GSFD0650
65V N-Channel MOSFET
Main Product Characteristics
D
D
BVDSS
65V
RDS(ON)
8.8mΩ
ID
G
50A
G
S
S
TO-252 (DPAK)
Schematic Diagram
Features and Benefits
Advanced MOSFET process technology
Ideal for high efficiency switched mode power supplies
Low on-resistance with low gate charge
Fast switching and reverse body recovery
Description
The GSFD0650 utilizes the latest techniques to achieve high cell density and low on-resistance. These
features make this device extremely efficient and reliable for use in high efficiency switch mode power
supplies and a wide variety of other applications.
Absolute Maximum Ratings (TC=25°C
Parameter
unless otherwise specified)
Symbol
Max.
Unit
Drain-Source Voltage
VDS
65
V
Gate-Source Voltage
VGS
±20
V
Drain Current-Continuous (TC=25°C)
ID
Drain Current-Continuous (TC=100°C)
50
31.6
A
Drain Current-Pulsed1
IDM
200
A
Single Pulse Avalanche Energy2
EAS
68.5
mJ
Single Pulse Avalanche Current2
IAS
37
A
53
W
0.42
W/°C
Power Dissipation (TC=25°C)
PD
Power Dissipation-Derate above 25°C
Thermal Resistance, Junction-to-Ambient
RθJA
62
°C/W
Thermal Resistance, Junction-to-Case
RθJC
2.36
°C/W
Operating Junction Temperature Range
TJ
-55 To +150
°C
TSTG
-55 To +150
°C
Storage Temperature Range
1/5
GSFD0650
65V N-Channel MOSFET
Electrical Characteristics (TJ=25°C
Parameter
Symbol
unless otherwise specified)
Conditions
Min.
Typ.
Max.
Unit
65
-
-
V
-
-
1
μA
-
-
10
μA
VGS=±20V, VDS=0V
-
-
±100
nA
VGS= 10V, ID=15A
-
7.3
8.8
VGS= 4.5V, ID=12A
-
11.3
14.7
1.2
1.6
2.5
V
-
10
-
S
-
16.6
25
-
1.8
2.7
Qgd
-
6.5
10
Turn-On Delay Time3,4
td(on)
-
10
15
3,4
tr
-
13.5
21
Turn-Off Delay Time3,4
td(off)
-
28
42
-
20
30
-
810
1210
-
320
480
-
22
35
-
0.9
-
Ω
-
-
50
A
-
-
100
A
-
-
1
V
-
30
-
nS
-
24
-
nC
On / Off Characteristics
Drain-Source Breakdown Voltage
BVDSS
VGS=0V, ID=250uA
IDSS
VDS= 60V, VGS=0V,
TJ=25°C
VDS= 48V, VGS=0V,
TJ=85°C
Drain-Source Leakage Current
Gate-Source Leakage Current
IGSS
Static Drain-Source On-Resistance
RDS(ON)
Gate Threshold Voltage
VGS(th)
Forward Transconductance
gfs
VGS=VDS, ID=250uA
VDS= 10V, IS=3A
mΩ
Dynamic and Switching Characteristics
Total Gate Charge3,4
Qg
Gate-Source Charge3,4
Qgs
Gate-Drain Charge
Rise Time
3,4
Fall Time3,4
VDS= 30V, ID=20A
VGS=10V
VDD=30V, RG=6Ω
VGS=10V, ID=20A
tf
Input Capacitance
Clss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Gate Resistance
Rg
VDS= 30V, VGS=0V,
F=1MHz
VGS=0V, VDS=0V,
F=1MHz
nC
nS
pF
Drain-Source Diode Characteristics and Maximum Ratings
Continuous Source Current
Pulsed Source Current
Diode Forward Voltage
Reverse Recovery Time3
Reverse Recovery
Charge3
IS
ISM
VG=VD=0V,
Force Current
VSD
VGS=0V, IS=1A,
TJ=25°C
trr
Qrr
VR=30V, IS=10A
di/dt=100A/μs
TJ=25°C
Note:
1.
2.
3.
4.
Repetitive rating: Pulsed width limited by maximum junction temperature.
VDD=25V, VGS=10V, L=0.1mH, IAS=37A, RG=25Ω, starting TJ=25°C.
Pulse test: pulse width ! 300us, duty cycle ! 2%.
Essentially independent of operating temperature.
2/5
GSFD0650
65V N-Channel MOSFET
Normalized On Resistance
ID, Continuous Drain Current (A)
Typical Electrical and Thermal Characteristic Curves
TC, Case Temperature (°C)
Figure 2. Normalized RDS(ON) vs. TJ
Normalized Gate Threshold Voltage
VGS, Gate to Source Voltage (V)
TJ, Junction Temperature (°C)
Figure 1. Continuous Drain Current vs. TC
Qg, Gate Charge (nC)
TJ, Junction Temperature (°C)
Figure 4. Gate Charge Waveform
Normalized Thermal Response
ID, Continuous Drain Current (A)
Figure 3. Normalized Vth vs. TJ
VDS, Drain to Source Voltage (V)
Square Wave Pulse Duration (S)
Figure 5. Normalized Transient Impedance
Figure 6. Maximum Safe Operation Area
3/5
GSFD0650
65V N-Channel MOSFET
Typical Electrical and Thermal Characteristic Curves
VDS
90%
10%
VGS
Td(on)
Tr
Ton
Tf
Td(off)
Toff
Figure 8. Gate Charge Waveform
Figure 7. Switching Time Waveform
4/5
GSFD0650
65V N-Channel MOSFET
Package Outline Dimensions
Symbol
TO-252 (DPAK)
Dimensions in Milimeters
Dimensions in Inches
Min
Max
Min
Max
A
2.200
2.400
0.087
0.094
A1
0.910
1.110
0.036
0.044
A2
0.000
0.150
0.000
0.006
B
6.400
6.800
0.252
0.268
C
0.450
0.580
0.018
0.023
C1
0.460
0.580
0.018
0.023
D
5.100
5.500
0.201
0.217
E
2.186
2.386
0.086
0.094
F
0.600
0.940
0.024
0.037
F1
0.500
0.860
0.020
0.034
L
9.400
10.400
0.370
0.409
L1
2.400
3.000
0.094
0.118
L2
5.400
6.200
0.213
0.244
L3
0.600
1.200
0.024
0.047
θ
3°
9°
3°
9°
www.goodarksemi.com
5/5
Doc.USGSFD0650xSP2.0
Feb. 2022
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