GSX-533111NF

SM Crystal for Bluetooth / Wireless Specifications GSX-533 Product GSX-533 Option Codes Parameters Frequency range: 12.0 ~ 44.0MHz Calibration tolerance: ±10ppm ±15ppm ±20ppm Other values (±7.5 ~ ±100ppm) ±10ppm ±15ppm ±20ppm ±30ppm Other values (±7.5 ~ ±100ppm) 1 P 2 specify 1 P 2 3 specify 1 2 3 specify Temperature stability: 5.10 (max) 3.30 (max) 0.90 (max) ACTUAL SIZE SOLDER PAD LAYOUT Operating temperature range: -10 to +60°C -20 to +70°C -30 to +80°C Other values 1.30 1.00 1.30 1 4 2 3 4 1.40 1 3 2 Storage temperature range: -40 to +85°C Circuit condition: 9pF 12pF 16pF 18pF 20pF Other values Fundamental N B D E F specify F 2.40 PAD 1 2 3 4 CONNECTION Crystal Ground & lid Crystal Ground & lid 1.60 2.20 1.60 TOP VIEW Oscillation mode: Equivalent series resistance: 40 max Scale 3:1 Frequency perturbation: ±1ppm max Ageing: ±1ppm max first year 10µW Features « « « « « Good frequency perturbation Metal lid can be grounded to minimise EMI Seam sealed for excellent long-term stability Ultra-miniature for maximum space saving Ideal for Bluetooth / Wireless applications Test drive level: Soldering condition: 260°C, 10 sec x2 max Standard. Optional - Please specify required code(s) when ordering Ordering Information Product name + option codes + frequency eg: GSX-533/111NF 16.0MHz 10/10/10/9-F GSX-533/1P3AF 26.0MHz 10/15/30/10-F Option code X (eg GSX-533/X) denotes a custom specification. ±10ppm temperature stability may not be available over -30+80°C. Check with our sales office before ordering. Available on T&R - 1k pcs per reel. Refer to our website for T&R and soldering details. Bluetooth Applications Frequency 12.0MHz 12.0MHz 15.360MHz 16.0MHz 32.0MHz Specification 9pF, C1 = 4fF ±20% 18pF, C1 = 4fF ±20% 18pF, 6.5ppm/pF typ pullability 9pF, 20ppm/pF min pullability 12pF, 20ppm/pF typ pullability IC Philips Philips CSR S. Wave Part No MA06096 MA06097 MA06098 MA05625* MA06099 GPS / Mobile Applications Frequency 13.0MHz 13.0MHz 13.0MHz 13.0MHz 16.367667MHz 24.5535MHz 26.0MHz 26.0MHz Specification 8pF, 22.5ppm/pF ±15% 8pF, 29.5ppm/pF ±10% 8.5pF, 25.5ppm/pF ±10% 11.5pF, C1 = 4.9fF ±20% 20pF, C1 = 6.0fF ±15% 32pF, C1 = 8.5fF ±15% 10pF, 18~25ppm/pF 9.5pF, 20ppm/pF min IC / Appln Part No Silicon Labs Silicon Labs Silicon Labs Infineon SiRF GPS Infineon Hitachi MA06106 MA06118 MA06119 MA06107 MA06105 MA05925 MA06108 MA06122 * Qualified for use with CSR chipset solutions. Golledge is a global supply partner for CSR Tel: +44 1460 256 100 08 Oct 2004 Fax: +44 1460 256 101 E-mail: sales@golledge.com Web: www.golledge.com Product Information Construction GSX-533 « « Ceramic body with gold-plated pads Metal lid, seam sealed Composition RoHS 2002/95/EC This product is lead-free, and is fully compliant with the RoHS directive 2002/95/EC Pb LeadFree Packaging & Handling Production quantities supplied on T & R, 1k or 3k pcs per reel. Small quantities may be supplied on tape (no reel), or in bulk. Soldering Profile °C 260 10s max Marking NNN T DC Year Code Marking type: Laser NNN = Part ID code DC = Date code in YW, as shown below Example: “zd” = 2004 week 30 Week codes: A ~ Z: weeks 1 to 26 a ~ z: weeks 27 to 52 200 2001 2002 2003 2004 2005 2006 2007 2008 Z z Z z 100 5°C/s max 5°C/s max Tape & Reel Specification 3.7 ±0.05 Preheat 140~160°C 1.50Ø 1.75 0 60~90s max Heat > 200°C 50~60s max Slow cooldown Time 4.0 2.0 0.3 Solder resistance: 260°C x 10 secs x 2. 5° ±0.05 MARK 5.5 5.5 12.0 ±0.3 1.2 8.0 3.0 120° FEED 12.4 +2.0 -0.0 1.50 20.2Ø 330Ø 13Ø 100Ø Not to scale. Dimensional tolerances ±0.1mm unless otherwise stated Tel: +44 1460 256 100 08 Oct 2004 Fax: +44 1460 256 101 E-mail: sales@golledge.com Web: www.golledge.com