MB2S

MB2S

  • 厂商:

    GOOD-ARK(苏州固锝)

  • 封装:

  • 描述:

    MB2S - Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers Reverse Voltage 200 t...

  • 详情介绍
  • 数据手册
  • 价格&库存
MB2S 数据手册
MB2S thru MB10S Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers Reverse Voltage 200 to 1000 Volts Forward Current 0.5 Ampere Features Plastic package has Underwriters Laboratory Flammability Classification 94V-0 Glass passivated chip junctions High surge overload rating: 35A peak Saves space on printed circuit boards High temperature soldering guaranteed: 260oC/10 seconds. Mechanical Data Case: Molded plastic body over passivated junctions Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Mounting Position: Any Weight: 0.078 oz., 0.22 g Package outline dimensions in inches (millimeters) Maximum Ratings and Electrical Characteristics (TA=25oC unless otherwise noted) Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward output rectified current (see Fig.1) on glass-epoxy P.C.B. on aluminum substrate Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) Rating for fusing (t < 8.3ms) Maximum instantaneous forward voltage drop per leg at 0.4A Maximum DC reverse current at rated DC blocking voltage per leg Typical thermal resistance per leg Typical junction capacitance per leg at 4.0V, 1.0MHz Operating junction and storage temperature range TA = 25oC TA = 125oC Symbols VRRM VRMS V DC IF(AV) IFSM It VF IR RθJA RθJA RθJL CJ TJ, TSTG 2 MB2S 200 140 200 MB4S 400 280 400 MB6S 600 420 600 0.5 0.8 (1) (2) MB8S 800 560 800 MB10S 1000 700 1000 Units Volts Volts Volts Amp Amps A 2 se c Volt uA o 35.0 5.0 1.0 5.0 100 85 70 20 (1) (2) (1) C/W pF o 13 -55 to +150 C Notes: 1. On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads 2. On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad 405 RATINGS AND CHARACTERISTIC CURVES (TA = 25oC unless otherwise noted) 406
MB2S
1. 物料型号: - MB2S, MB4S, MB6S, MB8S, MB10S

2. 器件简介: - 该器件为塑封体,具有UL94V-0阻燃等级,玻璃钝化芯片结,高浪涌过载能力:35A峰值,节省印刷电路板上的空间,保证260°C/10秒的高温焊接。

3. 引脚分配: - 引脚为镀层引脚,可按照MIL-STD-750, Method 2026进行焊接。

4. 参数特性: - 最大重复峰值反向电压:200V至1000V不等。 - 最大RMS电压:140V至700V不等。 - 最大直流阻断电压:200V至1000V不等。 - 最大平均正向输出整流电流:0.5A至0.8A不等。 - 峰值正向浪涌电流:35.0A。 - 额定熔断电流:5.0A2秒。 - 最大瞬时正向电压降:1.0V。 - 最大直流反向电流:5.0uA至100uA不等。 - 典型热阻:85°C/W至20°C/W不等。 - 典型结电容:13pF。

5. 功能详解: - 器件能够在高温下工作,具有高浪涌过载能力,适用于需要高可靠性和稳定性的应用。

6. 应用信息: - 适用于需要高温焊接和高浪涌电流的应用场景。

7. 封装信息: - 封装尺寸以英寸(毫米)给出,具体尺寸未在文档中详细说明。

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