GS78108AGB-12

GS78108AB BGA Commercial Temp Industrial Temp Features • Fast access time: 8, 10, 12 ns • CMOS low power operation: 240/190/170 mA at minimum cycle time • Single 3.3 V ± 0.3 V power supply • All inputs and outputs are TTL-compatible • Fully static operation • Industrial Temperature Option: –40° to 85°C • 14 mm x 22 mm, 119-bump, 1.27 mm Pitch Ball Grid Array package • RoHS-compliant package available 1M x 8 8Mb Asynchronous SRAM 8, 10, 12 ns 3.3 V VDD Symbol A0 to A19 DQ1 to DQ8 CE WE OE VDD VSS NC Pin Descriptions Description Address input Data input/output Chip enable input Write enable input Output enable input +3.3 V power supply Ground No connect Description The GS78108A is a high speed CMOS Static RAM organized as 1,048,576-words by 8-bits. Static design eliminates the need for external clocks or timing strobes. The GS78108operates on a single 3.3 V power supply, and all inputs and outputs are TTL-compatible. The GS7810A8 is available in a 14 mm x 22 mm BGA package. Block Diagram A0 Address Input Buffer Row Decoder Memory Array A19 CE WE OE Column Decoder Control I/O Buffer DQ1 DQ8 Rev: 1.04 5/2006 1/11 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS78108AB 1M x 8 Async SRAM in Bump, 14x22mm BGA—Top View (Package B) 1 A B C D E F G H J K L M N P R T U NC NC NC NC NC NC DQ1 DQ2 VDD DQ3 DQ4 NC NC NC NC NC A18 2 A15 A11 NC VDD NC VDD NC VDD VSS VDD NC VDD NC VDD NC A7 A3 3 A14 A10 VDD, NC VSS VDD VSS VDD VSS VDD VSS VDD VSS VDD VSS NC A6 A2 4 A16 CE A17 VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC WE OE 5 A13 A9 VSS, NC VSS VDD VSS VDD VSS VDD VSS VDD VSS VDD VSS NC A5 A1 6 A12 A8 NC VDD NC VDD NC VDD VSS VDD NC VDD NC VDD NC A4 A0 7 NC NC NC NC NC NC DQ5 DQ6 VDD DQ7 DQ8 NC NC NC NC NC A19 Note: Bumps 3C and 5C are actually NC’s but should be wired 3C = VDD and 5C = Vss to assure compatibility with future versions. Rev: 1.04 5/2006 2/11 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS78108AB Truth Table CE H L L L X: “H” or “L” OE X L X H WE X H L H DQ1 to DQ8 Not Selected Read Write High Z VDD Current ISB1, ISB2 — IDD — Absolute Maximum Ratings Parameter Supply Voltage Input Voltage Output Voltage Allowable power dissipation Storage temperature Symbol VDD VIN VOUT PD TSTG Rating –0.5 to +4.6 –0.5 to VDD +0.5 (≤ 4.6 V max.) –0.5 to VDD +0.5 (≤ 4.6 V max.) 1.5 –55 to 150 Unit V V V W o C Note: Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability. Recommended Operating Conditions Parameter Supply Voltage for -8/10/12 Input High Voltage Input Low Voltage Ambient Temperature, Commercial Range Ambient Temperature, Industrial Range Symbol VDD VIH VIL TAc TAi Min 3.0 2.0 –0.3 0 –40 Typ 3.3 — — — — Max 3.6 VDD +0.3 0.8 70 85 Unit V V V o C C o Notes: 1. Input overshoot voltage should be less than VDD +2 V and not exceed 20 ns. 2. Input undershoot voltage should be greater than –2 V and not exceed 20 ns. Rev: 1.04 5/2006 3/11 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS78108AB Capacitance Parameter Input Capacitance Output Capacitance Symbol CIN COUT Test Condition VIN = 0 V VOUT = 0 V Max 10 7 Unit pF pF Notes: 1. Tested at TA = 25°C, f = 1 MHz 2. These parameters are sampled and are not 100% tested DC I/O Pin Characteristics Parameter Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage Symbol IIL IOL VOH VOL Test Conditions VIN = 0 to VDD Output High Z, VOUT = 0 to VDD IOH = –4 mA IOL = +4 mA Min –2 uA –1 uA 2.4 Max 2 uA 1 uA 0.4 V Power Supply Currents Parameter Symbol Test Conditions E ≤ VIL All other inputs ≥ VIH or ≤ VIL Min. cycle time IOUT = 0 mA E ≥ VIH All other inputs ≥ VIH or ≤VIL Min. cycle time E ≥ VDD - 0.2V All other inputs ≥ VDD - 0.2V or ≤ 0.2V 0 to 70°C 8 ns 10 ns 12 ns 8 ns –40 to 85°C 10 ns 12 ns Operating Supply Current IDD 160 mA 130 mA 115 mA 180 mA 150 mA 135 mA Standby Current ISB1 60 mA 50 mA 50 mA 80 mA 70 mA 70 mA Standby Current ISB2 20 mA 40 mA Rev: 1.04 5/2006 4/11 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS78108AB AC Test Conditions Parameter Input high level Input low level Input rise time Input fall time Input reference level Output reference level Output load Conditions VIH = 2.4 V VIL = 0.4 V tr = 1 V/ns tf = 1 V/ns 1.4 V 1.4 V Fig. 1& 2 Output Load 1 DQ 50Ω VT = 1.4 V 30pF1 Output Load 2 3.3 V DQ 5pF1 589Ω 434Ω Notes: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted 3. Output load 2 for tLZ, tHZ, tOLZ and tOHZ. AC Characteristics Read Cycle Parameter Read cycle time Address access time Chip enable access time (CE) Output enable to output valid (OE) Output hold from address change Chip enable to output in low Z (CE) Output enable to output in low Z (OE) Chip disable to output in High Z (CE) Output disable to output in High Z (OE) Symbol tRC tAA tAC tOE tOH tLZ* tOLZ* tHZ* tOHZ* -8 Min 8 — — — 3 3 0 — — Max — 8 8 3.5 — — — 4 3.5 Min 10 — — — 3 3 0 — — -10 Max — 10 10 4 — — — 5 4 Min 12 — — — 3 3 0 — — -12 Max — 12 12 5 — — — 6 5 Unit ns ns ns ns ns ns ns ns ns Rev: 1.04 5/2006 5/11 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS78108AB Read Cycle 1:CE = OE = VIL tRC Address tAA tOH Data Out Previous Data Data valid * These parameters are sampled and are not 100% tested Write Cycle Parameter Write cycle time Address valid to end of write Chip enable to end of write Data set up time Data hold time Write pulse width Address set up time Write recovery time (WE) Write recovery time (CE) Output Low Z from end of write Write to output in High Z Symbol tWC tAW tCW tDW tDH tWP tAS tWR tWR1 tWLZ* tWHZ* -8 Min 8 5.5 5.5 4 0 5.5 0 0 0 3 — Max — — — — — — — — — — 3.5 Min 10 7 7 5 0 7 0 0 0 3 — -10 Max — — — — — — — — — — 4 Min 12 8 8 6 0 8 0 0 0 3 — -12 Max — — — — — — — — — — 5 Unit ns ns ns ns ns ns ns ns ns ns ns Rev: 1.04 5/2006 6/11 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS78108AB Write Cycle 1: WE Controlled tWC Address tAW OE tCW CE tAS WE tDW Data In tWHZ Data Out High impedance Data valid tWR tWP tDH tWLZ Write Cycle 2: CE Controlled tWC Address tAW OE tAS CE WE tWP tDW Data In Data Out Data valid tWR1 tCW tDH High impedance Rev: 1.04 5/2006 7/11 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS78108AB Package Dimensions—119-Bump FPBGA (Package B, Variation 1) (Date Code: yyww.31) Pin #1 Corner BOTTOM VIEW A1 Ø0.10S C Ø0.30S C AS B S Ø0.60~0.90 (119x) 1 2 3 45 6 7 A B C D E F G H J K L M N P R T U Ø1.00(3x) REF 7 6 5 43 2 1 A B C D E F G H J K L M N P R T U 22±0.20 19.50 0.70 REF 12.00 B 1.27 7.62 A 0.20(4x) 14±0.20 0.90±0.10 0.15 C 0.56±0.05 Rev: 1.04 5/2006 0.50~0.70 2.06.±0.13 C SEATING PLANE 0.15 C 30 TYP. 8/11 20.32 1.27 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS78108AB Package Dimensions—119-Bump FPBGA (Package B, Variation 2) (Date Code: yyww.3H) A1 1 A B C D E F G H J K L M N P R T U TOP VIEW BOTTOM VIEW A1 Ø0.10S C Ø0.30S C AS B S Ø0.60~0.90 (119x) 2 3 4 5 6 7 7 6 5 43 2 1 A B C D E F G H J K L M N P R T U 22±0.10 B 1.27 7.62 0.15 C A 0.20(4x) 14±0.10 Rev: 1.04 5/2006 0.50~0.70 1.86.±0.13 C SEATING PLANE 9/11 20.32 1.27 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS78108AB Ordering Information Part Number1 GS78108AB-8 GS78108AB-10 GS78108AB-12 GS78108AB-8I GS78108AB-10I GS78108AB-12I GS78108AB-15I GS78108AGB-8 Package 119-Bump BGA2 119-Bump BGA2 119-Bump BGA2 119-Bump BGA2 119-Bump BGA2 119-Bump BGA2 119-Bump BGA2 RoHS-compliant 119-Bump BGA2 RoHS-compliant 119-Bump BGA2 RoHS-compliant 119-Bump BGA2 RoHS-compliant 119-Bump BGA2 RoHS-compliant 119-Bump BGA2 RoHS-compliant 119-Bump BGA2 RoHS-compliant 119-Bump BGA2 Access Time 8 ns 10 ns 12 ns 8 ns 10 ns 12 ns 15 ns 8 ns Temp. Range Commercial Commercial Commercial Industrial Industrial Industrial Industrial Commercial Status GS78108AGB-10 10 ns Commercial GS78108AGB-12 12 ns Commercial GS78108AGB-8I 8 ns Industrial GS78108AGB-10I 10 ns Industrial GS78108AGB-12I 12 ns Industrial GS78108AGB-15I 15 ns Industrial Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. For example: GS78108AB-12T 2. Please see pages 8 and 9 for date code information for Variation 1 and Variation 2 of the 119-bump BGA. Rev: 1.04 5/2006 10/11 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS78108AB Revision History Rev. Code: Old; New GS78108AB_r1 GS78108AB_r1_01 GS78108AB_r1_01; GS78108AB_r1_02 GS78108AB_r1_02; GS78108AB_r1_03 GS78108AB_r1_03; GS78108AB_r1_04 Content Content/Format Content Content Types of Changes Format or Content Page #/Revisions/Reason • Creation of new datasheet • Added AC specifications to datasheet • Updated format • Added variation information to package mechanical • Added Variation 2 119 BGA to datasheet • Added date codes to mechanicals • Added RoHS-compliant package information Rev: 1.04 5/2006 11/11 © 2003, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.