 ----5.80 0.40 ----0° DIMENSION IN MM NOM. 1.60 ----1.45 ----------------1.27 ----------------- MAX. 1.75 0.25 ----0.51 0.25 5.00 4.00 ----6.20 1.27 0.10 8° MIN. 0.053 0.004 ----0.013 0.007 0.189 0.150 ----0.228 0.016 ----0° DIMENSION IN INCH NOM. 0.063 ----0.057 ----------------0.050 ----------------- MAX. 0.069 0.010 ----0.020 0.010 0.197 0.157 ----0.244 0.050 0.004 8° Ver: 0.3 Preliminary Oct 19, 2006 TEL: 886-3-5788833 http://www.gmt.com.tw 7 Global Mixed-mode Technology Inc. D1 G926 0.008TYP E1 E H L D θ 0.015x45º A2 0.004MAX. B A1 e A SEATING PLANE SOP-8 (FD) Package Note: 1. JEDEC Outline: MS-012 AA/E.P. Version: N/A 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not exceed .15mm (.006in) per side. 3. Dimensions “E” does not include inter-lead flash, or protrusions inter-lead flash and protrusions shall not exceed .25mm (.010in) per side. SYMBOL A A1 A2 B D E e H L θ D1 E1 DIMENSION IN MM MIN 1.35 0.00 ----0.41TYP 4.80 3.81 1.27TYP 5.80 0.41 0° --------6.20 1.27 8° 2.29 2.29 4.98 3.99 MAX 1.75 0.13 1.50 DIMENSION IN INCH MIN MAX 0.053 0.000 ----0.016TYP 0.189 0.150 0.05TYP 0.228 0.016 0° --------0.244 0.050 8° 0.090 0.090 0.196 0.157 0.069 0.005 0.059 Taping Specification PACKAGE SOP-8 SOP-8 (FD) Feed Feed Direction Typical SOP Package Orientation GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications. Q’TY/REEL 2,500 ea 2,500 ea Ver: 0.3 Preliminary Oct 19, 2006 TEL: 886-3-5788833 http://www.gmt.com.tw 8