G962-18ADJTJU

Global Mixed-mode Technology Inc. G962 2A Low Dropout Regulator with Enable Features Adjustable Output from 1.2V to 4.8V Using External Resistors 1.5V, 1.8V and 2.5V options by Setting ADJ Pin Below 0.2V Over current and over temperature protection 500mV dropout @2A Enable pin 10µA quiescent current in shutdown Output recovery mode in OTP Connect ADJ to GND for fixed output mode TO-252-5 Package General Description The G962 is a high performance positive voltage regulator designed for use in applications requiring very low dropout voltage at up to 2 Amps. Since it has superior dropout characteristics compared to regular LDOs, it can be used to supply 2.5V on motherboards or 1.5V, 1.8V on peripheral cards from the 3.3V supply thus allowing the elimination of costly heatsinks. An enable pin further reduces power dissipation while shut down. The G962 provides excellent regulation over variations in line, load and temperature. The TO-252-5 is available with 1.5V, 1.8V and 2.5V internally preset outputs that are also adjustable using external resistors. Applications Battery powered systems Motherboards Peripheral cards Set Top Boxes Notebook Computers Ordering Information ORDER NUMBER G962-15ADJTJU G962-18ADJTJU G962-25ADJTJU ORDER NUMBER (Pb free) G962-15ADJTJUf G962-18ADJTJUf G962-25ADJTJUf MARKING G962-15 G962-18 G962-25 TEMP. RANGE -40°C ~ +85°C -40°C ~ +85°C -40°C ~ +85°C PACKAGE TO-252-5 TO-252-5 TO-252-5 Note: TJ:TO-252-5 U : Tape & Reel e.g. 18 denotes the 1.8V output voltage. Pin Configuration Typical Application Circuit IENH R3 VEN VEN VIN VO G962 VEN VIN VO GND Top View 1 2 3 4 5 C1 47µF C2 100µF R1 ADJ EN VIN GND VO ADJ R2 TO-252-5 VO = Volts R2 R2=12kΩ is recommended R3 should be connected for current IENH restriction as VEN > VIN+0.3V 1.2 (R1+R2) Ver: 0.8 Preliminary Apr 01, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 1 Global Mixed-mode Technology Inc. (Note 1) Input Voltage……………………………….……………7V VEN Voltage……………………………….………VIN+0.3V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature.…..………..……150°C Storage Temperature Range…..….-65°C ≤TJ ≤ +150°C Reflow Temperature (Soldering, 10 sec)……..…260°C Thermal Resistance Junction to Ambient, (θJA) TO-252-5…………………………………………95°C/W Thermal Resistance Junction to Case, (θJC) TO-252-5…………………………………………..…..8°C/W ESD Rating (Human Body Model)……….…………2kV G962 Absolute Maximum Ratings Operation Conditions (Note 1) Input Voltage……………………………………2.2V ~7V Temperature Range……………......-40°C ≤TA ≤ +85°C Electrical Characteristics VEN=VIN, VIN =5V, IO = 0.5A, CIN = 4.7µF, COUT =10µF, TA = TJ = 25°C unless otherwise specified (Note 3) PARAMETER Output Voltage Line Regulation Load Regulation Quiescent Current Ripple Rejection Dropout Voltage Short Circuit Current Over Temperature VEN Voltage High VEN Voltage Low VEN Bias Current Low ADJ Reference Voltage ADJ Pin Threshold SYMBOL VO CONDITION VIN=VO +0.7V, IO=10mA VO+0.7V < VIN < 5.5V, IO=10mA 10mA < IO < 2A VIN=3.3V,VEN=VIN VIN=3.3V,VEN=0V fi=120Hz, 1VP-P, IO=100mA IO=2A (Note 4) Output Active Output Disabled VEN=0.4V VIN=2.2V, VADJ=VOUT, IO=10mA MIN -2 ----------------1.6 ----1.176 --- TYP VO 0.2 0.8 1.7 16 55 0.7 0.8 150 ------1.2 0.2 MAX 2 2 2 2.5 35 --0.85 ------0.4 20 1.224 --- UNIT % % % mA µA dB V A °C V V µA V V IQ VD VENH VENL IENL VREF Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is (Tjmax-TA) / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The over temperature point is guarantee by design. Definitions Dropout Voltage The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. Output Capacitor for Stable Condition The G962 can be stable for X5R MLCC capacitor larger than 10µF or POSCAP capacitor larger than 47µF. Ver: 0.8 Preliminary Apr 01, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 2 Global Mixed-mode Technology Inc. Typical Characteristics VEN=VIN, =5V, IO = 0.5A, CIN = 4.7µF, COUT =10µF, TA = TJ = 25°C (VOUT=1.8V) Line Transient Load Transient G962 Short Circuit Current Start-UP Overcurrent Protection Characteristics 70 60 Ripple Rejection (dB) 50 40 30 20 10 0 10 100 Ripple Rejection IL=1A IL=2A VIN=5V COUT=10µF Vripple=224mV 1000 10000 100000 1000000 Frequency (Hz) Ver: 0.8 Preliminary Apr 01, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 3 Global Mixed-mode Technology Inc. Typical Characteristics (continued) Max. Power Dissipation vs. PCB Top Copper Area 4.0 Max. Dissipation Power (W) G962 Max. Power Dissipation vs. TAMB (still air) ( Different PCB Top Copper Area ) 4 Unit: in2 A=0.5 A=1.0 3.5 Max. Dissipation Power (W) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 TAMB = 25°C ; Still Air 3.5 3 2.5 2 1.5 1 0.5 0 25 35 45 55 65 TAMB (°C) 75 85 A=1.5 A=2.0 A=2.5 A=3.0 A=3.5 A=4.0 A=4.5 A=5.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 2 PCB Top Copper Area (in ) Quiescent Current vs. Temperature 2.00 1.95 Quiescent Current (mA) 1.85 1.80 1.75 1.70 1.65 1.60 1.55 1.50 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature (°C) VIN=3.0V VIN=5.0V Dropout Voltage (mV) 1.90 900 800 700 600 500 400 300 200 100 0 0 Dropout Voltage vs. Temperature T=85°C T=25°C T=-25°C 0.5 1 IL (A) 1.5 2 Output Voltage vs. Temperature 1.864 IL=10mA Output Voltage (V) 1.844 Output Voltage vs. VIN 1.864 1.844 Output Voltage (V) 1.824 1.804 T=25°C IL=10mA T=85°C 1.824 VIN=5.0V 1.804 VIN=3.0V T=-25°C 1.784 1.784 1.764 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature (°C) 1.764 2.5 3 3.5 4 4.5 5 VIN (V) 5.5 6 6.5 7 Ver: 0.8 Preliminary Apr 01, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 4 Global Mixed-mode Technology Inc. Recommend Minimum Footprint G962 TO-252-5 TO-252-5 Ver: 0.8 Preliminary Apr 01, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 5 Global Mixed-mode Technology Inc. Package Information E E1 E1 L2 A F G962 D H A1 L1 e b C θ L A2 TO-252-5 (TJ) Package SYMBOL A A1 b C D E E1 e F L L1 L2 H MILLIMETER MIN. 2.19 0.89 0.64 0.46 5.36 6.35 5.21 1.27BSC 0.46 1.40 2.20 1.52 9.40 0° 0.58 1.78 2.80 2.03 10.40 4° 0.018 0.055 0.087 0.060 0.370 0° INCH MAX. 2.38 1.27 0.89 0.58 5.61 6.73 5.46 MIN. 0.086 0.035 0.025 0.018 0.211 0.250 0.205 0.050BSC MAX. 0.094 0.050 0.035 0.023 0.221 0.265 0.215 0.023 0.070 0.110 0.080 0.410 4° θ Taping Specification PACKAGE TO-252-5 Q’TY/REEL 2,500 ea Feed Direction TO -252-5 Package O rientation GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications. Ver: 0.8 Preliminary Apr 01, 2005 TEL: 886-3-5788833 http://www.gmt.com.tw 6