Gunter Semiconductor GmbH Gunter
P Channel Power MOSFET
GFC9034
Chip Specification
General Description: * Advanced Process Technology * Dynamic dV/dt Rating
* 175℃ Operating Temperature * Fast Switching * Fully Avalanche Rated
Mechanical Data: D38 Dimension 3.64mm x 3.86mm Thickness: 400 µm Metallization: Top : : Al Backside : CrNiAg / Au Suggested Bonding Conditions: Die Mounting: Solder Perform 95/5 PbSn or 92.5./2.5/5 PbAgIn Source Bonding Wire: 12 mil Al Absolute Maximum Rating
Characteristics
Drain-to-Source Breakdown Voltage Static Drain-to - Source On-resistance Continuous Drain current ( in target package) Continuous Drain current ( in target package) Operation Junction Temperatre Storage Temperature @Ta=25℃
Symbol -V(BR)DSS RDS(ON) --ID@25℃ --ID@100℃ Tj
Limit
Unit
Test Conditions − VGS=0V, -ID=250µΑ − VGS=10V, - ID=11Α - VGS=10V - VGS=10V
60 0.14 18 13 -55~175 -55~175
V Ω A A ℃ ℃
TSTR
Target Device: IRF9Z34 TO-220AB
PD
88
W
@Tc=25℃
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