GS8320Z18T-250I

Preliminary GS8320Z18/36T-250/225/200/166/150/133 100-Pin TQFP Commercial Temp Industrial Temp Features • NBT (No Bus Turn Around) functionality allows zero wait read-write-read bus utilization; Fully pin-compatible with both pipelined and flow through NtRAM™, NoBL™ and ZBT™ SRAMs • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply • User-configurable Pipeline and Flow Through mode • LBO pin for Linear or Interleave Burst mode • Pin compatible with 2Mb, 4Mb, 8Mb, and 16Mb devices • Byte write operation (9-bit Bytes) • 3 chip enable signals for easy depth expansion • ZZ Pin for automatic power-down • JEDEC-standard 100-lead TQFP package • Pb-Free 100-lead TQFP package available 36Mb Pipelined and Flow Through Synchronous NBT SRAMs 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Because it is a synchronous device, address, data inputs, and read/ write control inputs are captured on the rising edge of the input clock. Burst order control (LBO) must be tied to a power rail for proper operation. Asynchronous inputs include the Sleep mode enable (ZZ) and Output Enable. Output Enable can be used to override the synchronous control of the output drivers and turn the RAM's output drivers off at any time. Write cycles are internally self-timed and initiated by the rising edge of the clock input. This feature eliminates complex offchip write pulse generation required by asynchronous SRAMs and simplifies input signal timing. The GS8320Z18/36T may be configured by the user to operate in Pipeline or Flow Through mode. Operating as a pipelined synchronous device, meaning that in addition to the rising edge triggered registers that capture input signals, the device incorporates a rising-edge-triggered output register. For read cycles, pipelined SRAM output data is temporarily stored by the edge triggered output register during the access cycle and then released to the output drivers at the next rising edge of clock. The GS8320Z18/36T is implemented with GSI's high performance CMOS technology and is available in a JEDECstandard 100-pin TQFP package. Functional Description The GS8320Z18/36T is a 36Mbit Synchronous Static SRAM. GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or other pipelined read/double late write or flow through read/single late write SRAMs, allow utilization of all available bus bandwidth by eliminating the need to insert deselect cycles when the device is switched from read to write cycles. Parameter Synopsis tKQ tCycle Curr (x18) Curr (x32/x36) tKQ Flow tCycle Through Curr (x18) 2-1-1-1 Curr (x32/x36) Pipeline 3-1-1-1 -250 -225 -200 -166 -150 -133 Unit 2.5 2.7 3.0 3.5 3.8 4.0 ns 4.0 4.4 5.0 6.0 6.6 7.5 ns 285 350 6.5 6.5 205 235 265 320 7.0 7.0 195 225 245 295 7.5 7.5 185 210 220 210 185 mA 260 240 215 mA 8.0 8.5 8.5 ns 8.0 8.5 8.5 ns 175 165 155 mA 200 190 175 mA Rev: 1.03 10/2004 1/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 GS8320Z18T Pinout VDDQ VSS NC NC DQ B DQB VSS VDDQ DQ B DQB FT VDD VDD VSS DQ B DQB VDDQ VSS DQ B DQB DQPB NC VSS VDDQ NC NC NC NC NC NC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 2M x 18 10 71 Top View 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 A A E1 E2 NC NC BB BA E3 VDD VSS CK W CKE G ADV A A A A A NC NC VDDQ VSS NC DQPA DQA DQA VSS VDDQ DQA DQA VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA NC NC VSS VDDQ NC NC NC Rev: 1.03 10/2004 LBO A A A A A1 A0 NC NC VSS VDD NC A A A A A A A A 2/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 GS8320Z36T Pinout DQPC DQC DQC VDDQ VSS DQC DQC DQ C DQC VSS VDDQ DQ C DQC FT VDD VDD VSS DQ D DQD VDDQ VSS DQ D DQD DQD DQD VSS VDDQ DQD DQD DQPD 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 1M x 36 10 71 Top View 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 A A E1 E2 BD BC BB BA E3 VDD VSS CK W CKE G ADV A A A A DQPB DQB DQB VDDQ VSS DQB DQB DQB DQB VSS VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA DQA DQA VSS VDDQ DQA DQA DQPA Rev: 1.03 10/2004 LBO A A A A A1 A0 NC NC VSS VDD NC A A A A A A A A 3/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 100-Pin TQFP Pin Descriptions Symbol A 0, A 1 A CK BA BB BC BD W E1 E2 E3 G ADV CKE DQA DQB DQC DQD ZZ FT LBO VDD VSS VDDQ NC Type In In In In In In In In In In In In In In I/O I/O I/O I/O In In In In In In — Description Burst Address Inputs; Preload the burst counter Address Inputs Clock Input Signal Byte Write signal for data inputs DQA1-DQA9; active low Byte Write signal for data inputs DQB1-DQB9; active low Byte Write signal for data inputs DQC1-DQC9; active low Byte Write signal for data inputs DQD1-DQD9; active low Write Enable; active low Chip Enable; active low Chip Enable; Active High. For self decoded depth expansion Chip Enable; Active Low. For self decoded depth expansion Output Enable; active low Advance/Load; Burst address counter control pin Clock Input Buffer Enable; active low Byte A Data Input and Output pins Byte B Data Input and Output pins Byte C Data Input and Output pins Byte D Data Input and Output pins Power down control; active high Pipeline/Flow Through Mode Control; active low Linear Burst Order; active low Core power supply Ground Output driver power supply No Connect Rev: 1.03 10/2004 4/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 GS8320Z18/36 NBT SRAM Functional Block Diagram DQa–DQn FT Q Write Data K Register 1 D Write Data Write Address Burst Counter K Register 2 SA1’ SA0’ Read, Write and Data Coherency D K K Control Logic SA1 SA0 K Write Address Register 1 Match Q BC LBO BD W BA BB K FT E1 E2 ADV E3 CK Rev: 1.03 10/2004 A0–An 5/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. CKE G Write Drivers Memory Array Register 2 K Sense Amps K Preliminary GS8320Z18/36T-250/225/200/166/150/133 Functional Details Clocking Deassertion of the Clock Enable (CKE) input blocks the Clock input from reaching the RAM's internal circuits. It may be used to suspend RAM operations. Failure to observe Clock Enable set-up or hold requirements will result in erratic operation. Pipeline Mode Read and Write Operations All inputs (with the exception of Output Enable, Linear Burst Order and Sleep) are synchronized to rising clock edges. Single cycle read and write operations must be initiated with the Advance/Load pin (ADV) held low, in order to load the new address. Device activation is accomplished by asserting all three of the Chip Enable inputs (E1, E2 and E3). Deassertion of any one of the Enable inputs will deactivate the device. Function Read Write Byte “a” Write Byte “b” Write Byte “c” Write Byte “d” Write all Bytes Write Abort/NOP W H L L L L L L BA X L H H H L H BB X H L H H L H BC X H H L H L H BD X H H H L L H Read operation is initiated when the following conditions are satisfied at the rising edge of clock: CKE is asserted Low, all three chip enables (E1, E2, and E3) are active, the write enable input signals W is deasserted high, and ADV is asserted low. The address presented to the address inputs is latched in to address register and presented to the memory core and control logic. The control logic determines that a read access is in progress and allows the requested data to propagate to the input of the output register. At the next rising edge of clock the read data is allowed to propagate through the output register and onto the output pins. Write operation occurs when the RAM is selected, CKE is active, and the Write input is sampled low at the rising edge of clock. The Byte Write Enable inputs (BA, BB, BC, & BD) determine which bytes will be written. All or none may be activated. A write cycle with no Byte Write inputs active is a no-op cycle. The pipelined NBT SRAM provides double late write functionality, matching the write command versus data pipeline length (2 cycles) to the read command versus data pipeline length (2 cycles). At the first rising edge of clock, Enable, Write, Byte Write(s), and Address are registered. The Data In associated with that address is required at the third rising edge of clock. Flow Through Mode Read and Write Operations Operation of the RAM in Flow Through mode is very similar to operations in Pipeline mode. Activation of a Read Cycle and the use of the Burst Address Counter is identical. In Flow Through mode the device may begin driving out new data immediately after new address are clocked into the RAM, rather than holding new data until the following (second) clock edge. Therefore, in Flow Through mode the read pipeline is one cycle shorter than in Pipeline mode. Write operations are initiated in the same way, but differ in that the write pipeline is one cycle shorter as well, preserving the ability to turn the bus from reads to writes without inserting any dead cycles. While the pipelined NBT RAMs implement a double late write protocol, in Flow Through mode a single late write protocol mode is observed. Therefore, in Flow Through mode, address and control are registered on the first rising edge of clock and data in is required at the data input pins at the second rising edge of clock. Rev: 1.03 10/2004 6/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 Synchronous Truth Table Operation Read Cycle, Begin Burst Read Cycle, Continue Burst NOP/Read, Begin Burst Dummy Read, Continue Burst Write Cycle, Begin Burst Write Cycle, Continue Burst Write Abort, Continue Burst Deselect Cycle, Power Down Deselect Cycle, Power Down Deselect Cycle, Power Down Deselect Cycle Deselect Cycle, Continue Sleep Mode Clock Edge Ignore, Stall Type Address CK CKE ADV W Bx E1 E2 E3 G ZZ R B R B W B B D D D D D External Next External Next External Next Next None None None None None None Current L-H L-H L-H L-H L-H L-H L-H L-H L-H L-H L-H L-H X L-H L L L L L L L L L L L L X H L H L H L H H L L L L H X X H X H X L X X X X X L X X X X X X X L L H X X X H X X X L X L X L X X H X X L X X X H X H X H X X X X L H X X X L X L X L X X X H X L X X X L L H H X X X X X X X X X X L L L L L L L L L L L L H L DQ Q Q High-Z High-Z D D Notes 1,10 2 1,2,10 3 1,3,10 High-Z 1,2,3,10 High-Z High-Z High-Z High-Z High-Z High-Z 4 1 1 Notes: 1. Continue Burst cycles, whether read or write, use the same control inputs. A Deselect continue cycle can only be entered into if a Deselect cycle is executed first. 2. Dummy Read and Write abort can be considered NOPs because the SRAM performs no operation. A Write abort occurs when the W pin is sampled low but no Byte Write pins are active so no write operation is performed. 3. G can be wired low to minimize the number of control signals provided to the SRAM. Output drivers will automatically turn off during write cycles. 4. If CKE High occurs during a pipelined read cycle, the DQ bus will remain active (Low Z). If CKE High occurs during a write cycle, the bus will remain in High Z. 5. X = Don’t Care; H = Logic High; L = Logic Low; Bx = High = All Byte Write signals are high; Bx = Low = One or more Byte/Write signals are Low 6. All inputs, except G and ZZ must meet setup and hold times of rising clock edge. 7. Wait states can be inserted by setting CKE high. 8. This device contains circuitry that ensures all outputs are in High Z during power-up. 9. A 2-bit burst counter is incorporated. 10. The address counter is incriminated for all Burst continue cycles. Rev: 1.03 10/2004 7/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 Pipeline and Flow Through Read Write Control State Diagram D B Deselect R W D D W R R New Read B New Write W B R W R W B Burst Read D Burst Write D B Key Input Command Code Notes: 1. The Hold command (CKE Low) is not shown because it prevents any state change. ƒ Transition Current State (n) Next State (n+1) n n+1 2. W, R, B and D represent input command codes ,as indicated in the Synchronous Truth Table. n+2 n+3 Clock (CK) Command ƒ Current State ƒ Next State ƒ ƒ Current State and Next State Definition for Pipeline and Flow Through Read/Write Control State Diagram Rev: 1.03 10/2004 8/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 Pipeline Mode Data I/O State Diagram Intermediate BW High Z (Data In) D R Intermediate W Intermediate Intermediate RB Data Out (Q Valid) D Intermediate W R High Z B D Intermediate Key Input Command Code Notes: 1. The Hold command (CKE Low) is not shown because it prevents any state change. ƒ Transition Current State (n) Transition Next State (n+2) Intermediate State (N+1) 2. W, R, B, and D represent input command codes as indicated in the Truth Tables. n n+1 n+2 n+3 Clock (CK) Command ƒ Current State ƒ Intermediate State ƒ Next State ƒ Current State and Next State Definition for Pipeline Mode Data I/O State Diagram Rev: 1.03 10/2004 9/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 Flow Through Mode Data I/O State Diagram BW High Z (Data In) D R W RB Data Out (Q Valid) D W R High Z B D Key Input Command Code Notes 1. The Hold command (CKE Low) is not shown because it prevents any state change. ƒ Transition Current State (n) Next State (n+1) n n+1 2. W, R, B and D represent input command codes as indicated in the Truth Tables. n+2 n+3 Clock (CK) Command ƒ Current State ƒ Next State ƒ ƒ Current State and Next State Definition for: Pipeline and Flow Through Read Write Control State Diagram Rev: 1.03 10/2004 10/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 Burst Cycles Although NBT RAMs are designed to sustain 100% bus bandwidth by eliminating turnaround cycle when there is transition from read to write, multiple back-to-back reads or writes may also be performed. NBT SRAMs provide an on-chip burst address generator that can be utilized, if desired, to further simplify burst read or write implementations. The ADV control pin, when driven high, commands the SRAM to advance the internal address counter and use the counter generated address to read or write the SRAM. The starting address for the first cycle in a burst cycle series is loaded into the SRAM by driving the ADV pin low, into Load mode. Burst Order The burst address counter wraps around to its initial state after four addresses (the loaded address and three more) have been accessed. The burst sequence is determined by the state of the Linear Burst Order pin (LBO). When this pin is low, a linear burst sequence is selected. When the RAM is installed with the LBO pin tied high, Interleaved burst sequence is selected. See the tables below for details. Mode Pin Functions Mode Name Burst Order Control Output Register Control Power Down Control Pin Name LBO FT ZZ State L H L H or NC L or NC H Function Linear Burst Interleaved Burst Flow Through Pipeline Active Standby, IDD = ISB Note: There is a pull-up device FT pin and a pull-down device on the ZZ pin, so those input pins can be unconnected and the chip will operate in the default states as specified in the above tables. Burst Counter Sequences Linear Burst Sequence A[1:0] A[1:0] A[1:0] A[1:0] 1st address 2nd address 3rd address 4th address 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10 Interleaved Burst Sequence A[1:0] A[1:0] A[1:0] A[1:0] 1st address 2nd address 3rd address 4th address 00 01 10 11 01 00 11 10 10 11 00 01 11 10 01 00 Note: The burst counter wraps to initial state on the 5th clock. Note: The burst counter wraps to initial state on the 5th clock. BPR 1999.05.18 Rev: 1.03 10/2004 11/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 Sleep Mode During normal operation, ZZ must be pulled low, either by the user or by it’s internal pull down resistor. When ZZ is pulled high, the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM operates normally after 2 cycles of wake up time. Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of Sleep mode is dictated by the length of time the ZZ is in a high state. After entering Sleep mode, all inputs except ZZ become disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode. When the ZZ pin is driven high, ISB2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a deselect or read commands may be applied while the SRAM is recovering from Sleep mode. Sleep Mode Timing Diagram tKH tKC CK tZZR tZZS ZZ tZZH tKL Designing for Compatibility The GSI NBT SRAMs offer users a configurable selection between Flow Through mode and Pipeline mode via the FT signal found on Pin 14. Not all vendors offer this option, however most mark Pin 14 as VDD or VDDQ on pipelined parts and VSS on flow through parts. GSI NBT SRAMs are fully compatible with these sockets. Rev: 1.03 10/2004 12/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 Absolute Maximum Ratings (All voltages reference to VSS) Symbol VDD VDDQ VI/O VIN IIN IOUT PD TSTG TBIAS Note: Description Voltage on VDD Pins Voltage in VDDQ Pins Voltage on I/O Pins Voltage on Other Input Pins Input Current on Any Pin Output Current on Any I/O Pin Package Power Dissipation Storage Temperature Temperature Under Bias Value –0.5 to 4.6 –0.5 to 4.6 –0.5 to VDDQ +0.5 (≤ 4.6 V max.) –0.5 to VDD +0.5 (≤ 4.6 V max.) +/–20 +/–20 1.5 –55 to 125 –55 to 125 Unit V V V V mA mA W o o C C Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of this component. Power Supply Voltage Ranges Parameter 3.3 V Supply Voltage 2.5 V Supply Voltage 3.3 V VDDQ I/O Supply Voltage 2.5 V VDDQ I/O Supply Voltage Symbol VDD3 VDD2 VDDQ3 VDDQ2 Min. 3.0 2.3 3.0 2.3 Typ. 3.3 2.5 3.3 2.5 Max. 3.6 2.7 3.6 2.7 Unit V V V V Notes Notes: 1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. Rev: 1.03 10/2004 13/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 VDDQ3 Range Logic Levels Parameter VDD Input High Voltage VDD Input Low Voltage VDDQ I/O Input High Voltage VDDQ I/O Input Low Voltage Symbol VIH VIL VIHQ VILQ Min. 2.0 –0.3 2.0 –0.3 Typ. — — — — Max. VDD + 0.3 0.8 VDDQ + 0.3 0.8 Unit V V V V Notes 1 1 1,3 1,3 Notes: 1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. 3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V. VDDQ2 Range Logic Levels Parameter VDD Input High Voltage VDD Input Low Voltage VDDQ I/O Input High Voltage VDDQ I/O Input Low Voltage Symbol VIH VIL VIHQ VILQ Min. 0.6*VDD –0.3 0.6*VDD –0.3 Typ. — — — — Max. VDD + 0.3 0.3*VDD VDDQ + 0.3 0.3*VDD Unit V V V V Notes 1 1 1,3 1,3 Notes: 1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. 3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V. Recommended Operating Temperatures Parameter Ambient Temperature (Commercial Range Versions) Ambient Temperature (Industrial Range Versions) Symbol TA TA Min. 0 –40 Typ. 25 25 Max. 70 85 Unit °C °C Notes 2 2 Notes: 1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. Rev: 1.03 10/2004 14/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 Undershoot Measurement and Timing VIH VDD + 2.0 V VSS 50% VSS – 2.0 V 20% tKC VIL 50% VDD Overshoot Measurement and Timing 20% tKC Capacitance (TA = 25oC, f = 1 MHZ, VDD = 2.5 V) Parameter Input Capacitance Input/Output Capacitance Note: These parameters are sample tested. Symbol CIN CI/O Test conditions VIN = 0 V VOUT = 0 V Typ. 4 6 Max. 5 7 Unit pF pF AC Test Conditions Parameter Input high level Input low level Input slew rate Input reference level Output reference level Output load Conditions VDD – 0.2 V 0.2 V 1 V/ns VDDQ/2 VDDQ/2 Fig. 1 Notes: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted. 3. Device is deselected as defined by the Truth Table. Output Load 1 DQ 50Ω VDDQ/2 * Distributed Test Jig Capacitance 30pF* Rev: 1.03 10/2004 15/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 DC Electrical Characteristics Parameter Input Leakage Current (except mode pins) ZZInput Current Output Leakage Current (x36/x72) Output Leakage Current (x18) Output High Voltage Output High Voltage Output Low Voltage Symbol IIL IIN1 IOL IOL VOH2 VOH3 VOL Test Conditions VIN = 0 to VDD VDD ≥ VIN ≥ VIH 0 V ≤ VIN ≤ VIH Output Disable, VOUT = 0 to VDD Output Disable, VOUT = 0 to VDD IOH = –8 mA, VDDQ = 2.375 V IOH = –8 mA, VDDQ = 3.135 V IOL = 8 mA Min –2 uA –1 uA –1 uA –1 uA –1 uA 1.7 V 2.4 V — Max 2 uA 1 uA 100 uA 1 uA 1 uA — — 0.4 V Rev: 1.03 10/2004 16/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Operating Currents -250 Mode IDD IDDQ IDD IDDQ IDD IDDQ IDD IDDQ ISB 60 60 100 85 100 85 100 80 115 95 110 90 105 95 80 60 80 60 80 60 85 80 80 60 80 60 80 60 ISB IDD IDD 80 80 100 95 190 15 200 15 180 15 190 15 170 15 180 15 160 15 170 15 150 15 60 60 85 75 260 25 280 25 240 25 260 25 225 20 245 20 200 20 220 20 190 20 210 20 160 15 80 80 100 90 210 25 220 25 200 25 210 25 190 20 200 20 180 20 190 20 170 20 180 20 160 15 170 15 140 15 60 60 80 70 300 50 320 50 275 45 295 45 255 40 275 40 225 35 245 35 210 30 230 30 190 25 Symbol 0 to 70°C Unit 210 25 170 15 190 15 150 15 80 80 95 85 mA mA mA mA mA mA mA mA -225 0 to 70°C –40 to 85°C 0 to 70°C –40 to 85°C 0 to 70°C –40 to 85°C 0 to 70°C –40 to 85°C 0 to 70°C –40 to 85°C -200 -166 -150 -133 Rev: 1.03 10/2004 –40 to 85°C (x32/ x36) Flow Through Pipeline (x18) Flow Through Pipeline — Flow Through Pipeline — Flow Through Pipeline Parameter Test Conditions Operating Current Device Selected; All other inputs ≥VIH or ≤ VIL Output open 17/24 Standby Current ZZ ≥ VDD – 0.2 V Deselect Current Device Deselected; All other inputs ≥ VIH or ≤ VIL Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Notes: 1. IDD and IDDQ apply to any combination of VDD3, VDD2, VDDQ3, and VDDQ2 operation. 2. All parameters listed are worst case scenario. Preliminary GS8320Z18//36T-250/225/200/166/150/133 © 2001, GSI Technology Preliminary GS8320Z18/36T-250/225/200/166/150/133 AC Electrical Characteristics Parameter Clock Cycle Time Clock to Output Valid Pipeline Clock to Output Invalid Clock to Output in Low-Z Setup time Hold time Clock Cycle Time Clock to Output Valid Flow Through Clock to Output Invalid Clock to Output in Low-Z Setup time Hold time Clock HIGH Time Clock LOW Time Clock to Output in High-Z G to Output Valid G to output in Low-Z G to output in High-Z ZZ setup time ZZ hold time ZZ recovery Symbol tKC tKQ tKQX tLZ tS tH tKC tKQ tKQX tLZ1 tS tH tKH tKL tHZ1 tOE tOLZ1 tOHZ1 tZZS2 tZZH2 tZZR 1 -250 Min 4.0 — 1.5 1.5 1.2 0.2 5.5 — 3.0 3.0 1.5 0.5 1.3 1.5 1.5 — 0 — 5 1 20 Max — 2.5 — — — — — 5.5 — — — — — — 2.5 2.5 — 2.5 — — — -225 Min 4.4 — 1.5 1.5 1.3 0.3 6.0 — 3.0 3.0 1.5 0.5 1.3 1.5 1.5 — 0 — 5 1 20 Max — 2.7 — — — — — 6.0 — — — — — — 2.7 2.7 — 2.7 — — — -200 Min 5.0 — 1.5 1.5 1.4 0.4 6.5 — 3.0 3.0 1.5 0.5 1.3 1.5 1.5 — 0 — 5 1 20 Max — 3.0 — — — — — 6.5 — — — — — — 3.0 3.0 — 3.0 — — — -166 Min 6.0 — 1.5 1.5 1.5 0.5 7.0 — 3.0 3.0 1.5 0.5 1.3 1.5 1.5 — 0 — 5 1 20 Max — 3.5 — — — — — 7.0 — — — — — — 3.0 3.5 — 3.0 — — — -150 Min 6.7 — 1.5 1.5 1.5 0.5 7.5 — 3.0 3.0 1.5 0.5 1.5 1.7 1.5 — 0 — 5 1 20 Max — 3.8 — — — — — 7.5 — — — — — — 3.0 3.8 — 3.0 — — — -133 Min 7.5 — 1.5 1.5 1.5 0.5 8.5 — 3.0 3.0 1.5 0.5 1.7 2 1.5 — 0 — 5 1 20 Max — 4.0 — — — — — 8.5 — — — — — — 3.0 4.0 — 3.0 — — — Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Notes: 1. These parameters are sampled and are not 100% tested. 2. ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold times as specified above. Rev: 1.03 10/2004 18/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 Pipeline Mode Timing (NBT) Write A Write B Write B+1 tKL tKH tKC Read C Cont Read D Write E Read F DESELECT CK tH tS CKE tH tS E* tH tS ADV tH tS W tH tS Bn tH tS A0–An A B tH tS C tLZ tKQ D E F tHZ G tKQX DQa–DQd D(A) D(B) D(B+1) Q(C) Q(D) tOLZ tOHZ tOE D(E) Q(F) G *Note: E=High(False) if E1 = 1 or E2 = 0 or E3 = 1 Rev: 1.03 10/2004 19/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 Flow Through Mode Timing (NBT) Write A Write B Write B+1 tKL tKH CK Read C tKC Cont Read D Write E Read F Write G tH tS CKE tH tS E tH tS ADV tH tS W tH tS Bn tH tS A0–An A B C D E F G tKQ tH tS DQ D(A) D(B) tKQ tLZ D(B+1) Q(C) tKQX tHZ Q(D) tLZ D(E) Q(F) tKQX D(G) tOLZ tOE tOHZ G *Note: E = High(False) if E1 = 1 or E2 = 0 or E3 = 1 Rev: 1.03 10/2004 20/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 TQFP Package Drawing (Package T) L Symbol A1 A2 b c D D1 E E1 e L L1 Y θ θ c Pin 1 Description Standoff Body Thickness Lead Width Lead Thickness Terminal Dimension Package Body Terminal Dimension Package Body Lead Pitch Foot Length Lead Length Coplanarity Lead Angle Min. Nom. Max 0.05 1.35 0.20 0.09 21.9 19.9 15.9 13.9 — 0.45 — 0.10 1.40 0.30 — 22.0 20.0 16.0 14.0 0.65 0.60 1.00 0.15 1.45 0.40 0.20 22.1 20.1 16.1 14.1 — 0.75 — 0.10 L1 e b D D1 A1 Y A2 E1 E 0° — 7° Notes: 1. All dimensions are in millimeters (mm). 2. Package width and length do not include mold protrusion. Rev: 1.03 10/2004 21/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 Ordering Information—GSI NBT Synchronous SRAM Org 2M x 18 2M x 18 2M x 18 2M x 18 2M x 18 2M x 18 1M x 36 1M x 36 1M x 36 1M x 36 1M x 36 1M x 36 2M x 18 2M x 18 2M x 18 2M x 18 2M x 18 2M x 18 1M x 36 1M x 36 1M x 36 1M x 36 1M x 36 1M x 36 2M x 18 2M x 18 2M x 18 2M x 18 2M x 18 2M x 18 Part Number1 GS8320Z18T-250 GS8320Z18T-225 GS8320Z18T-200 GS8320Z18T-166 GS8320Z18T-150 GS8320Z18T-133 GS8320Z36T-250 GS8320Z36T-225 GS8320Z36T-200 GS8320Z36T-166 GS8320Z36T-150 GS8320Z36T-133 GS8320Z18T-250I GS8320Z18T-225I GS8320Z18T-200I GS8320Z18T-166I GS8320Z18T-150I GS8320Z18T-133I GS8320Z36T-250I GS8320Z36T-225I GS8320Z36T-200I GS8320Z36T-166I GS8320Z36T-150I GS8320Z36T-133I GS8320Z18GT-250 GS8320Z18GT-225 GS8320Z18GT-200 GS8320Z18GT-166 GS8320Z18GT-150 GS8320Z18GT-133 Type NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through Package TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Speed2 (MHz/ns) 250/6 225/6.5 200/7.5 166/8.5 150/10 133/11 250/6 225/6.5 200/7.5 166/8.5 150/10 133/11 250/6 225/6.5 200/7.5 166/8.5 150/10 133/11 250/6 225/6.5 200/7.5 166/8.5 150/10 133/11 250/6 225/6.5 200/7.5 166/8.5 150/10 133/11 TA3 C C C C C C C C C C C C I I I I I I I I I I I I C C C C C C Status Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8320Z36T-166IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings Rev: 1.03 10/2004 22/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 Ordering Information—GSI NBT Synchronous SRAM Org 1M x 36 1M x 36 1M x 36 1M x 36 1M x 36 1M x 36 2M x 18 2M x 18 2M x 18 2M x 18 2M x 18 2M x 18 1M x 36 1M x 36 1M x 36 1M x 36 1M x 36 1M x 36 Part Number1 GS8320Z36GT-250 GS8320Z36GT-225 GS8320Z36GT-200 GS8320Z36GT-166 GS8320Z36GT-150 GS8320Z36GT-133 GS8320Z18GT-250I GS8320Z18GT-225I GS8320Z18GT-200I GS8320Z18GT-166I GS8320Z18GT-150I GS8320Z18GT-133I GS8320Z36GT-250I GS8320Z36GT-225I GS8320Z36GT-200I GS8320Z36GT-166I GS8320Z36GT-150I GS8320Z36GT-133I Type NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through NBT Pipeline/Flow Through Package Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Speed2 (MHz/ns) 250/6 225/6.5 200/7.5 166/8.5 150/10 133/11 250/6 225/6.5 200/7.5 166/8.5 150/10 133/11 250/6 225/6.5 200/7.5 166/8.5 150/10 133/11 TA3 C C C C C C I I I I I I I I I I I I Status Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS8320Z36T-166IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings Rev: 1.03 10/2004 23/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Preliminary GS8320Z18/36T-250/225/200/166/150/133 36Mb Sync SRAM Datasheet Revision History DS/DateRev. Code: Old; New 8320Z18_r1 8320Z18_r1; 8320Z18_r1_01 Content Types of Changes Format or Content Page;Revisions;Reason • Creation of new datasheet • Corrected pinouts—moved A19 from pin 39 to pin 43; changed pin 39 to NC • Updated page 1 table • Updated Operating Currents table • Updated AC Characteristics table (tS and tH from 18Mb) • Removed pin locations from pin description table 8320Z18_r1_01; 8320Z18_r1_02 Content • Corrected Absolute Maximum Ratings table • Corrected Capacitance table • Updated DC Electrical Characteristics table • Removed Output Load 2 diagram on page 15 • Updated format 8320Z18_r1_02; 8320Z18_r1_03 Content/Format • Added Pb-free information for TQFP package Rev: 1.03 10/2004 24/24 © 2001, GSI Technology Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.