0225006.HXUP

0225006.HXUP

  • 厂商:

    HAMLIN

  • 封装:

    D4.5xL14.8mm

  • 描述:

    一次性保险丝(熔断) 6A 125V

  • 数据手册
  • 价格&库存
0225006.HXUP 数据手册
WIRELESS COMMUNICATIONS DIVISION VCC1 VCC2 RFIN GND GND Match VCTRL Match TQM7638 DATA SHEET 3V HBT SiGe PCS Band CDMA 4x4mm POWER AMPLIFIER MODULE RFOUT GND Bias Control VREF GND Features Product Description: The TQM7638 is a 3V, 3 stage SiGe HBT Power Amplifier Module designed for use in mobile phones. Its extremely small 4x4mm package makes it ideal for today’s extremely small data enabled phones. Its RF performance meets the requirements for products designed to IS-95/98 standards. The TQM7638 provides the capability to be operated in one, two, or continuous quiescent current modes. In digital quiescent current mode operation, the TQM7638 is controlled from the base-band processor using a CMOS compatible ICQ control voltage. Overall current consumption of the device is minimized by selecting the lowest ICQ state available for each power output level. RF input and output matching is included within the module; therefore, minimal external circuitry is required. The TQM7638 gives excellent RF performance with low current consumption resulting in longer talk times in portable applications. The small 6mm square surface mount package is ideal for new generation small and light phones. Electrical Specifications: Parameter Min Frequency CDMA mode Typ 1850 Pout1 CDMA Mode Efficiency1 Max Units 1910 MHz 28 dBm 31 % Note 1: Test Conditions CDMA Mode: VCC1=3.4VDC, VCC2=3.4VDC, VREF =2.90VDC, VCTRL=0.5VDC, Tc=25°C, Pout = 28.0dBm For additional information and latest specifications, see our website: www.triquint.com § Analog continuous bias capability with excellen linearity over 1.9 to 3.0VDC and temperature stability over –30C to 85C § Excellent PAE § Small 10 pin 4x4mm module § 1xRTT Compatible § Industry compatible digital quiescent current state control § Analog continuous bias capability § CMOS compatible logic input § Internally matched input and output § Full ESD Protection § Low leakage current Applications § Tri Mode CDMA phones § PCS Band CDMA based mobile phones 1 TQM7638 - Preliminary Data Sheet Absolute Maximum Ratings Symbol Parameter Absolute Maximum Units Value VCC1, VCC2 Power Supply Voltage, no RF Applied -0.5 to 6.0 RF Applied -0.5 to 5.0 Bias reference voltages (VREF) and bias control voltage (VCTRL). -0.5 to 5.0 VDC 2.5 W Case Temperature, Survival -40 to +100 °C TSTG Storage Temperature -40 to +150 °C RFIN DC Grounded RF input, 50ohm RF impedance 0 to 0V VDC RFOUT DC Blocked RF output, 50 ohm RF impedance -20V to 20V VDC VREF, VCTRL PDISS Power Dissipation TC VDC Note: The part may not survive all maximums applied simultaneously. CDMA Mode Electrical Characteristics1,2,3 Parameter Conditions RF Frequency Min. Typ/Nom 1850 Max. Units 1910 MHz Pout, ICQ-hi VCTRL = low 28 dBm Large Signal Gain, ICQ-hi Pout = 28dBm, VCTRL = low 29 dB Large Signal Gain, ICQ-low Pout = 15dBm, VCTRL = high 26 dB Gain Variation vs. Temp. -30 to 85 °C, Pout=28dBm +/-2.5 dB Quiescent Current, ICQ-hi VCTRL = low 124 mA Quiescent Current, ICQ-low VCTRL = high 82 mA Icc Pout = 28dBm, VCTRL = low 607 mA Power Added Efficiency Pout = 28dBm, VCTRL = low 31 % Adjacent Channel Power (ACP) Pout = 28dBm, VCTRL = low, IS-95 Standard -49 Alternate Channel Power (ALT) Pout = 28dBm, VCTRL = low, IS-95 Standard -58 dBc Output Power Low-Power Icq state ACPR=-47dBc, VCTRL = high, IS-95 Standard 15 dBm 2 For additional information and latest specifications, see our website: www.triquint.com - dBc Preliminary - TQM7638 Data Sheet CDMA Mode Electrical Characteristics1,2,3 (cont’d) Noise Power in Rx band Pout=28dBm, VCTRL = low, IS-95 Standard -88 dBm/30KHz Input VSWR Both ICQ-hi & ICQ-low 2:1 Second Harmonic Pout=+28dBm, VCTRL = low, IS-95 Standard 2.7VDC Continuous Gnd ~1.9 to Bias Off 3.0VDC Low 0VDC are a number of VCO signals and IF signals used in a given phone design, so it is important to protect the PA module from interfering signals and to limit any interference coming from the PA itself. Care should be taken when removing any of the RF bypassing components. One final area of concern is with excessive bypassing. If too large a value of bypassing capacitor is used on the control line, it could reduce the frequency response of the control line to the point where a specification failure could occur. Please be sure that the logic line and regulated supply lines driving the power amplifier Application control lines are adequate to supply peak current requirements of The applications circuit for the TQM7638 is very simple since most the bypassing capacitors chosen on the control lines. of the critical components are included inside the module. There are several important considerations when using the module in a phone design. One Bias State Operation The TQM7638 can be operated using one bias state. If this mode First of all, it is important that the source impedance of the VCC is selected, VCNTRL should be connected to ground. power supply be very low. This is because the high current demand during the modulation peaks of the CDMA waveform can Continuous Bias State Operation introduce voltage ripple at the symbol rate that will introduce The TQM7638 can be operated in continuous bias mode in which additional inter-modulation distortion or Adjacent Channel Power the VREF voltage is varied from ~1.9V to 3.0V to set the PAM distortion at the output of the power amplifier. If the power quiescent current as appropriate for the desired output power amplifier has a quiescent current of 100 mA and a peak current level. In this mode, VCNTRL should be connected to ground on the demand in excess of 1 amp, it is possible to see 900 mA change phone board. Specific application circuit information for this mode in the current required from VCC as the modulated signal moves is available upon request. from one extreme to the other. If the power supply source For additional information and latest specifications, see our website: www.triquint.com 5 TQM7638 - Preliminary Data Sheet Package Pin-Out: 1 10 VCC1 VCC2 2 GND RFIN RFOUT Match 3 9 Match 8 GND 4 VCTRL Bias Control VREF 5 GND 7 GND 6 Pin Descriptions: Pin Name Pin # Description and Usage (Equivalent Circuit) GND Paddle Device Ground and Heat Sink. Needs good thermal path to remove heat. VCC1 1 Collector supply for input stage. RFin 2 RF input. The RF circuit is DC grounded. 50 Ohm RF impedance. VCTRL 4 CMOS compatible logic level to set bias level VREF 5 Regulated supply for setting bias. Vref is set to 0VDC to power-off the TQM7638 RFOUT 8 RF output. The RF circuit is DC blocked internally. 50 ohm RF impedance. VCC2 10 Collector supply for output stage. GND 3, 6, 7, 9 Ground TriQuint recommends use of several via holes to the backside ground under the Paddle. 6 RFin For additional information and latest specifications, see our website: www.triquint.com Preliminary -TQM7638 Data Sheet Recommended PC board layout to Accept 10 Pin Module Package: T J U K D S N M E DIMENSION D E J K M N S T U MM 3.85 4.30 0.68 0.45 0.85 1.90 3.80 2.00 1.00 Notes: 1 Only ground signal traces are allowed directly under the package 2 Primary dimensions are in millimeters alternate dimensions are in inches. For additional information and latest specifications, see our website: www.triquint.com 7 TQM7638 - Preliminary Data Sheet Package Type: 10 Pin Plastic Module Package Pin 1 10 Pin 1 Indicator 2 9 3 8 4 7 5 6 Side View Top View 5 6 4 7 3 8 2 9 1 10 Bottom View 8 For additional information and latest specifications, see our website: www.triquint.com Preliminary - TQM7638 Data Sheet Package Type: 10 Pin Plastic Module Package (cont’d) DESIGNATION DESCRIPTION A OVERALL HEIGHT D PACKAGE LENGTH DIMENSION 1.06 +/-0.09 mm 4.0 +/-0.1 mm E PACKAGE WIDTH J SOLDER MASK OPENING LENGTH AND WIDTH 4.0 +/-0.1 mm K METAL PAD LENGTH AND WIDTH 0.40 +/-0.05 mm P DISTANCE BETWEEN METAL PAD AND PACKAGE EDGE 0.10 +/-0.025 mm 0.575 +/-0.075 mm T GND SOLDER MASK OPENING WIDTH 2.00 +/-0.05 mm S GND SOLDER MASK OPENING LENGTH 3.80 +/-0.05 mm R DISTANCE BETWEEN GND SOLDER MASK OPENING AND PACKAGE EDGE 0.10 +/-0.1 mm Q DISTANCE BETWEEN GND SOLDER MASK OPENING AND PACKAGE EDGE 1.00 +/-0.1 mm e TERMINAL PITCH FOR TERMINAL 1-10, 2-9, 3-8, 4-7 AND 5-6 3.400 mm e1 TERMINAL PITCH FOR TERMINAL 1-2-3-4-5 AND 6-78-9-10 0.850 mm Notes: 1. GND SOLDER MASK OPENING IS NOT CENTERED ON THE PACKAGE Additional Information For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Tel: (503) 615-9000 Email: info_wireless@tqs.com Fax: (503) 615-8902 For technical questions and additional information on specific applications: Email: info_wireless@tqs.com The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems. Copyright © 2002 TriQuint Semiconductor, Inc. All rights reserved. Revision 0.4, September 24, 2002 For additional information and latest specifications, see our website: www.triquint.com 9
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