SSFP3N20

SSFP3N20 StarMOST Power MOSFET ■ ■ Extremely high dv/dt capability Low Gate Charge Qg results in Simple Drive Requirement 100% avalanche tested Gate charge minimized Very low intrinsic capacitances Very good manufacturing repeatability VDSS = 200V ID25 =2.5A RDS(ON) =1.5Ω ■ ■ ■ ■ Description StarMOS is a new generation of high voltage N–Channel enhancement mode power MOSFETs. This new technology minimises the JFET effect, increases packing density and reduces the on-resistance. StarMOS also achieves faster switching speeds through optimised gate layout with planar stripe DMOS technology. Pin1–Gate Pin2–Drain Pin1–Source Application ■ Switching application Absolute Maximum Ratings Parameter ID@Tc=25ْ C ID@Tc=100ْC IDM PD@TC=25ْC VGS EAS IAR EAR dv/dt TJ TSTG Continuous Drain Current,VGS@10V Continuous Drain Current,VGS@10V Pulsed Drain Current Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current ① ① ③ ② ① Max. 2.5 1.5 10 20 0.34 ±20 44 3.3 3.8 5.0 –25 to +150 300(1.6mm from case) 10 Ibf in(1.1N m) ● ● Units A W W/ْ C V mJ A mJ V/ns ْC Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Mounting Torque,6-32 or M3 screw Thermal Resistance Parameter RθJC RθCS RθJA Junction-to-case Case-to-Sink,Flat,Greased Surface Junction-to-Ambient Min. — － — Typ. — 0.5 — Max. 6.4 — 80 ْC/W Units 1 SSFP3N20 StarMOST Power MOSFET Electrical Characteristics @TJ=25 ْC(unless otherwise specified) Parameter V(BR)DSS RDS(on) VGS(th) gfs IDSS Drain-to-Source Breakdown Voltage Static Drain-to-Source On-resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage current Gate-to-Source Forward leakage Gate-to-Source Reverse leakage Total Gate Charge Gate-to-Source charge Gate-to-Drain("Miller") charge Turn-on Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance △V(BR)DSS/△TJ Breakdown Voltage Temp.Coefficient Min. 200 — — 2.0 0.8 — — — — — — — — — — — — Typ. — 0.27 － — － — — — — － 1.2 3.0 － － － － 4.5 Max. Units — — 1.5 4.0 — 25 250 100 -100 7.5 — — 15 25 V Test Conditions VGS=0V,ID=250μA V/ْC Reference to 25ْC,ID=1mA Ω VGS=10V,ID=1.25A V S VDS=VGS,ID=250μA VDS=10V,ID=1.25A VDS=Rated VDSS,VGS=0V μA VDS=0.8×Rated VDSS, VGS=0V,TJ=125ْC nA VGS=20V VGS=-20V IGSS Qg Qgs Qgd td(on) tr td(off) tf LD ID=3.0A nC VDD=45V VDD=50V ID=1.25A nS VGS=10V RGEN=50Ω 15 15 — RGS=50Ω LS Ciss Coss Crss Internal Source Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance － — — — 7.5 200 80 25 — — — — Between lead, 6mm(0.25in.) nH from package and center of die contact VGS=0V pF VDS=25V f=1.0MHZ See Figure 5 Source-Drain Ratings and Characteristics Parameter IS ISM VSD trr Qrr ton Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) ① Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-on Time . . Min. — — — － 0.33 Typ. — — — 290 0.9 Max. 3.3 A 8.0 2.0 － 1.4 V nS nC Units Test Conditions MOSFET symbol showing the integral reverse p-n junction diode. TJ=25ْC,IS=2.5A,VGS=0V ④ TJ=25ْC,IF=2.5A di/dt=25A/μs ④ Intrinsic turn-on time is negligible (turn-on is dominated by Ls + LD) Notes: ① Repetitive rating;pulse width limited by max.junction temperature(see figure 11) ③ ISD≤2.5A,di/dt≤140A/μS,VDD≤V(BR)DSS, TJ≤150ْ C ④ Pulse width≤80μS; duty cycle≤1% ② L =6.4mH, IAS = 3.3 A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C 2