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GSS4501S

GSS4501S

  • 厂商:

    GTM

  • 封装:

  • 描述:

    GSS4501S - N AND P-CHANNEL ENHANCEMENT MODE POWER MOSFET - GTM CORPORATION

  • 数据手册
  • 价格&库存
GSS4501S 数据手册
Pb Free Plating Product ISSUED DATE :2006/04/27 REVISED DATE : GSS4501S N AND P-CHANNEL ENHANCEMENT MODE POWER MOSFET The GSS4501S provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The SOP-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. *Simple Drive Requirement *Low On-resistance *Schottky Diode Included Description N-CH BVDSS 30V N-CH RDS(ON) 33m N-CH ID 6A P-CH BVDSS -30V N-CH RDS(ON) 50m N-CH ID -5.3A Features Package Dimensions REF. A B C D E F Millimeter Min. Max. 5.80 4.80 3.80 0° 0.40 0.19 6.20 5.00 4.00 8° 0.90 0.25 REF. M H L J K G Millimeter Min. Max. 0.10 0.25 0.35 0.49 1.35 1.75 0.375 REF. 45° 1.27 TYP. Absolute Maximum Ratings Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current 1 3 3 Symbol VDS VGS ID @TA=25 : ID @TA=70 : IDM PD @TA=25 : Tj, Tstg Ratings N-channel P-channel Unit V V A A A W W/ : : 30 ±20 6 4.8 20 2.0 0.016 -30 ±20 -5.3 -4.7 -20 Total Power Dissipation Linear Derating Factor Operating Junction and Storage Temperature Range -55 ~ +150 Thermal Data Parameter Thermal Resistance Junction-ambient 3 Symbol Max. Rthj-a Value 62.5 Unit : /W GSS4501S Page: 1/7 ISSUED DATE :2006/04/27 REVISED DATE : N-Channel Electrical Characteristics (Tj = 25 : unless otherwise specified) Parameter Drain-Source Breakdown Voltage Gate Threshold Voltage Forward Transconductance Gate-Source Leakage Current Drain-Source Leakage Current(Tj=25 : ) Drain-Source Leakage Current(Tj=70 : ) Symbol BVDSS VGS(th) gfs IGSS IDSS Min. 30 1.0 - Typ. 12 - Max. 3.0 ±100 100 1 33 50 Unit V V S nA uA mA m Test Conditions VGS=0, ID=250uA VDS=VGS, ID=250uA VDS=10V, ID=6A VGS= ±20V VDS=30V, VGS=0 VDS=24V, VGS=0 VGS=10V, ID=6A VGS=4.5V, ID=5A ID=6A VDS=24V VGS=4.5V VDS=15V ID=1A VGS=10 RG=3.3 RD=15 VGS=0V VDS=25V f=1.0MHz Static Drain-Source On-Resistance2 Total Gate Charge 2 RDS(ON) Qg Qgs Qgd Td(on) Tr Td(off) Tf Ciss Coss Crss - 8.2 2 4.3 6 5.2 18.8 4.4 645 150 95 pF ns nC Gate-Source Charge Gate-Drain (“Miller”) Change Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance 2 Source-Drain & Schottky Diode Parameter Forward On Voltage 2 Symbol VSD Trr Qrr Min. - Typ. 16 8 Max. 0.5 - Unit V ns nC Test Conditions IS=1.7A, VGS=0V IS=1.7A, VGS=0V dI/dt=100A/ s Reverse Recovery Time Reverse Recovery Charge Notes: 1. Pulse width limited by Max. junction temperature. 2. Pulse width 300us, duty cycle 2%. 3. Surface mounted on 1 in2 copper pad of FR4 board; 135 : /W when mounted on Min. copper pad. GSS4501S Page: 2/7 ISSUED DATE :2006/04/27 REVISED DATE : P-Channel Electrical Characteristics (Tj = 25 : unless otherwise specified) Parameter Drain-Source Breakdown Voltage Gate Threshold Voltage Forward Transconductance Gate-Source Leakage Current Drain-Source Leakage Current(Tj=25 : ) Drain-Source Leakage Current(Tj=70 : ) Symbol BVDSS VGS(th) gfs IGSS IDSS Min. -30 -1.0 - Typ. 8.5 - Max. -3.0 ±100 -1 -25 50 90 Unit V V S nA uA uA m Test Conditions VGS=0, ID=-250uA VDS=VGS, ID=-250uA VDS=-10V, ID=-5.3A VGS= ±20V VDS=-30V, VGS=0 VDS=-24V, VGS=0 VGS=-10V, ID=-5.3A VGS=-4.5V, ID=-4.2A ID=-5.3A VDS=-15V VGS=-10V VDS=-15V ID=-1A VGS=-10V RG=6 RD=15 VGS=0V VDS=-15V f=1.0MHz Static Drain-Source On-Resistance2 Total Gate Charge 2 RDS(ON) Qg Qgs Qgd Td(on) Tr Td(off) Tf Ciss Coss Crss - 20 3.5 2 12 20 45 27 790 440 120 pF ns nC Gate-Source Charge Gate-Drain (“Miller”) Change Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance 2 Source-Drain Diode Parameter Forward On Voltage 2 Symbol VSD Trr Qrr Min. - Typ. 33.4 52 Max. -1.2 - Unit V ns nC Test Conditions IS=-2.6A, VGS=0V IS=-2.6A, VGS=0V dI/dt=100A/ s Reverse Recovery Time Reverse Recovery Charge Notes: 1. Pulse width limited by Max. junction temperature. 2. Pulse width 300us, duty cycle 2%. 3. Surface mounted on 1 in2 copper pad of FR4 board; 135 : /W when mounted on Min. copper pad. GSS4501S Page: 3/7 ISSUED DATE :2006/04/27 REVISED DATE : Characteristics Curve N-Channel Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Forward Characteristics of Reverse Diode GSS4501S Fig 6. Gate Threshold Voltage v.s. Junction Temperature Page: 4/7 ISSUED DATE :2006/04/27 REVISED DATE : N-Channel Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance Fig 11. Switching Time Circuit GSS4501S Fig 12. Gate Charge Circuit Page: 5/7 ISSUED DATE :2006/04/27 REVISED DATE : P-Channel Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Forward Characteristics of Reverse Diode GSS4501S Fig 6. Gate Threshold Voltage v.s. Junction Temperature Page: 6/7 ISSUED DATE :2006/04/27 REVISED DATE : P-Channel Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance Fig 11. Switching Time Circuit Fig 12. Gate Charge Circuit Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of GTM. GTM reserves the right to make changes to its products without notice. GTM semiconductor products are not warranted to be suitable for use in life-support Applications, or systems. GTM assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Taiwan: No. 17-1 Tatung Rd. Fu Kou Hsin-Chu Industrial Park, Hsin-Chu, Taiwan, R. O. C. TEL : 886-3-597-7061 FAX : 886-3-597-9220, 597-0785 China: (201203) No.255, Jang-Jiang Tsai-Lueng RD. , Pu-Dung-Hsin District, Shang-Hai City, China TEL : 86-21-5895-7671 ~ 4 FAX : 86-21-38950165 GSS4501S Page: 7/7
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