RMB2S

RMB2S thru RMB4S Miniature Glass Passivated Fast Recovery Surface Mount Bridge Rectifiers Reverse Voltage 200 to 400 Volts Forward Current 0.5 Ampere Features Plastic package has UL Flammability Classification 94V-0 Glass passivated chip junctions Saves space on printed circuit boards Fast recovery, low switching loss High temperature soldering guaranteed: 260oC/10 seconds at 5 lbs. (2.3kg) tension Mechanical Data Case: Molded plastic body over passivated junctions Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: Polarity symbols marked on body Mounting Position: Any Weight: 0.078 oz, 0.22g Package outline dimensions in inches (millimeters) Maximum Ratings and Electrical Characteristics (TA=25oC unless otherwise noted) Parameter Maximum repetitive peak reverse voltag Maximum RMS voltage Maximum DC blocking voltage Maximum average forward output rectified current at TA=30oC on glass-epoxy P.C.B. on aluminum substrate Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) Rating for fusing (t < 8.3ms) Maximum instantaneous forward voltage drop per leg at 0.4A Maximum DC reverse current at rated DC blocking voltage per leg TA = 25oC TA = 125oC Symbols VRRM VRMS V DC IF(AV) RMB2S 200 140 200 0.5 0.8 (1) (2) RMB4S 400 280 400 Units Volts Volts Volts Amp IFSM I2t VF IR trr RθJA RθJA RθJL CJ TJ, TSTG 30.0 5.0 1.0 5.0 100 150 85 70 20 (1) (2) (1) Amps A 2 se c Volt uA nS o Maximum reverse recovery time at IF=0.5A, IR=1.0A, Irr=0.25A Typical thermal resistance per leg Typical junction capacitance per leg at 4.0V, 1.0MHz Operating junction and storage temperature range C/W pF o 13 -55 to +150 C Notes: 1. On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads 2. On aluminum substrate P.C.B. with an area of 0.8 x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad 409 RATINGS AND CHARACTERISTIC CURVES (TA = 25oC unless otherwise noted) 410