GS76024AB-8I

GS76024AB BGA Commercial Temp Industrial Temp Features • Fast access time: 8, 10, 12 ns • CMOS low power operation: 260/210/180 mA at minimum cycle time • Single 3.3 V ± 0.3V power supply • All inputs and outputs are TTL-compatible • Fully static operation • Industrial Temperature Option: –40 to 85°C • Package B: 14 mm x 22 mm, 119-bump, 1.27 mm pitch BGA 256K x 24 6Mb Asynchronous SRAM 8, 10, 12 ns 3.3 V VDD Center VDD and VSS 119-bump Ball Grid Array Package Description The GS76024A is a high speed CMOS static RAM organized as 262,144 words by 24 bits. Static design eliminates the need for external clocks or timing strobes. Operating on a single 3.3 V power supply and all inputs and outputs are TTLcompatible. The GS76024A is available in a 119-bump BGA package. Block Diagram A0 Address Input A17 Column Decoder Row Decoder Memory Array CE Control WE OE I/O Buffer DQ1 DQ24 Pin Descriptions Symbol A0 to A17 WE CE VDD Description Address input Write enable input Chip enable input +3.3V power supply Symbol DQ1 to DQ24 OE VSS Description Data input/output Output enable input Ground Rev: 1.02 12/2005 1/12 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS76024AB 119-bump, 1.27 mm Pitch BGA Pad Out—Top View (Package B) 1 A B C D E F G H J K L M N P R T U NC NC DQ13 DQ14 DQ15 DQ16 DQ17 DQ18 VDD DQ19 DQ20 DQ21 DQ22 DQ23 DQ24 NC NC 2 A3 A7 NC VDD NC VDD NC VDD VSS VDD NC VDD NC VDD NC A11 A15 3 A2 A6 VDD, NC VSS VDD VSS VDD VSS VDD VSS VDD VSS VDD VSS NC A10 A14 4 A16 CE A17 VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC WE OE 5 A1 A5 VSS, NC VSS VDD VSS VDD VSS VDD VSS VDD VSS VDD VSS NC A9 A13 6 A0 A4 NC VDD NC VDD NC VDD VSS VDD NC VDD NC VDD NC A8 A12 7 NC NC DQ12 DQ11 DQ10 DQ9 DQ8 DQ7 VDD DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 NC NC Note: Bumps 3C and 5C are actually NCs but should be wired C3 = VDD and C5 = VSS to assure compatibility with future versions. Rev: 1.02 12/2005 2/12 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS76024AB Truth Table CE H L L L Note: X: “H” or “L” OE X L X H WE X H L H Mode Not selected Read Write Output disable DQ0 to DQ23 High Z Data Out Data In High Z IDD VDD Current ISB1, ISB2 Absolute Maximum Ratings Parameter Supply Voltage Input Voltage Output Voltage Allowable BGA power dissipation Storage temperature Symbol VDD VIN VOUT PD TSTG Rating –0.5 to +4.6 –0.5 to VDD +0.5 (≤ 4.6 V max.) –0.5 to VDD +0.5 (≤ 4.6 V max.) 1.5 –55 to 150 Unit V V V W o C Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability. Recommended Operating Conditions Parameter Supply Voltage for -8/10/12 Input High Voltage Input Low Voltage Ambient Temperature, Commercial Range Ambient Temperature, Industrial Range Symbol VDD VIH VIL TAc TAi Min 3.0 2.0 –0.3 0 –40 Typ 3.3 — — — — Max 3.6 VDD+0.3 0.8 70 85 Unit V V V o C C o Notes: 1. Input overshoot voltage should be less than VDD +2 V and not exceed 20 ns. 2. Input undershoot voltage should be greater than –2 V and not exceed 20 ns. Rev: 1.02 12/2005 3/12 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS76024AB Capacitance Parameter Input Capacitance I/O Capacitance Symbol CIN COUT Test Condition VIN = 0 V VOUT = 0 V Max 10 7 Unit pF pF Notes: 1. Tested at TA = 25°C, f = 1 MHz 2. These parameters are sampled and are not 100% tested DC I/O Pin Characteristics Parameter Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage Symbol IIL IOL VOH VOL Test Conditions VIN = 0 to VDD Output High Z, VOUT = 0 to VDD IOH = –4 mA IOL = +4 mA Min –2 uA –1 uA 2.4 — Max 2 uA 1 uA — 0.4 V Rev: 1.02 12/2005 4/12 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS76024AB AC Test Conditions Parameter Input high level Input low level Input rise time Input fall time Input reference level Output reference level Output load Conditions VIH = 2.4 V VIL = 0.4 V tr = 1 V/ns tf = 1 V/ns 1.4 V 1.4 V Fig. 1& 2 Output Load 1 DQ 50Ω VT = 1.4 V 30pF1 Output Load 2 3.3 V DQ 5pF1 589Ω 434Ω Notes: 1. Includes scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted 3. Output load 2 for tLZ, tHZ, tOLZ and tOHZ. Power Supply Currents Parameter Symbol Test Conditions CE ≤ VIL All other inputs ≥ VIH or ≤ VIL Min. cycle time IOUT = 0 mA CE ≥ VIH All other inputs ≥ VIH or ≤VIL Min. cycle time CE ≥ VDD - 0.2V All other inputs ≥ VDD - 0.2V or ≤ 0.2V 0 to 70°C 8 ns 10 ns 12 ns 8 ns –40 to 85°C 10 ns 12 ns Operating Supply Current IDD 260 mA 210 mA 180 mA 280 mA 230 mA 200 mA Standby Current ISB1 60 mA 50 mA 50 mA 80 mA 70 mA 70 mA Standby Current ISB2 20 mA 40 mA Rev: 1.02 12/2005 5/12 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS76024AB AC Characteristics Read Cycle Parameter Read cycle time Address access time Chip enable access time (CE) Byte enable access time (UB, LB) Output enable to output valid (OE) Output hold from address change Chip enable to output in low Z (CE) Output enable to output in low Z (OE) Byte enable to output in low Z (UB, LB) Chip disable to output in High Z (CE) Output disable to output in High Z (OE) Byte disable to output in High Z (UB, LB) * These parameters are sampled and are not 100% tested Symbol tRC tAA tAC tAB tOE tOH tLZ* tOLZ* tBLZ* tHZ* tOHZ* tBHZ* -8 Min 8 — — — — 3 3 0 0 — — — Max — 8 8 3.5 3.5 — — — — 4 3.5 3.5 Min 10 — — — — 3 3 0 0 — — — -10 Max — 10 10 4 4 — — — — 5 4 4 Min 12 — — — — 3 3 0 0 — — — -12 Max — 12 12 5 5 — — — — 6 5 5 Unit ns ns ns ns ns ns ns ns ns ns ns ns Read Cycle 1: CE = OE = VIL, WE = VIH tRC Address tAA tOH Data Out Previous Data Data valid Rev: 1.02 12/2005 6/12 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS76024AB Read Cycle 2: WE = VIH tRC Address tAA CE tAC tLZ OE tOLZ High impedance tOE Data valid tHZ tOHZ Data Out Write Cycle Parameter Write cycle time Address valid to end of write Chip enable to end of write Byte enable to end of write Data set up time Data hold time Write pulse width Address set up time Write recovery time (WE) Write recovery time (CE) Output Low Z from end of write Write to output in High Z Symbol tWC tAW tCW tBW tDW tDH tWP tAS tWR tWR1 tWLZ* tWHZ* -8 Min 8 5.5 5.5 5.5 4 0 5.5 0 0 0 3 — Max — — — — — — — — — — — 3.5 Min 10 7 7 7 4.5 0 7 0 0 0 3 — -10 Max — — — — — — — — — — — 4 Min 12 8 8 8 6 0 8 0 0 0 3 — -12 Max — — — — — — — — — — — 5 Unit ns ns ns ns ns ns ns ns ns ns ns ns * These parameters are sampled and are not 100% tested. Rev: 1.02 12/2005 7/12 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS76024AB Write Cycle 1: WE control tWC Address tAW OE tCW CE tAS WE tDW Data In tWHZ Data Out High impedance Data valid tWR tWP tDH tWLZ Write Cycle 2: CE control tWC Address tAW OE tAS CE WE tWP tDW Data In Data Out Data valid tWR1 tCW tDH High impedance Rev: 1.02 12/2005 8/12 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS76024AB Package Dimensions—119-Bump FPBGA (Package B, Variation 1) (Date Code: yyww.31) Pin #1 Corner BOTTOM VIEW A1 Ø0.10S C Ø0.30S C AS B S Ø0.60~0.90 (119x) 1 2 3 45 6 7 A B C D E F G H J K L M N P R T U Ø1.00(3x) REF 7 6 5 43 2 1 A B C D E F G H J K L M N P R T U 22±0.20 19.50 0.70 REF 12.00 B 1.27 7.62 A 0.20(4x) 14±0.20 0.90±0.10 0.15 C 0.56±0.05 Rev: 1.02 12/2005 0.50~0.70 2.06.±0.13 C SEATING PLANE 0.15 C 30 TYP. 9/12 20.32 1.27 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS76024AB Package Dimensions—119-Bump FPBGA (Package B, Variation 2) (Date Code: yyww.3H) A1 1 A B C D E F G H J K L M N P R T U TOP VIEW BOTTOM VIEW A1 Ø0.10S C Ø0.30S C AS B S Ø0.60~0.90 (119x) 2 3 4 5 6 7 7 6 5 43 2 1 A B C D E F G H J K L M N P R T U 22±0.10 B 1.27 7.62 0.15 C A 0.20(4x) 14±0.10 Rev: 1.02 12/2005 0.50~0.70 1.86.±0.13 C SEATING PLANE 10/12 20.32 1.27 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS76024AB Ordering Information Part Number1 GS76024AB-8 GS76024AB-10 GS76024AB-12 GS76024AB-8I GS76024AB-10I GS76024AB-12I Package 119-Bump BGA2 119-Bump BGA2 119-Bump BGA2 119-Bump BGA2 119-Bump BGA2 119-Bump BGA2 Access Time 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns Temp. Range Commercial Commercial Commercial Industrial Industrial Industrial Status Notes: 1. Customers requiring Tape and Reel should add the character “T” to the end of the part number. For example: GS76024AB-12T. 2. Please see pages 9 and 10 for date code information for Variation 1 and Variation 2 of the 119-bump BGA. Rev: 1.02 12/2005 11/12 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS76024AB Revision History Rev. Code: Old; New GS76024A_r1 GS76024A_r1; GS76024A_r1_01 GS76024A_r1_01; GS76024A_r1_02 Content/Format Content Types of Changes Format or Content Page/Revisions/Reason • Creation of new datasheet • Updated format • Added variation information to package mechanical • Added Variation 2 119 BGA to datasheet • Added date codes to mechanicals Rev: 1.02 12/2005 12/12 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.