Fuse Datasheet
157T Series
Standard Nano2® Fuse and Clip Assembly
RoHS
PS
E
Description
The 157T Series Fuse/Clip assembly is a small, square, Time-Lag,
surface mount fuse that is assembled in surface mountable fuse
clips. The unique time delay feature of this fuse design helps
solve the problem of nuisance “opening” by accommodating
inrush currents that normally cause a fast-acting fuse to open.
The fuse clip and pre-installed fuse combination can be
automatically placed in PC Board in one efficient manufacturing
operation. It permits quick and easy replacement of fuses without
performing desoldering process, even in the field and without
exposing the PC Board to detrimental effects of rework solder
heat.
Features & Benefits
Additional Information
Resources
Accessories
■ Surface Mountable,
Time-Lag Fuse.
■ Easily replaceable on PC
Board (Field Replaceable)
■ Fully compatible with RoHS/
Pb-Free solder alloys and
higher temperature profiles
associated with leadfree
assembly.
■ RoHS Compliant and
Halogen-free
■ Available in ratings of 0.375 ~
5 Amperes.
Applications
Samples
■ Instrumentations
■ Telecommunications
■ Base Stations
Electrical Characteristics for Series
Agency Approvals
Agency File Number
Ampere Range
% of Ampere Rating
% of Ampere Rating
Opening Time at 25ºC
E14721
0.375A ~ 5A
100%
0.375A ~ 5A
NBK030205-E10480B
1A - 5A
200%
0.375A ~ 5A
Note: PSE/METI Certification is only applicable to the fuse. Clips do not require certification for the
Japanese Market
300%
0.375A ~ 5A
800%
0.375A ~ 5A
4 hours, Minimum
1 sec. Minimum,
60 secs. Maximum
0.20 secs. Minimum,
3.00 secs. Maximum
0.02 secs. Minimum,
0.10 secs. Maximum
Agency
PS
E
Electrical Specifications by Item
Ampere
Rating (A)
Amp Code
Max Voltage
Rating (V)
Interrupting
Rating
(A)
Fuse
Furnished
Nominal Cold
Resistance (Ohms)
Nominal
Melting
I2t (A2sec)
Agency Approvals
PS
E
0.375
0.375
125
454.375
1.2214
0.101
X
-
0.50
0.500
125
454.5
0.7047
0.240
X
-
0.75
0.750
125
454.75
0.3602
0.904
X
-
1.00
1.0
125
454001.0
0.2245
1.98
X
X
1.50
1.5
125
2.00
2.0
125
45401.5
0.0934
3.65
X
X
454002.0
0.0629
8.20
X
2.50
2.5
X
125
45402.5
0.0452
15.0
X
3.00
X
3.0
125
454003.0
0.0342
20.16
X
X
3.50
3.5
125
45403.5
0.0226
26.53
X
X
4.00
4.0
125
454004.0
0.0188
34.40
X
X
5.00
5.0
125
454005.0
0.0138
53.72
X
X
50A @ 125VAC/VDC
1. Cold resistance measured at less than 10% of rated current at 23ºC.
2. I2t values stated for 8ms opening time.
3. Agency Approval Table Key: X=Approved or Certified, P=Pending and Blank=Not Approved
4. Have special electrical characteristic needs? Contact Littelfuse to learn more about application specific options
1
© 2021 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: GD. 09/24/21
Fuse Datasheet
157T Series
Standard Nano2® Fuse and Clip Assembly
Temperature Re-rating Curve
2.0A
2.5A
3.0A
3.5A
4A
5A
.75A
1.0A
1.5A
100
.50A
.375A
Average Time Current Curves
TIME IN SECONDS
10
1
0.1
Note:
1. Rerating depicted in this curve is in addition to the standard derating of 25% for continuous operation.
0.01
0.001
0.1
1
10
100
CURRENT IN AMPS
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (Min to Max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus Temp (TL) to
peak
5°C/second max
TS(max) to TL - Ramp-up Rate
5°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
5°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
2
tL
Ramp-down
TS(min)
25
Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
250+0/-5 °C
Ramp-down Rate
tP
TP
Temperature
Reflow Condition
Preheat
tS
time to peak temperature
(t 25ºC to peak)
Time
© 2021 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: GD. 09/24/21
Fuse Datasheet
157T Series
Standard Nano2® Fuse and Clip Assembly
Product Characteristics
Body: Ceramic
Cap: For 0.375A ~ 5A – Silver plated Brass
Clip Plating: Matte Tin
Materials
Product Marking
Operating Temperature -55ºC to 125ºC with proper derating
Body: Brand Logo, Current Rating, “T” for
Time-Lag
Clip Retention
Force applied at fuse center, perpendicular to
the long axis (@0.75 lbs. MIN)
Solderability
MIL-STD-202, Method 208 / IPC/ EIA /
JEDEC J-STD-002, Test Condition A
Humidity Test
MIL –STD-202, Method 103 @ 85ºC / 85%RH,
1000 hours
Resistance to
Solvents
MIL-STD-202, Method 215 (3 solvent types)
Thermal Shock
MIL-STD-202, Method 107, Test Condition B
(5 cycles -65ºC to +125ºC)
Vibration
MIL-STD-202, Method 201 (10-55 Hz)
Moisture Resistance
MIL-STD-202, Method 106, 10 cycles
Salt Spray/
Atmosphere
MIL-STD-202, Method 101, Test Condition B
(48 hrs.), 5% NaCl in De-ionized Water
Shock
MIL-STD-202, Method 213, Test Condition I
(100 G’s peak for 6 milliseconds)
Part Numbering System
Dimensions
6.50 ± 0.20
[0.256]
0157 005. D R T
6.10
[0.240]
2.69
[0.106]
LF
Series
T
3.7 ± 0.13
[0.146]
Time-Lag Fuse
2.69
[0.106]
1A
Packing Option
Amp code
1.45
[0.057]
R = Tape and Reel
Quantity Code
3.70
[0.146]
D = 1500 pcs
3.40
[0.134]
3.90 ± 0.13
[0.154]
Packaging
2.50 ± 0.2
[0.098]
"A"
"B"
0.10
Packaging
Option
Packaging
Specification
Quantity
Quantity &
Packaging Code
Tape and Reel
Surface Mount
1500
DRT
7.26
[0.29]
2.46
[0.10]
3.00
[0.12]
2.40
[0.09]
PCB Recommendation for Thermal Management
1. Minimum Copper Layer Thickness = 100um
2. Minimum Copper Trace Width = 10mm
Note:
Alternate methods of thermal management may be used. In such cases, under normal operations, the maximum
temperature of the fuse body should not exceed 80ºC in a 25ºC ambient environment.
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are
not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics.
3
© 2021 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: GD. 09/24/21
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