HS2F

HS2F

  • 厂商:

    GOOD-ARK(苏州固锝)

  • 封装:

  • 描述:

    HS2F - High Efficient Surface Mount Rectifiers Reverse Voltage 50 to 1000 Volts Forward Current 1.5 ...

  • 详情介绍
  • 数据手册
  • 价格&库存
HS2F 数据手册
HS2A thru HS2M High Efficient Surface Mount Rectifiers Reverse Voltage 50 to 1000 Volts Forward Current 1.5 Amperes Features Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: 250oC/10 seconds at terminals Plastic material used carries Underwriters Laboratory Classification 94V-O Mechanical Data Cases: Molded plastic Terminals: Solder plated Polarity: Indicated by cathode band Weight: 0.003 ounce, 0.093 gram Maximum Ratings and Electrical Characteristics Ratings at 25oC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20% Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current See Fig.2 Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage @ 1.5A Maximum DC reverse current at rated DC blocking voltage @ TA=25oC @ TA=100oC Symbols VRRM VRMS V DC I(AV) IFSM VF IR trr CJ TJ TSTG 50 50 -55 to +150 -55 to +150 1.0 5.0 100 75 30 H S 2A 50 35 50 H S 2B 100 70 100 H S 2D 200 140 200 H S 2F 300 210 300 1.5 H S 2G 400 280 400 H S 2J 600 420 600 H S 2K 800 560 800 H S 2M 1000 700 1000 Units Volts Volts Volts Amps 50.0 1.3 1.7 Amps Volts uA uA nS pF o Maximum reverse recovery time (Note 1) Typical junction capacitance (Note 2) Operating junction temperature range Storage temperature range Notes: C C o 1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A 2. Measured at 1 MHz and Applied Reverse Voltage of 4.0 V D.C. 165 RATINGS AND CHARACTERISTIC CURVES 166
HS2F
1. 物料型号: - 型号为DO-214AA(SMB),这是一种表面贴装的二极管封装形式。

2. 器件简介: - 该器件为玻璃钝化结芯片,适用于表面贴装应用。具有低正向电压降、低轮廓封装、内置应变消除,适合自动放置。快速开关,高效率,耐高温焊接:250°C/10秒在端子处。使用的塑料材料符合UL94V-0级。

3. 引脚分配: - 引脚为模塑塑料,端子为镀锡。

4. 参数特性: - 包括最大重复峰值反向电压、最大RMS电压、最大直流阻断电压、最大平均正向整流电流、峰值正向浪涌电流、最大瞬时正向电压、在额定直流阻断电压下的最大直流反向电流、最大反向恢复时间、典型结电容、工作结温范围和存储温度范围等参数。

5. 功能详解: - 该器件为单相、半波、60Hz、阻性或感性负载设计。对于电容性负载,电流需降低20%。提供了详细的参数表和图表,包括反向恢复时间特性和测试电路图、最大正向电流降额曲线、典型反向特性、典型瞬时正向特性、最大非重复正向浪涌电流和典型结电容等。

6. 应用信息: - 适用于需要快速开关和高效率的应用场合,如电源整流、电机驱动等。

7. 封装信息: - 封装类型为DO-214AA(SMB),这是一种小尺寸的表面贴装封装,适合自动贴装和高密度PCB布局。

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