GS74108AGP-10I

GS74108ATP/J/X SOJ, TSOP, FP-BGA Commercial Temp Industrial Temp Features • Fast access time: 8, 10, 12 ns • CMOS low power operation: 120/95/85 mA at minimum cycle time • Single 3.3 V power supply • All inputs and outputs are TTL-compatible • Fully static operation • Industrial Temperature Option: –40° to 85°C • Package line up J: 400 mil, 36-pin SOJ package GJ: RoHS-compliant 400 mil, 36-pin SOJ package TP: 400 mil, 44-pin TSOP-II package GP: RoHS-compliant 400 mil, 44-pin TSOP-II package X: 6 mm x 10 mm FPBGA package GX: RoHS-compliant 6 mm x 10 mm FPBGA package • RoHS-compliant packages available A4 A3 A2 A1 A0 CE DQ1 DQ2 VDD VSS DQ3 DQ4 WE A17 A16 A15 A14 A13 512K x 8 4Mb Asynchronous SRAM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 8, 10, 12 ns 3.3 V VDD Center VDD and VSS SOJ 512K x 8-Pin Configuration 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 NC A5 A6 A7 A8 OE DQ8 DQ7 VSS VDD DQ6 DQ5 A9 A10 A11 A12 A18 NC 36-pin 400 mil SOJ Description The GS74108A is a high speed CMOS Static RAM organized as 524,288 words by 8 bits. Static design eliminates the need for external clocks or timing strobes. The GS74108A operates on a single 3.3 V power supply and all inputs and outputs are TTL-compatible. The GS74108A is available in 400 mil SOJ, 400 mil TSOP-II, and 6 mm x 10 mm FPBGA packages. FP-BGA 512K x 8 Bump Configuration (Package X) 1 2 3 4 5 6 Pin Descriptions Symbol A0–A18 DQ1–DQ8 CE WE OE VD D VSS NC Description Address input Data input/output Chip enable input Write enable input Output enable input +3.3 V power supply Ground No connect A B C D E F G H NC DQ1 DQ2 VSS VDD DQ3 DQ4 NC OE NC NC NC NC NC NC A16 A2 A1 A0 A18 A17 A13 A14 A15 A6 A5 A4 A3 A9 A10 A11 A12 A7 CE NC NC NC NC WE A8 NC DQ8 DQ7 VDD VSS DQ6 DQ5 NC 6 mm x 10 mm *All GSI Technology packages are at least 5/6 RoHS compliant. Packages listed with the additional “G” designator are 6/6 RoHS compliant. Rev: 1.07 1/2006 1/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X TSOP-II 512K x 8-Pin Configuration NC NC A4 A3 A2 A1 A0 CE DQ1 DQ2 VDD VSS DQ3 DQ4 WE A17 A16 A15 A14 A13 NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 NC NC NC A5 A6 A7 A8 OE DQ8 DQ7 VSS VDD DQ6 DQ5 A9 A10 A11 A12 A18 NC NC NC 44-pin 400 mil TSOP II Block Diagram A0 Address Input Buffer Row Decoder Memory Array A18 CE WE OE Column Decoder Control I/O Buffer DQ1 DQ8 Rev: 1.07 1/2006 2/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X Truth Table CE H L L L Note: X: “H” or “L” OE X L X H WE X H L H DQ1 to DQ8 Not Selected Read Write High Z VDD Current ISB1, ISB2 IDD Absolute Maximum Ratings Parameter Supply Voltage Input Voltage Output Voltage Allowable power dissipation Storage temperature Symbol VDD VIN VOUT PD TSTG Rating –0.5 to +4.6 –0.5 to VDD +0.5 (≤ 4.6 V max.) –0.5 to VDD +0.5 (≤ 4.6 V max.) 0.7 –55 to 150 Unit V V V W o C Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability. Recommended Operating Conditions Parameter Supply Voltage for -8/-10/-12 Input High Voltage Input Low Voltage Ambient Temperature, Commercial Range Ambient Temperature, Industrial Range Symbol VDD VIH VIL TAc TAI Min 3.0 2.0 –0.3 0 –40 Typ 3.3 — — — — Max 3.6 VDD +0.3 0.8 70 85 Unit V V V o C C o Notes: 1. Input overshoot voltage should be less than VDD +2 V and not exceed 20 ns. 2. Input undershoot voltage should be greater than –2 V and not exceed 20 ns. Rev: 1.07 1/2006 3/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X Capacitance Parameter Input Capacitance Output Capacitance Symbol CIN COUT Test Condition VIN = 0 V VOUT = 0 V Max 5 7 Unit pF pF Notes: 1. Tested at TA = 25°C, f = 1 MHz 2. These parameters are sampled and are not 100% tested. DC I/O Pin Characteristics Parameter Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage Symbol IIL ILO VOH VOL Test Conditions VIN = 0 to VDD Output High Z VOUT = 0 to VDD IOH = –4 mA ILO = +4 mA Min – 1 uA –1 uA 2.4 — Max 1 uA 1 uA — 0.4 V Power Supply Currents Parameter Symbol Test Conditions CE ≤ VIL All other inputs ≥ VIH or ≤ VIL Min. cycle time IOUT = 0 mA CE ≥ VIH All other inputs ≥ VIH or ≤VIL Min. cycle time CE ≥ VDD - 0.2V All other inputs ≥ VDD - 0.2V or ≤ 0.2V 0 to 70°C 8 ns 10 ns 12 ns 8 ns –40 to 85°C 10 ns 12 ns Operating Supply Current ID D 120 mA 95 mA 85 mA 130 mA 105 mA 95 mA Standby Current ISB1 30 mA 25 mA 22 mA 40 mA 35 mA 32 mA Standby Current ISB2 10 mA 20 mA Rev: 1.07 1/2006 4/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X AC Test Conditions Parameter Input high level Input low level Input rise time Input fall time Input reference level Output reference level Output load Conditions VIH = 2.4 V VIL = 0.4 V tr = 1 V/ns tf = 1 V/ns 1.4 V 1.4 V Fig. 1& 2 Output Load 1 DQ 50Ω VT = 1.4 V 30pF1 Output Load 2 3.3 V DQ 5pF1 589Ω 434Ω Notes: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted. 3. Output load 2 for tLZ, tHZ, tOLZ and tOHZ AC Characteristics Read Cycle Parameter Read cycle time Address access time Chip enable access time (CE) Output enable to output valid (OE) Output hold from address change Chip enable to output in low Z (CE) Output enable to output in low Z (OE) Chip disable to output in High Z (CE) Output disable to output in High Z (OE) * These parameters are sampled and are not 100% tested. Symbol tRC tAA tAC tOE tOH tLZ* tOLZ* tHZ* tOHZ* -8 Min 8 — — — 3 3 0 — — Max — 8 8 3.5 — — — 4 3.5 Min 10 — — — 3 3 0 — — -10 Max — 10 10 4 — — — 5 4 Min 12 — — — 3 3 0 — — -12 Max — 12 12 5 — — — 6 5 Unit ns ns ns ns ns ns ns ns ns Rev: 1.07 1/2006 5/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X Read Cycle 1: CE = OE = VIL, WE = VIH tRC Address tAA tOH Data Out Previous Data Data valid Read Cycle 2: WE = VIH tRC Address tAA CE tAC tLZ OE tOE Data Out tOLZ High impedance DATA VALID tHZ tOHZ Rev: 1.07 1/2006 6/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X Write Cycle Parameter Write cycle time Address valid to end of write Chip enable to end of write Data set up time Data hold time Write pulse width Address set up time Write recovery time (WE) Write recovery time (CE) Output Low Z from end of write Write to output in High Z * These parameters are sampled and are not 100% tested. Symbol tWC tAW tCW tDW tDH tWP tAS tWR tWR1 tWLZ* tWHZ* -8 Min 8 5.5 5.5 4 0 5.5 0 0 0 3 — Max — — — — — — — — — — 3.5 Min 10 7 7 5 0 7 0 0 0 3 — -10 Max — — — — — — — — — — 4 Min 12 8 8 6 0 8 0 0 0 3 — -12 Max — — — — — — — — — — 5 Unit ns ns ns ns ns ns ns ns ns ns ns Write Cycle 1: WE control tWC Address tAW OE tCW CE tAS WE tDW Data In tWHZ Data Out HIGH IMPEDANCE DATA VALID tWR tWP tDH tWLZ Rev: 1.07 1/2006 7/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X Write Cycle 2: CE control tWC Address tAW OE tAS CE tWP WE tDW Data In Data Out DATA VALID tWR1 tCW tDH HIGH IMPEDANCE 36-Pin SOJ, 400 mil Dimension in inch D L c E HE GE Symbol A A1 A2 B B1 A Dimension in mm min — 0.66 2.67 0.33 0.61 0.15 23.37 10.04 — 10.93 9.00 2.08 — 0o nom — — 2.80 0.43 0.71 0.20 23.47 10.16 1.27 11.05 9.30 — — — max 3.70 — 2.92 0.53 0.81 0.30 23.60 10.28 — 11.17 9.60 — 0.10 10o min — 0.026 0.105 0.013 0.024 0.006 0.920 0.395 — 0.430 0.354 0.082 — 0o nom — — 0.110 0.017 0.028 0.008 0.924 0.400 0.05 0.435 0.366 — — — max 0.146 — 0.115 0.021 0.032 0.012 0.929 0.405 — 0.440 0.378 — 0.004 10o 1 e c D E A A2 A1 y B B1 e Detail A Q HE GE L y Q Notes: 1. Dimension D& E do not include interlead flash. 2. Dimension B1 does not include dambar protrusion/intrusion. Rev: 1.07 1/2006 8/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X 44-Pin, 400 mil TSOP-II 44 D 23 c Dimension in inch Dimension in mm Symbol min nom max min nom max A — 0.002 0.037 0.01 — 0.721 0.396 — 0.455 0.016 — — 0 o — — 0.039 0.014 0.006 0.725 0.400 0.031 0.463 0.020 0.031 — — 0.047 — 0.041 0.018 — 0.729 0.404 — 0.471 0.024 — 0.004 5 o — 0.05 0.95 0.25 — 18.31 10.06 — 11.56 0.40 — — 0 o — — 1.00 0.35 0.15 18.41 10.16 0.80 11.76 0.50 0.80 — — 1.20 — 1.05 0.45 — 18.51 10.26 — 11.96 0.60 — 0.10 5o HE A E A1 A2 B c D E e 1 A2 e 22 B A A1 y L1 L HE L L1 Detail A Q y Q Notes: 1. Dimension D& E do not include interlead flash. 2. Dimension B does not include dambar protrusion/intrusion. 3. Controlling dimension: mm Rev: 1.07 1/2006 9/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X 6 mm x 10 mm FPBGA D Symbol A A1 Unit: mm 1.10±0.10 0.20~0.30 fb f0.30~0.40 0.36(TYP) 10.0±0.05 5.25 6.0±0.05 3.75 0.75(TYP) 0.10 E Pin A1 Index c D D1 E E1 Top View e aaa A c A1 Pin A1 Index Side View ABCDEFGH aaa fb Solder Ball 1 2 3 4 5 6 e E1 e D1 Bottom View Rev: 1.07 1/2006 10/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X Ordering Information Part Number1 GS74108ATP-8 GS74108ATP-10 GS74108ATP-12 GS74108ATP-8I GS74108ATP-10I GS74108ATP-12I GS74108AGP-8 GS74108AGP-10 GS74108AGP-12 GS74108AGP-8I GS74108AGP-10I GS74108AGP-12I GS74108AJ-8 GS74108AJ-10 GS74108AJ-12 GS74108AJ-8I GS74108AJ-10I GS74108AJ-12I GS74108AGJ-8 GS74108AGJ-10 GS74108AGJ-12 GS74108AGJ-8I GS74108AGJ-10I GS74108AGJ-12I GS74108AX-8 GS74108AX-10 GS74108AX-12 GS74108AX-8I GS74108AX-10I Package2 400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II 400 mil TSOP-II RoHS-compliant 400 mil TSOP-II RoHS-compliant 400 mil TSOP-II RoHS-compliant 400 mil TSOP-II RoHS-compliant 400 mil TSOP-II RoHS-compliant 400 mil TSOP-II RoHS-compliant 400 mil TSOP-II 400 mil SOJ 400 mil SOJ 400 mil SOJ 400 mil SOJ 400 mil SOJ 400 mil SOJ RoHS-compliant 400 mil SOJ RoHS-compliant 400 mil SOJ RoHS-compliant 400 mil SOJ RoHS-compliant 400 mil SOJ RoHS-compliant 400 mil SOJ RoHS-compliant 400 mil SOJ 6 mm x 10 mm FPBGA 6 mm x 10 mm FPBGA 6 mm x 10 mm FPBGA 6 mm x 10 mm FPBGA 6 mm x 10 mm FPBGA Access Time 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns Temp. Range Commercial Commercial Commercial Industrial Industrial Industrial Commercial Commercial Commercial Industrial Industrial Industrial Commercial Commercial Commercial Industrial Industrial Industrial Commercial Commercial Commercial Industrial Industrial Industrial Commercial Commercial Commercial Industrial Industrial Status3 MP MP MP MP MP MP PQ PQ PQ PQ PQ PQ MP MP MP MP MP MP PQ PQ PQ PQ PQ PQ MP MP MP MP MP Rev: 1.07 1/2006 11/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X Ordering Information Part Number1 GS74108AX-12I GS74108AGX-8 GS74108AGX-10 GS74108AGX-12 GS74108AGX-8I GS74108AGX-10I GS74108AGX-12I Package2 6 mm x 10 mm FPBGA RoHS-compliant 6 mm x 10 mm FPBGA RoHS-compliant 6 mm x 10 mm FPBGA RoHS-compliant 6 mm x 10 mm FPBGA RoHS-compliant 6 mm x 10 mm FPBGA RoHS-compliant 6 mm x 10 mm FPBGA RoHS-compliant 6 mm x 10 mm FPBGA Access Time 12 ns 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns Temp. Range Industrial Commercial Commercial Commercial Industrial Industrial Industrial Status3 MP PQ PQ PQ PQ PQ PQ Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. For example: GS74108ATP-8T. 2. All GSI Technology packages are at least 5/6 RoHS compliant. Packages listed with the additional “G” designator are 6/6 RoHS compliant. 3. MP = Mass Production. PQ = Pre-Qualification. Rev: 1.07 1/2006 12/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS74108ATP/J/X 4M Asynchronous Datasheet Revision History Rev. Code: Old; New 74108A_r1 74108A_r1; 74108A_r1_01 74108A_r1_01; 74108A_r1_02 74108A_r1_02; 74108A_r1_03 74108A_r1_03; 74108A_r1_04 74108A_r1_04; 74108A_r1_05 74108A_r1_05; 74108A_r1_06 74108A_r1_06; 74108A_r1_07 Types of Changes Format or Content Format/Content Content Content Content Content Content Content Content Page #/Revisions/Reason • Creation of new datasheet • Added 6 ns speed bin • Updated all power numbers • Updated Recommended Operating Conditions table on page 4 • Added 7 ns bin to entire document • Added X package • Removed 6 ns speed bin from entire document • Corrected “X” package pinout • Removed 7 ns speed bin from entire document • Updated format • Added Pb-free information for TSOP-II package • Added Pb-free information for FP-BGA package • Added RoHS-compliant information for SOJ • Changed Pb-free references to RoHS-compliant • Added status to ordering information table Rev: 1.07 1/2006 13/13 © 2001, Giga Semiconductor, Inc. Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.