GLC130

Gunter Gunter Semiconductor GmbH N Channel Power MOSFET FOR LOGIC DRIVER GLC130 Chip Specification General Description: * Advanced Process Technology * Dynamic dv/dt Rating * 175℃ Operating Temperature * Fast Switching * Fully Avalanche Rated * RDS(ON) rated at VGS = 5V * Ease of parallel Mechanical Data: D13 Dimension 2.68mm x 3.75mm 400 µm Thickness: Metallization: Al Top : : CrNiAg / Au Backside : Suggested Bonding Conditions: Die Mounting: Solder Perform 95/5 PbSn or 92.5./2.5/5 PbAgIn Source Bonding Wire: 10 mil Al Absolute Maximum Rating Characteristics Drain-to-Source Breakdown Voltage Static Drain-to - Source On-resistance Continuous Drain current ( in target package) Continuous Drain current ( in target package) Operation Junction Temperature Storage Temperature @Ta=25℃ Symbol V(BR)DSS RDS(ON) ID@25℃ ID@100℃ Tj Limit Unit Test Conditions VGS=0V, ID=250µΑ VGS=5V, ID=9Α VGS= 5V VGS= 5V 100 0.16 15 11 -55~175 -55~175 V Ω A A ℃ ℃ TSTR Target Device: IRL530 TO-220AB PD 88 W @Tc=25℃