PHOTODIODE
GaAsP photodiode
Diffusion type
Red sensitivity extended type
Features Applications
l Low dark current l High stability l Red sensitivity extended type
l Analytical instruments l Color identification
s General ratings / Absolute maximum ratings
Type No. G1735 G1736 G1737 G1738 G1740 G3297 Dimensional outline/ Window material * ➀/K ➁/K ➂/K ➃/R ➄/R ➅/L Package TO-18 TO-5 TO-8 Ceramic Ceramic TO-18 Active area size (mm) 1.3 × 1.3 2.7 × 2.7 5.6 × 5.6 1.3 × 1.3 5.6 × 5.6 1.3 × 1.3 Effective active area (mm2) 1.66 7.26 29.3 1.66 29.3 1.66 Absolute maximum ratings Operating Storage Reverse temperature temperature voltage Topr Tstg VR Max. (V) (°C) (°C)
5
-30 to +80
-40 to +85
s Electrical and optical characteristics (Typ. Ta=25 °C, unless otherwise noted)
Terminal Temp. Rise time Dark Short circuit capacitance coefficient tr current current Ct of VR=0 V Isc ID VR=0 V ID Type No. Max. x RL=1 kΩ GaP He-Ne 100 l TCID f=10 kHz LED laser λp 560 nm 633 nm Min. Typ. V4=10 mV V4=1 V (nm) (nm) (pF) (µA) (µA) (pA) (pA) (times/°C) (µs) G1735 0.2 0.25 2 20 0.5 250 G1736 0.8 1.1 5 50 1.8 1200 G1737 4 5 10 100 10 4500 0.4 0.22 0.29 1.07 400 to 760 710 G1738 0.2 0.25 2 20 0.5 250 G1740 4 5 10 100 10 4500 G3297 1.5 1.8 2 20 0.5 250 * Window material K: borosilicate glass, L: lens type borosilicate glass, R: resin coating Spectral Peak response sensitivity range wavelength λ λp Photo sensitivity S (A/W) Shunt resistance Rsh VR=10 mV NEP
Min. Typ. (GΩ) (GΩ) (W/Hz1/2) 5 25 2.0 × 10-15 2 15 3.2 × 10-15 1 5 4.5 × 10-15 5 25 2.0 × 10-15 1 5 4.5 × 10-15 5 25 2.0 × 10-15
GaAsP photodiode
sSpectral response
0.5 (Typ. Ta=25 ˚C)
Diffusion type
(Typ.)
sPhoto sensitivity temperature characteristic
+1.5
PHOTO SENSITIVITY (A/W)
0.4
TEMPERATURE COEFFICIENT (%/˚C)
+1.0
0.3
+0.5
0.2
0
0.1
0 200
400
600
800
-0.5 200
400
600
800
WAVELENGTH (nm)
KGPDB0024EA
WAVELENGTH (nm)
KGPDB0025EA
sRise time vs. load resistance
10 ms (Typ. Ta=25 ˚C, VR=0 V)
sDark current vs. reverse voltage
1 nA (Typ. Ta=25 ˚C)
1 ms
G1737, G1740 G1737, G1740 G1736 100 pA
100 µs
DARK CURRENT
RISE TIME
G1736 10 pA
10 µs G1735, G1738 G3297 1 µs
1 pA G1735, G1738, G3297
100 ns 2 10
103
104
105
106
100 fA 0.001
0.01
0.1
1
10
LOAD RESISTANCE (Ω)
KGPDB0026EA
REVERSE VOLTAGE (V)
KGPDB0027EA
sShunt resistance vs. ambient temperature
10 TΩ (Typ. VR=10 mV)
sShort circuit current linearity
100 10
-2
(Typ. Ta=25 ˚C, A light source fully illuminated)
1 TΩ
G1735, G1738, G3297
RL=100 Ω
OUTPUT CURRENT (A)
SHUNT RESISTANCE
G1736 100 GΩ
10 10 10
-4
-6
10 GΩ G1737, G1740
-8
1 GΩ
10-10 10-12 10
-14
100 MΩ
DEPENDENT ON NEP
10 MΩ -20 0 20 40 60 80
10
-16
10-16 10-14 10-12 10-10
10-8
10-6
10-4
10-2
100
AMBIENT TEMPERATURE (˚C)
KGPDB0028EA
INCIDENT LIGHT LEVEL (lx)
KGPDB0008EA
GaAsP photodiode
sDimensional outlines (unit: mm) ➀ G1735
WINDOW 3.0 ± 0.2 5.4 ± 0.2
Diffusion type
➁ G1736
9.1 ± 0.2 WINDOW 5.9 ± 0.1
3.55 ± 0.2
PHOTOSENSITIVE SURFACE 0.45 LEAD
PHOTOSENSITIVE SURFACE 0.45 LEAD
2.4
2.9
5.08 ± 0.2 Borosilicate glass window may extend a maximum of 0.2 mm beyond the upper surface of the cap.
2.54 ± 0.2
CONNECTED TO CASE Borosilicate glass window may extend a maximum of 0.1 mm beyond the upper surface of the cap.
14
CONNECTED TO CASE
KGPDA0012EA
20
4.1 ± 0.2
4.7 ± 0.1
8.1 ± 0.1
KGPDA0013EA
➂ G1737
13.9 ± 0.2
➃ G1738
CATHODE TERMINAL MARK 6.0 ± 0.2
5.0 ± 0.2
WINDOW 10.5 ± 0.1
12.35 ± 0.1
ACTIVE AREA
5.0 ± 0.2
PHOTOSENSITIVE SURFACE
7.5 ± 0.2 MARK ( 1.4)
0.45 LEAD
0.6
3.0 ± 0.2
CONNECTED TO CASE
Borosilicate glass window may extend a maximum of 0.2 mm beyond the upper surface of the cap.
KGPDA0014EA
14
1.5 ± 0.2
PHOTOSENSITIVE SURFACE 0.45 LEAD
1.9
15
KGPDA0002EA
GaAsP photodiode
Diffusion type
➄ G1740
10.1 ± 0.1
8.9 ± 0.1
➅ G3297
5.4 ± 0.2 4.65 ± 0.1
2.15 ± 0.3 14 4.5 ± 0.2
ACTIVE AREA
PHOTOSENSITIVE SURFACE
PHOTOSENSITIVE SURFACE
0.3 0.7
2.0 ± 0.1
0.45 LEAD
10.5
0.5 LEAD 9.2 ± 0.3 7.4 ± 0.2 ANODE TERMINAL MARK
2.4
2.54 ± 0.2
8.0 ± 0.3
CONNECTED TO CASE Coating resin may extend a maximum of 0.1 mm beyond the upper surface of the package.
KGPDA0010EA KGPDA0009EA
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions. Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. ©2001 Hamamatsu Photonics K.K.
HAMAMATSU PHOTONICS K.K., Solid State Division 1126-1 Ichino-cho, Hamamatsu City, 435-8558 Japan, Telephone: (81) 053-434-3311, Fax: (81) 053-434-5184, http://www.hamamatsu.com
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218 Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 08152-3750, Fax: (49) 08152-2658 France: Hamamatsu Photonics France S.A.R.L.: 8, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10 United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777 North Europe: Hamamatsu Photonics Norden AB: Smidesvägen 12, SE-171 41 Solna, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01 Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741
Cat. No. KGPD1003E01 Apr. 2001 DN