MLSEP24B-0603

MLSEP*** Series Multilayer Polymer ESD Suppressor Features ESD protection for high speed data lines to IEC61000-4-2 ESD contact discharge typical 8KV, max 15KV IEC61000-4-2 ESD air discharge typical 15KV, max 25KV Multilayer structure Surface mount Extremely low capacitance Very low leakage current Fast response time Bi-directional ESD protection Lead free solder termination The best ESD protection for high frequency, low voltage applications MLSEP24B-0603 Application High Definition Multi-Media Interface (HDMI) Digital Visual Interface (DVI) Display Port Interface Unified Display Interface (UDI) MDDI Ports Gigabit Ethernet USB2.0 and IEEE1394 interface Caution: This component is designed for signal line protection only, not intended to be used under bias, not for application with a power line. Electrical Characteristics Electrical Characteristics Parameter Continuous operating voltage Trigger voltage Clamping voltage Leakage current Capacitance Operating Temperature Storage Temperature ESD pulse withstand Notes: 1, Trigger and clamping voltage measure per IEC 61000-4-2, 8KV direct discharge method Symbol VDC VT VC IL CP ----Pulses Conditions --IEC61000-4-2 8KV contact discharge IEC61000-4-2 8KV contact discharge 24V VDC VR = 0V, f = 1MHz ----IEC61000-4-2 8KV contact discharge Min -----------40 -55 2000 Typ --500 36 0.20 0.15 ------Max 24 ----10 0.3 90 150 --Units V V V nA pF ℃ ℃ --- Polymer ESD Suppressor 1 www.goodark.com MLSEP*** Series Multilayer Polymer ESD Suppressor MLSEP24B-0603 Typical PESD clamping for +8KV pulse per IEC61000-4-2 Design Recommendations for USB2.0 For USB2.0 port Design Recommendations for Antenna For antenna line Polymer ESD Suppressor 2 www.goodark.com MLSEP*** Series Multilayer Polymer ESD Suppressor Part Numbering MLSEP24B-0603 Environmental Specifications Operation temperature: -40~90℃ Moisture Resistance, Steady state: MIL-STD-833,Method 1004.7,85% RH,85℃,1000hrs Thermal Shock: MIL-STD-202,Method 107G,-55℃to150℃,30 min cycle,10 cycles. Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10HZ, 1 min. cycle, 2hrs each in X-Y-Z) Chemical Resistance: ASTM D-543, 4hrs @40℃, 3 solutions(H2O, detergent solution, deluxer ) Solder leach resistance and terminal adhesion: Per EIA-576 test Product Dimensions (mm) Length A Min Max 1.50 1.70 Width B Min Max 0.70 0.90 Height C Min Max 0.33 0.43 Terminal width D Min Max 0.40 0.50 Unit mm Recommended PAD Layout X Min 0.90 Max 1.00 Min 0.60 Y Max 0.70 Min 1.30 G Max 1.40 Unit mm Polymer ESD Suppressor 3 www.goodark.com MLSEP*** Series Multilayer Polymer ESD Suppressor Solder Reflow Recommendation MLSEP24B-0603 Item A B C D E F Notes: Process Soak Start Soak time Soak end Peak Temp. Time above Cooling Description From ambient to soak temperature and soak start Soak time Soak end From soak temperature to Peak temperature Main heating time From main heating temperature to 100℃ Reach Temp. 150℃ - 180℃ --180℃ - 200℃ 260℃ 230℃ - 260℃ 100℃ Time or Rate 2℃ - 4℃ / sec 60s - 120s --2℃ - 3℃ / sec 40s - 60s Max. 4℃ / sec 1* Peak temperature can be high to 260℃, and the recommendation time is as below at 230℃ 40s ~ 60s at 240℃ 30s ~ 40s at 260℃ 5s ~ 10s 2* Recommended reflow methods: IR, Vapor phase oven, hot air oven, wave solder. 3* Devices can be cleaned using standard industry methods and solvents. 4* Component can withstand 270℃ 10 sec. 5* If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Package Information Tape & Reel: 5000pcs per reel. Polymer ESD Suppressor 4 www.goodark.com