GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp Features
• FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floating mode pins • Default to Interleaved Pipeline mode • Byte Write (BW) and/or Global Write (GW) operation • Internal self-timed write cycle • Automatic power-down for portable applications • JEDEC-standard 100-lead TQFP and 165-bump BGA packages • Pb-Free 100-lead TQFP and 165-bump BGA packages available
512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O
Linear Burst Order (LBO) input. The Burst function need not be used. New addresses can be loaded on every cycle with no degradation of chip performance. Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the user via the FT mode pin (Pin 14). Holding the FT mode pin low places the RAM in Flow Through mode, causing output data to bypass the Data Output Register. Holding FT high places the RAM in Pipeline mode, activating the risingedge-triggered Data Output Register. DCD Pipelined Reads The GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D) is a DCD (Dual Cycle Deselect) pipelined synchronous SRAM. SCD (Single Cycle Deselect) versions are also available. DCD SRAMs pipeline disable commands to the same degree as read commands. DCD RAMs hold the deselect command for one full cycle and then begin turning off their outputs just after the second rising edge of clock. Byte Write and Global Write Byte write operation is performed by using Byte Write enable (BW) input combined with one or more individual byte write signals (Bx). In addition, Global Write (GW) is available for writing all bytes at one time, regardless of the Byte Write control inputs. Sleep Mode Low power (Sleep mode) is attained through the assertion (High) of the ZZ signal, or by stopping the clock (CK). Memory data is retained during Sleep mode. Core and Interface Voltages The GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D) operates on a 2.5 V or 3.3 V power supply. All input are 3.3 V and 2.5 V compatible. Separate output power (VDDQ) pins are used to decouple output noise from the internal circuits and are 3.3 V and 2.5 V compatible.
Functional Description
Applications The GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D) is a 9,437,184-bit high performance synchronous SRAM with a 2-bit burst address counter. Although of a type originally developed for Level 2 Cache applications supporting high performance CPUs, the device now finds application in synchronous SRAM applications, ranging from DSP main store to networking chip set support. Controls Addresses, data I/Os, chip enable (E1), address burst control inputs (ADSP, ADSC, ADV) and write control inputs (Bx, BW, GW) are synchronous and are controlled by a positiveedge-triggered clock input (CK). Output enable (G) and power down control (ZZ) are asynchronous inputs. Burst cycles can be initiated with either ADSP or ADSC inputs. In Burst mode, subsequent burst addresses are generated internally and are controlled by ADV. The burst address counter may be configured to count in either linear or interleave order with the -333
Pipeline 3-1-1-1 tKQ tCycle Curr (x18) Curr (x32/x36) tKQ tCycle Curr (x18) Curr (x32/x36) 2.5 3.0 250 290 4.5 4.5 200 230
Paramter Synopsis
-300
2.5 3.3 230 265 5.0 5.0 185 210
-250
2.5 4.0 200 230 5.5 5.5 160 185
-200
3.0 5.0 170 195 6.5 6.5 140 160
-150
3.8 6.7 140 160 7.5 7.5 128 145
Unit
ns ns mA mA ns ns mA mA
Flow Through 2-1-1-1
Rev: 1.04 3/2005
1/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
GS881E18B 100-Pin TQFP Pinout (Package T)
VDDQ VSS NC NC DQ B DQB VSS VDDQ DQ B DQB FT VDD NC VSS DQ B DQB VDDQ VSS DQ B DQB DQPB NC VSS VDDQ NC NC NC
NC NC NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 512K x 18 10 71 Top View 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
A A E1 E2 NC NC BB BA A VDD VSS CK GW BW G ADSC ADSP ADV A A
A NC NC VDDQ VSS NC DQPA DQA DQA VSS VDDQ DQA DQA VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA NC NC VSS VDDQ NC NC NC
Rev: 1.04 3/2005
LBO A A A A
A1 A0 TMS TDI VSS VDD TDO TCK A A A A A A A 2/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
GS881E32B 100-Pin TQFP Pinout (Package T)
NC DQC DQC VDDQ VSS DQC DQC DQ C DQC VSS VDDQ DQ C DQC FT VDD NC VSS DQ D DQD VDDQ VSS DQ D DQD DQD DQD VSS VDDQ DQD DQD NC
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 256K x 32 10 71 Top View 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
A A E1 E2 BD BC BB BA A VDD VSS CK GW BW G ADSC ADSP ADV A A
NC DQB DQB VDDQ VSS DQB DQB DQB DQB VSS VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA DQA DQA VSS VDDQ DQA DQA NC
LBO A A A A2 A A0 TMS TDI VSS VDD Rev: 1.04 3/2005 3/40
TDO TCK A A A A A A A
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
GS881E36B 100-Pin TQFP Pinout (Package T)
DQPC DQC DQC VDDQ VSS DQC DQC DQ C DQC VSS VDDQ DQ C DQC FT VDD NC VSS DQ D DQD VDDQ VSS DQ D DQD DQD DQD VSS VDDQ DQD DQD DQPD
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 1 80 2 79 3 78 4 77 5 76 6 75 7 74 8 73 9 72 256K x 36 10 71 Top View 11 70 12 69 13 68 14 67 15 66 16 65 17 64 18 63 19 62 20 61 21 60 22 59 23 58 24 57 25 56 26 55 27 54 28 53 29 52 30 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
A A E1 E2 BD BC BB BA A VDD VSS CK GW BW G ADSC ADSP ADV A A
DQPB DQB DQB VDDQ VSS DQB DQB DQB DQB VSS VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSS DQA DQA DQA DQA VSS VDDQ DQA DQA DQPA
LBO A A A A2 A A0 TMS TDI VSS VDD Rev: 1.04 3/2005 4/40
TDO TCK A A A A A A A
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
TQFP Pin Description Symbol
A 0, A 1 A DQA DQB DQC DQD NC BW BA, BB, BC, BD NC CK GW E2 E1 G ADV ADSP, ADSC ZZ LBO VDD VSS VDDQ
Type
I I I/O — I I — I I I I I I I I I I I I
Description
Address field LSBs and Address Counter preset Inputs Address Inputs Data Input and Output pins No Connect Byte Write—Writes all enabled bytes; active low Byte Write Enable for DQ Data I/Os; active low No Connect Clock Input Signal; active high Global Write Enable—Writes all bytes; active low Chip Enable; active high Chip Enable; active low Output Enable; active low Burst address counter advance enable; active low Address Strobe (Processor, Cache Controller); active low Sleep Mode control; active high Linear Burst Order mode; active low Core power supply I/O and Core Ground Output driver power supply
Rev: 1.04 3/2005
5/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
165 Bump BGA—x18 Commom I/O—Top View (Package D)
1 A B C D E F G H J K L M N P R NC NC NC NC NC NC NC FT DQB DQB DQB DQB DQB NC LBO 2 A A NC DQB DQB DQB DQB MCL NC NC NC NC NC NC NC 3 E1 E2 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 4 BB NC VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 5 NC BA VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDI TMS 6 E3 CK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC A1 A0 7 BW GW VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDO TCK 8 ADSC G VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 9 ADV ADSP VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 10 A A NC NC NC NC NC NC DQA DQA DQA DQA NC A A 11 A NC DQA DQA DQA DQA DQA ZZ NC NC NC NC NC A A A B C D E F G H J K L M N P R
11 x 15 Bump BGA—13mm x 15 mm Body—1.0 mm Bump Pitch
Rev: 1.04 3/2005
6/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
165 Bump BGA—x32 Common I/O—Top View (Package D)
1 A B C D E F G H J K L M N P R NC NC NC DQC DQC DQC DQC FT DQD DQD DQD DQD NC NC LBO 2 A A NC DQC DQC DQC DQC MCL DQD DQD DQD DQD NC NC NC 3 E1 E2 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 4 BC BD VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 5 BB BA VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDI TMS 6 E3 CK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC A1 A0 7 BW GW VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDO TCK 8 ADSC G VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 9 ADV ADSP VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 10 A A NC DQB DQB DQB DQB NC DQA DQA DQA DQA NC A A 11 NC NC NC DQB DQB DQB DQB ZZ DQA DQA DQA DQA NC A A A B C D E F G H J K L M N P R
11 x 15 Bump BGA—13mm x 15 mm Body—1.0 mm Bump Pitch
Rev: 1.04 3/2005
7/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
165 Bump BGA—x36 Common I/O—Top View (Package D)
1 A B C D E F G H J K L M N P R NC NC DQPC DQC DQC DQC DQC FT DQD DQD DQD DQD DQPD NC LBO 2 A A NC DQC DQC DQC DQC MCL DQD DQD DQD DQD NC NC NC 3 E1 E2 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 4 BC BD VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 5 BB BA VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDI TMS 6 E3 CK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC A1 A0 7 BW GW VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDO TCK 8 ADSC G VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 9 ADV ADSP VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 10 A A NC DQB DQB DQB DQB NC DQA DQA DQA DQA NC A A 11 NC NC DQPB DQB DQB DQB DQB ZZ DQA DQA DQA DQA DQPA A A A B C D E F G H J K L M N P R
11 x 15 Bump BGA—13mm x 15 mm Body—1.0 mm Bump Pitch
Rev: 1.04 3/2005
8/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
GS881E18/32/36BD 165-Bump BGA Pin Description Symbol
A 0, A 1 A DQA DQB DQC DQD BA , BB , BC , BD NC CK BW GW E1 E3 E2 G ADV ADSC, ADSP ZZ FT LBO TMS TDI TDO TCK MCL VDD VSS VDDQ
Type
I I I/O I — I I I I I I I I I I I I I I O I — I I I
Description
Address field LSBs and Address Counter Preset Inputs Address Inputs Data Input and Output pins Byte Write Enable for DQA, DQB, DQC, DQD I/Os; active low No Connect Clock Input Signal; active high Byte Write—Writes all enabled bytes; active low Global Write Enable—Writes all bytes; active low Chip Enable; active low Chip Enable; active low Chip Enable; active high Output Enable; active low Burst address counter advance enable; active l0w Address Strobe (Processor, Cache Controller); active low Sleep mode control; active high Flow Through or Pipeline mode; active low Linear Burst Order mode; active low Scan Test Mode Select Scan Test Data In Scan Test Data Out Scan Test Clock Must Connect Low Core power supply I/O and Core Ground Output driver power supply
Rev: 1.04 3/2005
9/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
GS881E18/32/36B Block Diagram
A0–An
Register
D
Q A0 D0 A1 Q0 D1 Q1 Counter Load A0 A1
A
LBO ADV CK ADSC ADSP GW BW BA
Register
Memory Array
Q D Q D
Register
D BB
Q
36 4
36
Register
D BC
Q Q
Register
D
Register
Q
Register
D
D BD
Q
Register
D
Q
E1 E2 E3
Register
D
Q
Register
D
Q
FT G Power Down Control 1 DQx1–DQx9
ZZ
Note: Only x36 version shown for simplicity.
Rev: 1.04 3/2005
10/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Mode Pin Functions Mode Name
Burst Order Control Output Register Control Power Down Control FLXDrive Output Impedance Control
Pin Name
LBO FT ZZ ZQ
State
L H L H or NC L or NC H L H or NC
Function
Linear Burst Interleaved Burst Flow Through Pipeline Active Standby, IDD = ISB High Drive (Low Impedance) Low Drive (High Impedance)
Note: There is a pull-up device onthe FT pin and a pull-down device on the ZZ pin, so this input pin can be unconnected and the chip will operate in the default states as specified in the above tables. Burst Counter Sequences
Linear Burst Sequence A[1:0] A[1:0] A[1:0] A[1:0]
1st address 2nd address 3rd address 4th address 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10
Interleaved Burst Sequence A[1:0] A[1:0] A[1:0] A[1:0]
1st address 2nd address 3rd address 4th address 00 01 10 11 01 00 11 10 10 11 00 01 11 10 01 00
Note: The burst counter wraps to initial state on the 5th clock.
Note: The burst counter wraps to initial state on the 5th clock.
BPR 1999.05.18
Rev: 1.04 3/2005
11/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Byte Write Truth Table Function
Read Read Write byte a Write byte b Write byte c Write byte d Write all bytes
GW
H H H H H H H
BW
H L L L L L L
BA
X H L H H H L
BB
X H H L H H L
BC
X H H H L H L
BD
X H H H H L L
Notes
1 1 2, 3 2, 3 2, 3, 4 2, 3, 4 2, 3, 4
Write all bytes L X X X X X Notes: 1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs. 2. Byte Write Enable inputs BA, BB, BC and/or BD may be used in any combination with BW to write single or multiple bytes. 3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs. 4. Bytes “C” and “D” are only available on the x36 version.
Rev: 1.04 3/2005
12/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Synchronous Truth Table Operation
Deselect Cycle, Power Down Deselect Cycle, Power Down Deselect Cycle, Power Down Read Cycle, Begin Burst Read Cycle, Begin Burst Write Cycle, Begin Burst Read Cycle, Continue Burst Read Cycle, Continue Burst Write Cycle, Continue Burst Write Cycle, Continue Burst Read Cycle, Suspend Burst Read Cycle, Suspend Burst Write Cycle, Suspend Burst
Address Used
None None None External External External Next Next Next Next Current Current Current
State Diagram Key5
X X X R R W CR CR CW CW
E1
H L L L L L X H X H X H X
E2
X F F T T T X X X X X X X
ADSP ADSC
X L H L H H H X H X H X H L X L X L L H H H H H H H
ADV
X X X X X X L L L L H H H
W3
X X X X F T F F T T F F T
DQ4
High-Z High-Z High-Z Q Q D Q Q D D Q Q D
Write Cycle, Suspend Burst Current H X X H H T D Notes: 1. X = Don’t Care, H = High, L = Low 2. E = T (True) if E2 = 1 and E3 = 0; E = F (False) if E2 = 0 or E3 = 1 3. W = T (True) and F (False) is defined in the Byte Write Truth Table preceding. 4. G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown as “Q” in the Truth Table above). 5. All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish basic synchronous or synchronous burst operations and may be avoided for simplicity. 6. Tying ADSP high and ADSC low allows simple non-burst synchronous operations. See BOLD items above. 7. Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See ITALIC items above.
Rev: 1.04 3/2005
13/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Simplified State Diagram
X
Deselect W W Simple Synchronous Operation R R
X CW
First Write
R CR
First Read
X CR
Simple Burst Synchronous Operation
W R X Burst Write CR CW
R
Burst Read
X
CR
Notes: 1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low. 2. The upper portion of the diagram assumes active use of only the Enable (E1) and Write (BA, BB, BC, BD, BW, and GW) control inputs, and that ADSP is tied high and ADSC is tied low. 3. The upper and lower portions of the diagram together assume active use of only the Enable, Write, and ADSC control inputs, and assumes ADSP is tied high and ADV is tied low.
Rev: 1.04 3/2005
14/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Simplified State Diagram with G
X
Deselect W W X W CW R R
First Write
R CR
First Read
X CR
CW
W X Burst Write R CR W CW
R X
Burst Read
CW
CR
Notes: 1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use of G. 2. Use of “Dummy Reads” (Read Cycles with G High) may be used to make the transition from read cycles to write cycles without passing through a Deselect cycle. Dummy Read cycles increment the address counter just like normal read cycles. 3. Transitions shown in gray tone assume G has been pulsed high long enough to turn the RAM’s drivers off and for incoming data to meet Data Input Set Up Time.
Rev: 1.04 3/2005
15/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Absolute Maximum Ratings
(All voltages reference to VSS)
Symbol
VDD VDDQ VI/O VIN IIN IOUT PD TSTG TBIAS
Description
Voltage on VDD Pins Voltage in VDDQ Pins Voltage on I/O Pins Voltage on Other Input Pins Input Current on Any Pin Output Current on Any I/O Pin Package Power Dissipation Storage Temperature Temperature Under Bias
Value
–0.5 to 4.6 –0.5 to 4.6 –0.5 to VDDQ +0.5 (≤ 4.6 V max.) –0.5 to VDD +0.5 (≤ 4.6 V max.) +/–20 +/–20 1.5 –55 to 125 –55 to 125
Unit
V V V V mA mA W
o o
C C
Note: Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended Operating Conditions. Exposure to conditions exceeding the Absolute Maximum Ratings, for an extended period of time, may affect reliability of this component.
Power Supply Voltage Ranges Parameter
3.3 V Supply Voltage 2.5 V Supply Voltage 3.3 V VDDQ I/O Supply Voltage 2.5 V VDDQ I/O Supply Voltage
Symbol
VDD3 VDD2 VDDQ3 VDDQ2
Min.
3.0 2.3 3.0 2.3
Typ.
3.3 2.5 3.3 2.5
Max.
3.6 2.7 3.6 2.7
Unit
V V V V
Notes
Notes: 1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Rev: 1.04 3/2005
16/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
VDDQ3 Range Logic Levels Parameter
VDD Input High Voltage VDD Input Low Voltage VDDQ I/O Input High Voltage VDDQ I/O Input Low Voltage
Symbol
VIH VIL VIHQ VILQ
Min.
2.0 –0.3 2.0 –0.3
Typ.
— — — —
Max.
VDD + 0.3 0.8 VDDQ + 0.3 0.8
Unit
V V V V
Notes
1 1 1,3 1,3
Notes: 1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. 3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V.
VDDQ2 Range Logic Levels Parameter
VDD Input High Voltage VDD Input Low Voltage VDDQ I/O Input High Voltage VDDQ I/O Input Low Voltage
Symbol
VIH VIL VIHQ VILQ
Min.
0.6*VDD –0.3 0.6*VDD –0.3
Typ.
— — — —
Max.
VDD + 0.3 0.3*VDD VDDQ + 0.3 0.3*VDD
Unit
V V V V
Notes
1 1 1,3 1,3
Notes: 1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC. 3. VIHQ (max) is voltage on VDDQ pins plus 0.3 V.
Recommended Operating Temperatures Parameter
Ambient Temperature (Commercial Range Versions) Ambient Temperature (Industrial Range Versions)
Symbol
TA TA
Min.
0 –40
Typ.
25 25
Max.
70 85
Unit
°C °C
Notes
2 2
Notes: 1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are evaluated for worst case in the temperature range marked on the device. 2. Input Under/overshoot voltage must be –2 V > Vi < VDDn+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
Rev: 1.04 3/2005
17/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Undershoot Measurement and Timing
VIH VDD + 2.0 V VSS 50% VSS – 2.0 V 50% tKC VIL 50% VDD
Overshoot Measurement and Timing
50% tKC
Capacitance
(TA = 25oC, f = 1 MHZ, VDD = 2.5 V)
Parameter
Input Capacitance Input/Output Capacitance Note: These parameters are sample tested.
Symbol
CIN CI/O
Test conditions
VIN = 0 V VOUT = 0 V
Typ.
4 6
Max.
5 7
Unit
pF pF
AC Test Conditions Parameter
Input high level Input low level Input slew rate Input reference level Output reference level Output load
Conditions
VDD – 0.2 V 0.2 V 1 V/ns VDD/2 VDDQ/2 Fig. 1
Notes: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. 1 unless otherwise noted. 3. Device is deselected as defined by the Truth Table.
Output Load 1 DQ 50Ω VDDQ/2
* Distributed Test Jig Capacitance
30pF*
Rev: 1.04 3/2005
18/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
DC Electrical Characteristics Parameter
Input Leakage Current (except mode pins) ZZ Input Current FT, SCD, ZQ Input Current Output Leakage Current Output High Voltage Output High Voltage Output Low Voltage
Symbol
IIL IIN1 IIN2 IOL VOH2 VOH3 VOL
Test Conditions
VIN = 0 to VDD VDD ≥ VIN ≥ VIH 0 V ≤ VIN ≤ VIH VDD ≥ VIN ≥ VIL 0 V ≤ VIN ≤ VIL Output Disable, VOUT = 0 to VDD IOH = –8 mA, VDDQ = 2.375 V IOH = –8 mA, VDDQ = 3.135 V IOL = 8 mA
Min
–1 uA –1 uA –1 uA –100 uA –1 uA –1 uA 1.7 V 2.4 V —
Max
1 uA 1 uA 100 uA 1 uA 1 uA 1 uA — — 0.4 V
Rev: 1.04 3/2005
19/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Operating Currents
-333 Parameter Test Conditions Mode Symbol 0 to 70°C
250 40 205 25 230 20 185 15 40 40 95 65
-300 0 to 70°C
230 35 185 25 210 20 170 15 40 40 90 60
-250 0 to 70°C
200 30 160 25 185 15 145 15 40 40 85 60
-200 0 to 70°C
170 25 140 20 155 15 130 10 40 40 75 50
-150 0 to 70°C
140 20 130 15 130 10 120 8 40 40 60 50
–40 to 85°C
270 40 225 25 250 20 205 15 50 50 100 60
–40 to 85°C
250 35 205 25 230 20 190 15 50 50 95 65
–40 to 85°C
220 30 180 25 205 15 165 15 50 50 90 65
–40 to 85°C
190 25 160 20 175 15 150 10 50 50 80 55
–40 to 85°C
160 20 150 15 150 10 140 8 50 50 65 55
Unit
Operating Current
Device Selected; All other inputs ≥VIH or ≤ VIL Output open
(x32/ x36)
Pipeline Flow Through Pipeline
IDD IDDQ IDD IDDQ IDD IDDQ IDD IDDQ ISB ISB IDD IDD
mA mA mA mA mA mA mA mA
(x18)
Flow Through Pipeline
Standby Current
ZZ ≥ VDD – 0.2 V Device Deselected; All other inputs ≥ VIH or ≤ VIL
—
Flow Through Pipeline
Deselect Current
—
Flow Through
Notes: 1. IDD and IDDQ apply to any combination of VDD3, VDD2, VDDQ3, and VDDQ2 operation. 2. All parameters listed are worst case scenario.
Rev: 1.04 3/2005
20/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
AC Electrical Characteristics
Parameter
Clock Cycle Time Clock to Output Valid Clock to Output Invalid Clock to Output in Low-Z Setup time Hold time Clock Cycle Time Clock to Output Valid Clock to Output Invalid Clock to Output in Low-Z Setup time Hold time Clock HIGH Time Clock LOW Time Clock to Output in High-Z G to Output Valid G to output in Low-Z G to output in High-Z ZZ setup time ZZ hold time ZZ recovery
Symbol
tKC tKQ tKQX tLZ1 tS tH tKC tKQ tKQX tLZ tS tH tKH tKL tHZ1 tOE tOLZ1 tOHZ1 tZZS
2 2 1
-333
Min 3.0 — 1.5 1.5 1.0 0.1 4.5 — 2.0 2.0 1.3 0.3 1.0 1.2 1.5 — 0 — 5 1 20 Max — 2.5 — — — — — 4.5 — — — — — — 2.5 2.5 — 2.5 — — — Min 3.3 — 1.5 1.5 1.0 0.1 5.0 — 2.0 2.0 1.4 0.4 1.0 1.2 1.5 — 0 — 5 1 20
-300
Max — 2.5 — — — — — 5.0 — — — — — — 2.5 2.5 — 2.5 — — — Min 4.0 — 1.5 1.5 1.2 0.2 5.5 — 2.0 2.0 1.5 0.5 1.3 1.5 1.5 — 0 — 5 1 20
-250
Max — 2.5 — — — — — 5.5 — — — — — — 2.5 2.5 — 2.5 — — — Min 5.0 — 1.5 1.5 1.4 0.4 6.5 — 2.0 2.0 1.5 0.5 1.3 1.5 1.5 — 0 — 5 1 20
-200
Max — 3.0 — — — — — 6.5 — — — — — — 3.0 3.0 — 3.0 — — — Min 6.7 — 1.5 1.5 1.5 0.5 7.5 — 2.0 2.0 1.5 0.5 1.5 1.7 1.5 — 0 — 5 1 20
-150
Max — 3.8 — — — — — 7.5 — — — — — — 3.0 3.8 — 3.8 — — —
Unit
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Pipeline
Flow Through
tZZH
tZZR
Notes: 1. These parameters are sampled and are not 100% tested. 2. ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold times as specified above.
Rev: 1.04 3/2005
21/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Pipeline Mode Timing (DCD)
Begin
Read A
Cont
Deselect Deselect Write B tKL tKH tKC
Read C
Read C+1 Read C+2 Read C+3 Cont
Deselect Deselect
CK ADSP tS tH ADSC tS ADV tS tH Ao–An
A B C ADSC initiated read
tH
tS GW tS BW tH tS Ba–Bd tS tH E1 tS tH E2 tS tH E3 G tS tOE DQa–DQd
Hi-Z E2 and E3 only sampled with ADSC Deselected with E1
tH
tKQ tH tLZ
Q(C) Q(C+1) Q(C+2) Q(C+3)
tHZ tKQX
tOHZ
Q(A) D(B)
Rev: 1.04 3/2005
22/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Flow Through Mode Timing (DCD)
Begin
Read A
Cont tKL tKH
Deselect Write B tKC
Read C
Read C+1 Read C+2 Read C+3 Read C
Deselect
CK ADSP tS tH ADSC tH tS ADV tS tH Ao–An
A B C Fixed High
tS tH ADSC initiated read
tS
tH
tS tH GW tS tH BW tH tS Ba–Bd tS tH E1 tS tH E2 tS tH E3 G tOE tKQ DQa–DQd
Q(A) E1 masks ADSP Deselected with E1
E2 and E3 only sampled with ADSP and ADSC
E1 masks ADSP
tH tS tOHZ
D(B)
tLZ
Q(C) Q(C+1) Q(C+2) Q(C+3) Q(C)
tKQX tHZ
Rev: 1.04 3/2005
23/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Sleep Mode
During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high, the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM operates normally after ZZ recovery time. Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of Sleep mode is dictated by the length of time the ZZ is in a High state. After entering Sleep mode, all inputs except ZZ become disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode. When the ZZ pin is driven high, ISB2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a Deselect or Read commands may be applied while the SRAM is recovering from Sleep mode.
Sleep Mode Timing Diagram
tKH tKC CK Setup Hold ADSP ADSC tZZR tZZS ZZ tZZH tKL
Application Tips
Single and Dual Cycle Deselect SCD devices force the use of “dummy read cycles” (read cycles that are launched normally but that are ended with the output drivers inactive) in a fully synchronous environment. Dummy read cycles waste performance but their use usually assures there will be no bus contention in transitions from reads to writes or between banks of RAMs. DCD SRAMs (like this one) do not waste bandwidth on dummy cycles and are logically simpler to manage in a multiple bank application (wait states need not be inserted at bank address boundary crossings) but greater care must be exercised to avoid excessive bus contention.
JTAG Port Operation
Overview The JTAG Port on this RAM operates in a manner that is compliant with IEEE Standard 1149.1-1990, a serial boundary scan interface standard (commonly referred to as JTAG). The JTAG Port input interface levels scale with VDD. The JTAG output drivers are powered by VDDQ.
Rev: 1.04 3/2005
24/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Disabling the JTAG Port It is possible to use this device without utilizing the JTAG port. The port is reset at power-up and will remain inactive unless clocked. TCK, TDI, and TMS are designed with internal pull-up circuits.To assure normal operation of the RAM with the JTAG Port unused, TCK, TDI, and TMS may be left floating or tied to either VDD or VSS. TDO should be left unconnected.
JTAG Port Registers JTAG Pin Descriptions Pin
TCK TMS
Pin Name
Test Clock Test Mode Select
I/O
In In
Description
Clocks all TAP events. All inputs are captured on the rising edge of TCK and all outputs propagate from the falling edge of TCK. The TMS input is sampled on the rising edge of TCK. This is the command input for the TAP controller state machine. An undriven TMS input will produce the same result as a logic one input level. The TDI input is sampled on the rising edge of TCK. This is the input side of the serial registers placed between TDI and TDO. The register placed between TDI and TDO is determined by the state of the TAP Controller state machine and the instruction that is currently loaded in the TAP Instruction Register (refer to the TAP Controller State Diagram). An undriven TDI pin will produce the same result as a logic one input level.
TDI
Test Data In
In
TDO
Test Data Out
Output that is active depending on the state of the TAP state machine. Output changes in Out response to the falling edge of TCK. This is the output side of the serial registers placed between TDI and TDO.
Note: This device does not have a TRST (TAP Reset) pin. TRST is optional in IEEE 1149.1. The Test-Logic-Reset state is entered while TMS is held high for five rising edges of TCK. The TAP Controller is also reset automaticly at power-up. Overview The various JTAG registers, refered to as Test Access Port orTAP Registers, are selected (one at a time) via the sequences of 1s and 0s applied to TMS as TCK is strobed. Each of the TAP Registers is a serial shift register that captures serial input data on the rising edge of TCK and pushes serial data out on the next falling edge of TCK. When a register is selected, it is placed between the TDI and TDO pins. Instruction Register The Instruction Register holds the instructions that are executed by the TAP controller when it is moved into the Run, Test/Idle, or the various data register states. Instructions are 3 bits long. The Instruction Register can be loaded when it is placed between the TDI and TDO pins. The Instruction Register is automatically preloaded with the IDCODE instruction at power-up or whenever the controller is placed in Test-Logic-Reset state. Bypass Register The Bypass Register is a single bit register that can be placed between TDI and TDO. It allows serial test data to be passed through the RAM’s JTAG Port to another device in the scan chain with as little delay as possible. Boundary Scan Register The Boundary Scan Register is a collection of flip flops that can be preset by the logic level found on the RAM’s input or I/O pins. The flip flops are then daisy chained together so the levels found can be shifted serially out of the JTAG Port’s TDO pin. The Boundary Scan Register also includes a number of place holder flip flops (always set to a logic 1). The relationship between the device pins and the bits in the Boundary Scan Register is described in the Scan Order Table following. The Boundary Scan Register, under the control of the TAP Controller, is loaded with the contents of the RAMs I/O ring when the controller is in Capture-DR state and then is placed between the TDI and TDO pins when the controller is moved to Shift-DR state. SAMPLE-Z, SAMPLE/PRELOAD and EXTEST instructions can be used to activate the Boundary Scan Register.
Rev: 1.04 3/2005
25/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
JTAG TAP Block Diagram
· · ·
108
·
·
·
·
·
·
· ·
1
Boundary Scan Register
0
Bypass Register
210
0
Instruction Register TDI ID Code Register
31 30 29
TDO
·
···
210
Control Signals TMS TCK Test Access Port (TAP) Controller
Identification (ID) Register The ID Register is a 32-bit register that is loaded with a device and vendor specific 32-bit code when the controller is put in Capture-DR state with the IDCODE command loaded in the Instruction Register. The code is loaded from a 32-bit on-chip ROM. It describes various attributes of the RAM as indicated below. The register is then placed between the TDI and TDO pins when the controller is moved into Shift-DR state. Bit 0 in the register is the LSB and the first to reach TDO when shifting begins.
Rev: 1.04 3/2005
26/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Tap Controller Instruction Set ID Register Contents
Die Revision Code Bit # x36 x32 x18 GSI Technology JEDEC Vendor ID Code Presence Register 0 1 1 1
Not Used
I/O Configuration
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 X X X X X X X X X X X X 0 0 0 0 0 0 0 0 0 X 0 X 1 0 1 0 0 0 0 0 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 0 1 0 0 0 1 0 0 0 0 0 0 0 011011001 0 011011001 0 011011001
Overview There are two classes of instructions defined in the Standard 1149.1-1990; the standard (Public) instructions, and device specific (Private) instructions. Some Public instructions are mandatory for 1149.1 compliance. Optional Public instructions must be implemented in prescribed ways. The TAP on this device may be used to monitor all input and I/O pads, and can be used to load address, data or control signals into the RAM or to preload the I/O buffers. When the TAP controller is placed in Capture-IR state the two least significant bits of the instruction register are loaded with 01. When the controller is moved to the Shift-IR state the Instruction Register is placed between TDI and TDO. In this state the desired instruction is serially loaded through the TDI input (while the previous contents are shifted out at TDO). For all instructions, the TAP executes newly loaded instructions only when the controller is moved to Update-IR state. The TAP instruction set for this device is listed in the following table.
Rev: 1.04 3/2005
27/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
JTAG Tap Controller State Diagram
1
Test Logic Reset
0 1 1 1
0
Run Test Idle
Select DR
0 1
Select IR
0 1
Capture DR
0
Capture IR
0
Shift DR
1 1
0 1
Shift IR
1
0
Exit1 DR
0
Exit1 IR
0
Pause DR
1
0
Pause IR
1
0
Exit2 DR
1
0
Exit2 IR
1
0
Update DR
1 0
Update IR
1 0
Instruction Descriptions BYPASS When the BYPASS instruction is loaded in the Instruction Register the Bypass Register is placed between TDI and TDO. This occurs when the TAP controller is moved to the Shift-DR state. This allows the board level scan path to be shortened to facilitate testing of other devices in the scan path. SAMPLE/PRELOAD SAMPLE/PRELOAD is a Standard 1149.1 mandatory public instruction. When the SAMPLE / PRELOAD instruction is loaded in the Instruction Register, moving the TAP controller into the Capture-DR state loads the data in the RAMs input and I/O buffers into the Boundary Scan Register. Boundary Scan Register locations are not associated with an input or I/O pin, and are loaded with the default state identified in the Boundary Scan Chain table at the end of this section of the datasheet. Because the RAM clock is independent from the TAP Clock (TCK) it is possible for the TAP to attempt to capture the I/O ring contents while the input buffers are in transition (i.e. in a metastable state). Although allowing the TAP to sample metastable inputs will not harm the device, repeatable results cannot be expected. RAM input signals must be stabilized for long enough to meet the TAPs input data capture set-up plus hold time (tTS plus tTH). The RAMs clock inputs need not be paused for any other TAP operation except capturing the I/O ring contents into the Boundary Scan Register. Moving the controller to Shift-DR state then places the boundary scan register between the TDI and TDO pins. EXTEST EXTEST is an IEEE 1149.1 mandatory public instruction. It is to be executed whenever the instruction register is loaded with all logic 0s. The EXTEST command does not block or override the RAM’s input pins; therefore, the RAM’s internal state is still determined by its input pins.
Rev: 1.04 3/2005
28/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Typically, the Boundary Scan Register is loaded with the desired pattern of data with the SAMPLE/PRELOAD command. Then the EXTEST command is used to output the Boundary Scan Register’s contents, in parallel, on the RAM’s data output drivers on the falling edge of TCK when the controller is in the Update-IR state. Alternately, the Boundary Scan Register may be loaded in parallel using the EXTEST command. When the EXTEST instruction is selected, the sate of all the RAM’s input and I/O pins, as well as the default values at Scan Register locations not associated with a pin, are transferred in parallel into the Boundary Scan Register on the rising edge of TCK in the Capture-DR state, the RAM’s output pins drive out the value of the Boundary Scan Register location with which each output pin is associated. IDCODE The IDCODE instruction causes the ID ROM to be loaded into the ID register when the controller is in Capture-DR mode and places the ID register between the TDI and TDO pins in Shift-DR mode. The IDCODE instruction is the default instruction loaded in at power up and any time the controller is placed in the Test-Logic-Reset state. SAMPLE-Z If the SAMPLE-Z instruction is loaded in the instruction register, all RAM outputs are forced to an inactive drive state (highZ) and the Boundary Scan Register is connected between TDI and TDO when the TAP controller is moved to the Shift-DR state. RFU These instructions are Reserved for Future Use. In this device they replicate the BYPASS instruction.
Rev: 1.04 3/2005
29/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
JTAG Port AC Test Conditions Parameter
Input high level Input low level Input slew rate Input reference level Output reference level
Conditions
VDD – 0.2 V 0.2 V 1 V/ns VDDQ/2 VDDQ/2 DQ
JTAG Port AC Test Load
50Ω VDDQ/2
* Distributed Test Jig Capacitance
30pF*
Notes: 1. Include scope and jig capacitance. 2. Test conditions as shown unless otherwise noted.
JTAG TAP Instruction Set Summary Instruction
EXTEST IDCODE SAMPLE-Z RFU SAMPLE/ PRELOAD GSI RFU
Code
000 001 010 011 100 101 110
Description
Places the Boundary Scan Register between TDI and TDO. Preloads ID Register and places it between TDI and TDO. Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. Forces all RAM output drivers to High-Z. Do not use this instruction; Reserved for Future Use. Replicates BYPASS instruction. Places Bypass Register between TDI and TDO. Captures I/O ring contents. Places the Boundary Scan Register between TDI and TDO. GSI private instruction. Do not use this instruction; Reserved for Future Use. Replicates BYPASS instruction. Places Bypass Register between TDI and TDO.
Notes
1 1, 2 1 1 1 1 1 1
BYPASS 111 Places Bypass Register between TDI and TDO. Notes: 1. Instruction codes expressed in binary, MSB on left, LSB on right. 2. Default instruction automatically loaded at power-up and in test-logic-reset state.
Rev: 1.04 3/2005
30/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
JTAG Port Recommended Operating Conditions and DC Characteristics Parameter
3.3 V Test Port Input High Voltage 3.3 V Test Port Input Low Voltage 2.5 V Test Port Input High Voltage 2.5 V Test Port Input Low Voltage TMS, TCK and TDI Input Leakage Current TMS, TCK and TDI Input Leakage Current TDO Output Leakage Current Test Port Output High Voltage Test Port Output Low Voltage Test Port Output CMOS High Test Port Output CMOS Low
Symbol
VIHJ3 VILJ3 VIHJ2 VILJ2 IINHJ IINLJ IOLJ VOHJ VOLJ VOHJC VOLJC
Min.
2.0 –0.3 0.6 * VDD2 –0.3 –300 –1 –1 1.7 — VDDQ – 100 mV —
Max.
VDD3 +0.3 0.8 VDD2 +0.3 0.3 * VDD2 1 100 1 — 0.4 — 100 mV
Unit Notes
V V V V uA uA uA V V V V 1 1 1 1 2 3 4 5, 6 5, 7 5, 8 5, 9
Notes: 1. Input Under/overshoot voltage must be –2 V > Vi < VDDn +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC. 2. VILJ ≤ VIN ≤ VDDn 3. 0 V ≤ VIN ≤ VILJn 4. Output Disable, VOUT = 0 to VDDn 5. The TDO output driver is served by the VDDQ supply. 6. IOHJ = –4 mA 7. IOLJ = + 4 mA 8. IOHJC = –100 uA 9. IOLJC = +100 uA
Rev: 1.04 3/2005
31/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
JTAG Port Timing Diagram
tTKC TCK tTH tTS TDI tTH tTS TMS tTKQ TDO tTH tTS Parallel SRAM input
tTKH
tTKL
JTAG Port AC Electrical Characteristics
Parameter TCK Cycle Time TCK Low to TDO Valid TCK High Pulse Width TCK Low Pulse Width TDI & TMS Set Up Time TDI & TMS Hold Time Symbol tTKC tTKQ tTKH tTKL tTS tTH Min 50 — 20 20 10 10 Max — 20 — — — — Unit ns ns ns ns ns ns
Boundary Scan (BSDL Files) For information regarding the Boundary Scan Chain, or to obtain BSDL files for this part, please contact our Applications Engineering Department at: apps@gsitechnology.com.
Rev: 1.04 3/2005
32/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
TQFP Package Drawing (Package T) L Symbol
A1 A2 b c D D1 E E1 e L L1 Y θ
θ c Pin 1
Description
Standoff Body Thickness Lead Width Lead Thickness Terminal Dimension Package Body Terminal Dimension Package Body Lead Pitch Foot Length Lead Length Coplanarity Lead Angle
Min. Nom. Max
0.05 1.35 0.20 0.09 21.9 19.9 15.9 13.9 — 0.45 — 0.10 1.40 0.30 — 22.0 20.0 16.0 14.0 0.65 0.60 1.00 0.15 1.45 0.40 0.20 22.1 20.1 16.1 14.1 — 0.75 — 0.10
L1
e b
D D1
A1
Y
A2
E1 E
0°
—
7°
Notes: 1. All dimensions are in millimeters (mm). 2. Package width and length do not include mold protrusion.
Rev: 1.04 3/2005
33/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D) Package Dimensions—165-Bump FPBGA (Package D; Variation 1)
A1 CORNER TOP VIEW BOTTOM VIEW Ø0.10 M C Ø0.25 M C A B Ø0.40~0.50 (165x) A1 CORNER
1 2 3 4 5 6 7 8 9 10 11 A B C D E F G H J K L M N P R
11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R
1.0 10.0 1.0
15±0.07
14.0
A
0.45±0.05 0.25 C
1.0
1.0
0.15 C
B 0.20(4x)
13±0.07
(0.26)
Rev: 1.04 3/2005
0.25~0.40 1.20 MAX.
C
SEATING PLANE
34/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Ordering Information for GSI Synchronous Burst RAMs Org
512K x 18 512K x 18 512K x 18 512K x 18 512K x 18 256K x 32 256K x 32 256K x 32 256K x 32 256K x 32 256K x 36 256K x 36 256K x 36 256K x 36 256K x 36 512K x 18 512K x 18 512K x 18 512K x 18 512K x 18 256K x 32 256K x 32 256K x 32 256K x 32 256K x 32 256K x 36 256K x 36
Part Number1
GS881E18BT-333 GS881E18BT-300 GS881E18BT-250 GS881E18BT-200 GS881E18BT-150 GS881E36BT-333 GS881E32BT-300 GS881E36BT-250 GS881E32BT-200 GS881E32BT-150 GS881E36BT-333 GS881E36BT-300 GS881E36BT-250 GS881E36BT-200 GS881E36BT-150 GS881E18BT-333I GS881E18BT-2300I GS881E18BT-250I GS881E18BT-200I GS881E18BT-150I GS881E36BT-333I GS881E32BT-300I GS881E36BT-250I GS881E32BT-200I GS881E32BT-150I GS881E36BT-333I GS881E36BT-300I
Type
DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through
Package
TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP TQFP
Speed2 (MHz/ns)
333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5
TA3
C C C C C C C C C C C C C C C I I I I I I I I I I I I
256K x 36 GS881E36BT-250I DCD Pipeline/Flow Through TQFP 250/5.5 I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS881E18BT-150IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.04 3/2005
35/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Ordering Information for GSI Synchronous Burst RAMs (Continued) Org
256K x 36 256K x 36 512K x 18 512K x 18 512K x 18 512K x 18 512K x 18 256K x 32 256K x 32 256K x 32 256K x 32 256K x 32 256K x 36 256K x 36 256K x 36 256K x 36 256K x 36 512K x 18 512K x 18 512K x 18 512K x 18 512K x 18 256K x 32 256K x 32 256K x 32 256K x 32 256K x 32 256K x 36 256K x 36
Part Number1
GS881E36BT-200I GS881E36BT-150I GS881E18BGT-333 GS881E18BGT-300 GS881E18BGT-250 GS881E18BGT-200 GS881E18BGT-150 GS881E36BGT-333 GS881E32BGT-300 GS881E36BGT-250 GS881E32BGT-200 GS881E32BGT-150 GS881E36BGT-333 GS881E36BGT-300 GS881E36BGT-250 GS881E36BGT-200 GS881E36BGT-150 GS881E18BGT-333I GS881E18BGT-2300I GS881E18BGT-250I GS881E18BGT-200I GS881E18BGT-150I GS881E36BGT-333I GS881E32BGT-300I GS881E36BGT-250I GS881E32BGT-200I GS881E32BGT-150I GS881E36BGT-333I GS881E36BGT-300I
Type
DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through
Package
TQFP TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP Pb-free TQFP
Speed2 (MHz/ns)
200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5
TA3
I I C C C C C C C C C C C C C C C I I I I I I I I I I I I
256K x 36 GS881E36BGT-250I DCD Pipeline/Flow Through Pb-free TQFP 250/5.5 I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS881E18BT-150IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.04 3/2005
36/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Ordering Information for GSI Synchronous Burst RAMs (Continued) Org
256K x 36 256K x 36 512K x 18 512K x 18 512K x 18 512K x 18 512K x 18 256K x 32 256K x 32 256K x 32 256K x 32 256K x 32 256K x 36 256K x 36 256K x 36 256K x 36 256K x 36 512K x 18 512K x 18 512K x 18 512K x 18 512K x 18 256K x 32 256K x 32 256K x 32 256K x 32 256K x 32 256K x 36 256K x 36
Part Number1
GS881E36BGT-200I GS881E36BGT-150I GS881E18BD-333 GS881E18BD-300 GS881E18BD-250 GS881E18BD-200 GS881E18BD-150 GS881E32BD-333 GS881E32BD-300 GS881E32BD-250 GS881E32BD-200 GS881E32BD-150 GS881E36BD-333 GS881E36BD-300 GS881E36BD-250 GS881E36BD-200 GS881E36BD-150 GS881E18BD-333I GS881E18BD-300I GS881E18BD-250I GS881E18BD-200I GS881E18BD-150I GS881E32BD-333I GS881E32BD-300I GS881E32BD-250I GS881E32BD-200I GS881E32BD-150I GS881E36BD-333I GS881E36BD-300I
Type
DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through
Package
Pb-free TQFP Pb-free TQFP 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1) 165 BGA (var. 1)
Speed2 (MHz/ns)
200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5
TA3
I I C C C C C C C C C C C C C C C I I I I I I I I I I I I
256K x 36 GS881E36BD-250I DCD Pipeline/Flow Through 165 BGA (var. 1) 250/5.5 I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS881E18BT-150IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.04 3/2005
37/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Ordering Information for GSI Synchronous Burst RAMs (Continued) Org
256K x 36 256K x 36 512K x 18 512K x 18 512K x 18 512K x 18 512K x 18 256K x 32 256K x 32 256K x 32 256K x 32 256K x 32 256K x 36 256K x 36 256K x 36 256K x 36 256K x 36 512K x 18 512K x 18 512K x 18 512K x 18 512K x 18 256K x 32 256K x 32 256K x 32 256K x 32
Part Number1
GS881E36BD-200I GS881E36BD-150I GS881E18BGD-333 GS881E18BGD-300 GS881E18BGD-250 GS881E18BGD-200 GS881E18BGD-150 GS881E32BGD-333 GS881E32BGD-300 GS881E32BGD-250 GS881E32BGD-200 GS881E32BGD-150 GS881E36BGD-333 GS881E36BGD-300 GS881E36BGD-250 GS881E36BGD-200 GS881E36BGD-150 GS881E18BGD-333I GS881E18BGD-300I GS881E18BGD-250I GS881E18BGD-200I GS881E18BGD-150I GS881E32BGD-333I GS881E32BGD-300I GS881E32BGD-250I GS881E32BGD-200I
Type
DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through
Package
165 BGA (var. 1) 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1)
Speed2 (MHz/ns)
200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5 150/7.5 333/4.5 300/5 250/5.5 200/6.5
TA3
I I C C C C C C C C C C C C C C C I I I I I I I I I
256K x 32 GS881E32BGD-150I DCD Pipeline/Flow Through Pb-Free 165 BGA (var. 1) 150/7.5 I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS881E18BT-150IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.04 3/2005
38/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
Ordering Information for GSI Synchronous Burst RAMs (Continued) Org
256K x 36 256K x 36 256K x 36 256K x 36
Part Number1
GS881E36BGD-333I GS881E36BGD-300I GS881E36BGD-250I GS881E36BGD-200I
Type
DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through DCD Pipeline/Flow Through
Package
Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1) Pb-Free 165 BGA (var. 1)
Speed2 (MHz/ns)
333/4.5 300/5 250/5.5 200/6.5
TA3
I I I I
256K x 36 GS881E36BGD-150I DCD Pipeline/Flow Through Pb-Free 165 BGA (var. 1) 150/7.5 I Notes: 1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS881E18BT-150IT. 2. The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each device is Pipeline/Flow Through mode-selectable by the user. 3. TA = C = Commercial Temperature Range. TA = I = Industrial Temperature Range. 4. GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.04 3/2005
39/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS881E18B(T/D)/GS881E32B(T/D)/GS881E36B(T/D)
9Mb Sync SRAM Datasheet Revision History DS/DateRev. Code: Old;
New 881E18B_r1 881E18B_r1; 881E18B_r1_01 881E18B_r1_01; 881E18B_r1_02 881E18B_r1_02; 881E18B_r1_03 881E18B_r1_03; 881E18B_r1_04 Content
Types of Changes Format or Content
Page;Revisions;Reason
• Creation of new datasheet • Added x32 TQFP • Removed address and DQ number designations • Removed erroneous speed bins • Added 333/300 MHz speed bins • Basic format updates • Removed Preliminary banner due to qualification of parts • Added Pb-free information to TQFP • Added variation information to 165 BGA • Added Pb-free information for 165 BGA
Content/Format
Content/Format Content
Rev: 1.04 3/2005
40/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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