HS3D

HS3D

  • 厂商:

    GOOD-ARK(苏州固锝)

  • 封装:

  • 描述:

    HS3D - High Efficient Surface Mount Rectifiers Reverse Voltage 50 to 1000 Volts Forward Current 3.0 ...

  • 详情介绍
  • 数据手册
  • 价格&库存
HS3D 数据手册
HS3A thru HS3M High Efficient Surface Mount Rectifiers Reverse Voltage 50 to 1000 Volts Forward Current 3.0 Amperes Features Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: 250oC/10 seconds at terminals Plastic material used carries Underwriters Laboratory Classification 94V-O Mechanical Data Cases: Molded plastic Terminals: Solder plated Polarity: Indicated by cathode band Weight: 0.009 ounce, 0.21 gram Maximum Ratings and Electrical Characteristics Ratings at 25oC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20% Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current See Fig.2 Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage @ 3.0A Maximum DC reverse current at rated DC blocking voltage @ TA=25oC @ TA=100oC Symbols VRRM VRMS V DC I(AV) IFSM VF IR trr CJ TJ TSTG 50 80 -55 to +150 -55 to +150 1.0 10.0 200 75 50 H S 3A 50 35 50 H S 3B 100 70 100 H S 3D 200 140 200 H S 3F 300 210 300 3.0 H S 3G 400 280 400 H S 3J 600 420 600 H S 3K 800 560 800 H S 3M 1000 700 1000 Units Volts Volts Volts Amps 150.0 1.3 1.7 Amps Volts uA uA nS pF o Maximum reverse recovery time (Note 1) Typical junction capacitance (Note 2) Operating junction temperature range Storage temperature range Notes: C C o 1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A 2. Measured at 1 MHz and Applied Reverse Voltage of 4.0 V D.C. 181 RATINGS AND CHARACTERISTIC CURVES 182
HS3D
1. 物料型号: - 型号包括HS3A、HS3B、HS3D、HS3F、HS3G、HS3J、HS3K和HS3M。

2. 器件简介: - 该器件为表面贴装应用的玻璃钝化结芯片。具有低正向电压降、低轮廓封装、内置应变消除,适合自动放置。快速开关,高效率。

3. 引脚分配: - 极性由阴极带表示。

4. 参数特性: - 包括最大重复峰值反向电压、最大RMS电压、最大直流阻断电压、最大平均正向整流电流、峰值正向浪涌电流、最大瞬时正向电压、在额定直流阻断电压下的最大直流反向电流、最大反向恢复时间、典型结电容和工作结温范围等。

5. 功能详解: - 器件适用于单相、半波、60Hz、电阻性或感性负载。对于电容性负载,电流需降低20%。

6. 应用信息: - 适用于需要快速开关和高效率的应用场合。

7. 封装信息: - 封装材料为塑料,符合UL94V-0等级。封装类型为模塑塑料,引脚为镀锡。

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