0402SFF075F/24-2

Surface-mount Fuses – Fundamentals Surface-mount Fuses Fundamentals Overview TE Circuit Protection offers the widest selection of surface-mount fuses available for addressing a broad range of overcurrent protection applications. Helping ng to prevent costly damage and promote a safe environment nt for electronic and electrical equipment, our single-use chip fuses provide performance stability to support applications with current urrent ratings from .5A up to 20A. TE Circuit Protection also offers fers the telecom FT600 fuse for telecommunications applications. ons. This telecom fuse helps comply with North American overcurrent current protection requirements, including Telcordia, GR-1089, TIA-968-A (formerly FCC Part 68), and UL60950 3rd edition. Multi-layer Design for Chip hip Fuses The multi-layer design has the he benefit of exposing more fuse fuse element surface area to the glass-ceramic absorptio absorption on material. m mate erial. When the fuse elements open, en, there is more material mate erial for fo the th he vaporizing fuse metals to absorb efficient orb into, resulting in n a very very ef e fiicie ent and effective quenching of the e fuse arc. Figure 1 compared the multi-layer with ayer design desi sig gn of of our SFF S SF FF ffuses usess w ith standard glass coated designs. s. The glass glasss coated coatte ed d designs d de esignss rely re ely on the coating on only one side of the fuse element absorb e fu se el lem mentt tto oa bso orrb tthe he e vaporizing fuse material when it op opens. Therefore, much pens. Th herefo ore e,, tthere here iss mu uch less absorption material available fuse metals. ble to t absorb abs ab b orb rb the he ffu use m me tal a s. s The The result can be prolonged arcing possible g and dp osssib ble coating n breach. bre each. ch h Figure 2 shows how the absorption orptiion characteristics ch hara racte eris ri tic iic cs off the he two he designs differ. The multi-layer design desig gn indicates ind dica ate t s a clean clea ean separation ea s paration se n with the fuse element evenly y diffusing diffu usin ng into into o the the surrounding surro oundiing ceramic substrate. In the glass ass coated co oate te ed design, dessign, the tthe element element diffusion takes place in a smalll portion device po ortio on off the the dev vice e and an a n is only absorbed by the glass materiall dir directly above re tly ab rect re bove the e area of failure. Figure F igurre 1 Glass/Ceramic G lass/C Ceramicc Substrate Subsstrate e Multiple Multtiple Fuse Elements Ele emen nts Multi-layer M ulti-laye er Design Substrate Su Material M Single Fuse Glass Element Coating Single-layer Glass Coated Design Sin Figure Figu ure e2 Fault Zones Zone 11 Multi-layer Design Single-layer Glass Coated Design Single-la Wire-In-Air Design for 2410SFV 2410 0SFV VF Fuses uses DF use which is very suitable The 2410(6125) is a Wire-In-Airr SMD Fuse t ti li ti for secondary level over currentt protection applications. Figure 3 compared our straight wire element design 2410SFV fuses with normal corrugating wire design fuse. The straight wire element in air performs consistent fusing and cutting characteristics together with excellent inrush current withstanding capability. Introduced PCB assembly technology into 2410SFV fuses design and manufacture, we achieved on lead free completely and no end cap falling off risk comparing with traditional ceramic body with end cap fuse. Figure 3 Glass fiber enforced epoxy body Straight wire element Copper terminal plated with Ni and Tin Ceramic body Corrugate wire element End cap plated with Tin 75 Temperature Derating A fuse is a temperature sensitive nsitive device. Therefore, operating temperature will have an effect on fuse f performance and lifetime. Operating temperature should ould be taken into consideration when selecting the fuse currentt rating. ra ati t ng. The T Thermal Derating Curve for surface mount fuses is presented sented in Figure 4. Use it to determine the derating percentage percenttage based ba ased on operating temperature and apply it to the derated system tem current. Figure 4 105 100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -55 2410 Series S Temper e atu er ure e Effect Effect On O Current Rating Temperature 0 110 5 105 0 100 5 95 % De-rating % De-rating 1206/0603/0402 06/0603/0402 Series ure Effect on Current Rating Temperature 0 90 5 85 0 80 5 75 0 70 5 65 0 60 5 55 -35 -15 5 25 45 65 85 5 1 105 05 5 125 1 5 145 5 0 50 -55 -35 Maximum mum Operating Temperature Tem emperaturre (°C) em (°C)) -1 -15 15 5 25 45 65 85 105 125 Maximum Maxiim mum mu um Operating u Operating Temperature (°C) Pulse Cycle Derating Figure Fi igure e5 Surface-mount Fuse Pulse Derating Curve 100% % of Minimum I2t Once the I2t value for the a application pplica ation waveform ati wa ave eform has h s been ha been b en determined, it must be derated erated db based ased d on the t e number numberr off cycles nu cycle ess expected over the system lifetime. ifetim me.. Since me. Sinc ce e the the stress str trress induced indu n ced by by the th he e current pulse is mechanical nature, number al in nn a ure,, tthe atu he num mb ber be e off ttimes tthe he stress is applied has significant ficant ntt bearing n bea aring ng on n how how w much muc uc derating uch deratting must be applied to the fuse e rating. ra ating. Figure Figu gu ure 5 presents pre re esen nttss the the e current currrent pulse derating curve for our surface-mount su urfa ace-m e oun eou u t chip ch c ip fuses fuses up to 100,000 cycles. 10% 100 1000 10000 100000 Number of Pulses Numbe Selecting Surface-mount ountt Fuses Fus ses 11 Fuse selection seems straightforward, ghtforward, in that, you pick one which has a current rating just a bit higher highe than your worstcase system operating current. Unfortunately, it’s not that simple. There are derating considerations for operating current and application temperature. Turn-on and other system operations (like processor speed changes or motor start up) cause current surges or spikes that also require consideration when selecting a fuse. So selecting the right fuse for your application is not as simple as knowing the nominal current drawn by the system. Fuse Selection Flowchart However, the basic considerations for fuse selection are shown in the flowchart presented in Figure 6. Following this flow chart will help you select a fuse best suited for your application conditions. Figure 6 Step 1 – Determine Steady State Fuse Current Rating Step 2 – Determine Pulse Waveform by Calculating I2t Apply Standard Steady State Derating (75%) [Ifuse ≥ Isys/0.75] Step 3 – Apply Pulse Cycle Derating Step 7 – Select Fuse Current Rating (use higher value between Step 1 and Step 6) 76 Step 4 – Apply Pulse Temperature Derating Apply Temperature Derating [Ifuse ≥ Isys/0.75/Ktemp] Step 5 – Apply Derating for Variance in the Circuit Steady State Fuse Current Rating Step 6 – Select Fuse Current Rating for Pulse Environment Step 8 – Check Voltage Rating NEW Pulse Tolerant chip fusess has high inrush current withstand capability and provide ovide overcurrent protection on DC power systems. Silver er fusing element, monolithic and multilayer design provides vides strong arc suppression characteristics. These RoHS-compliant surface-mount ace-mount devices facilitate e the development of more reliable, high performance performanc ce consumer electronics such ch as laptops, multimedia multi time ti m dia devices, cell phones, and other ther portable electronics. electro onics s. Benefits Surface-mount Fuses – Pulse Tolerant Chip Fuses Surface-mount Fuses Pulse se Tolerant T l t Chip Chip Fuses F Features • High inrush current withstanding capability tand ding gc apa pability y • Lead free materials and RoHS compliant • Ceramic Monolithic structure ure • Halogen free (refers to: Brⱕ900ppm, Clⱕ900 Clⱕ900ppm, Br+Clⱕ1500ppm) • Silver fusing element and silve silver er termination term mina nation with nickel and tin plating • Monolithic, multilayer design • Excellent temperature stability bility • High-temperature performance performanc • Strong arc suppression characteristics • -55°C to +125°C operating temperature range 11 Applications • Laptops • Printers • Game systems • Digital cameras • DVD players • LCD monitors • Cell phones • Portable electronics • Scanners 77 Table FP1 Clear Time e Characteristics for Pulse Tolerant Chip Fuses % of rated current 100% Clear time at 25°C 4 hours (min.) 200% 1 seconds (min.) 60 seconds (max (max.) max m ma a .) 1000% 0.0002 second (min.) 0.02 seconds dss ((max.) max ax.) Table FP2 Typical Electrical ectrical Characteristics an and nd D Dimensions ime ension ns forr P Pulse uls se T Tolerant oleran Chip Fuses 0603 (1608 mm) Pulse e Tolerant Chip Fuses s Typical T ypica Electrical El lectrica al Ch Characteristics ara D A Part P art Number Nu umbe mb r Shape and Dimensions mm (Inch) B C B A mm in C D Min Max Min Ma ax Max in Min x Max Mn Min Max 1.45 1.75 0.65 0.9 95 0.95 0.2 21 0.21 0.51 0.51 0 .65 5 0.65 0.95 5 (0.057) (0.069) (0.03 37) (0.026) (0.037) (0.008 (0 0 ) (0.020) 08 (0.0 020) (0.008) (0.02 26) (0.037) (0. 0 037) (0.026) Ratted d Rated Current Curren re t (A) Nominal Nomin Nominal I2t Cold DC DCR (A2sec)† (Ω)* Max. Interrupt Ratings Voltage (VDC) Current (A) 0603SFP100F/32-2 06 060 603 3S 3SF S P100F/3 32-2 2 1. 1.0 0 0.210 0.080 32 50 0603SFP150F/32-2 0603SF SFP150F/ F//32-2 1.5 0.101 0.11 32 50 0603SFP200F/32-2 0603SF SFP20 200F/32-2 20 2.0 0.057 0.24 32 50 0603SFP250F/32-2 0603S 3S SFP250F/32-2 2.5 0.042 0.56 32 50 0603SFP300F/32-2 0 06 060 6 3SFP300F/32-2 3.0 0.030 0.72 32 50 0603SFP350F/32-2 3.5 0.022 1.10 32 50 0603SFP400F/32-2 4.0 0.018 2.08 32 50 0603SFP450F/32-2 4.5 0.014 2.63 32 50 0603SFP500F/32-2 5.0 0.013 3.25 32 50 1206 (3216 mm) Pulse e Tolerant Toler e antt Chip Chi h p Fuses Typical Typica Electrical Chara Characteristics Max. Interrupt Ratings D A 11 Part Number Shape and Dimensions mm (Inch) B C A mm in B C D Min Max Min Max Min Max Min Max 3.00 3.40 0.77 1.17 0.26 0.76 1.40 1.80 (0.118) (0.134) (0.030) (0.046) (0.010) (0.030) (0.055) (0.071) Rated Current (A) Nominal Nominal I2t Cold DCR (A2sec)† (Ω)* Voltage (VDC) Current (A) 1206SFP100F/63-2 1.0 0.340 0.11 63 50 1206SFP150F/63-2 1.5 0.150 0.33 63 50 1206SFP200F/63-2 2.0 0.090 0.80 63 50 1206SFP250F/32-2 2.5 0.070 1.19 32 50 1206SFP300F/32-2 3.0 0.035 1.35 32 50 1206SFP350F/32-2 3.5 0.029 1.84 32 50 1206SFP400F/32-2 4.0 0.023 2.74 32 50 1206SFP450F/32-2 4.5 0.021 3.20 32 50 1206SFP500F/32-2 5.0 0.017 5.50 32 50 * Measured at ⱕ10% of rated current and 25°C ambient temperature. † Melting I2t at 0.001 sec clear time. 78 RoHS Compliant, ELV Compliant HF Halogen Free Surface-mount Fuses – Pulse Tolerant Chip Fuses Figure FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses Figure FP1 4.5 A 5.0 A A A A 3.0 4.0 A 2. 5 3.5 A 2. 0 1.5 A 1.0 A 0603SFP Average Time Current Curves 100 10 Clear Time (s) 1 0.1 0.01 0.001 0.0001 1 10 0 100 Current C urrr rrent (A) rre (A) A) Figure FP2 0603SFP 06 060 03SF 3 P I2T vs. t Curves 10,000 5.0A 4.5A 4.0A 3.5A 3.0A 2.5A 2.0A 1000 11 1.5A 1.0A I2t (A2s) 100 10 1 0.1 0.01 0.0001 0.001 0.01 0.1 1 10 100 Time (s) Note: Curves are nominal RoHS Compliant, ELV Compliant HF Halogen Free 79 Figure FP1-FP4 Family Performance Curves for Pulse Tolerant Chip Fuses Cont’d Figure FP3 A 2. 5 3.0 A 3.5 A 4.0 A 4.5 A 5.0 A A 2. 0 1.0 A 1.5 A 1206SFP Average Time Current Curves 10,000 Clear Time (s) 100 1 0.01 0.001 10 1 100 Current (A) (A)) Figure FP4 1206SFP I2T vs. t Curves 5.0A 4.5A 4.0A 3.5A 3.0A 2.5A 2.0A 1.5A 1.0A 10,000 11 I2t (A2s) 100 1 0.01 0.0001 0.01 1 Time (s) Note: Curves are nominal  Please go to page 97 for more information for Pulse Tolerant Chip Fuses. 80 RoHS Compliant, ELV Compliant HF Halogen Free 100 10,000 Surface-mount Fuses – 0603 Very Fast-Acting Chip Fuses Surface-mount Fuses 0603 Very Fast-Acting Chip Fuses NEW Very Fast-acting chip fuses help provide overcurrent protection on systems using ng DC power sources up to c, multilayer design provides 32VDC. The fuse’s monolithic, the highest hold current in the smallest footprint, reduces diffusion-related aging, improves product reliability and resilience, and d enhances high-temperature performance in a wide range ge of circuit designs. These RoHS-compliant surface-mount urface-mount devices offer strong arc suppression characteristics racteristics and facilitate the development of more reliable, eliable, high performance e consumer electronics such ch as laptops, multimedia multimediia devices, cell phones, and other ther portable electronics. electroni nics ni c . Benefits Features F eattures • Very fast acting at 200% and 30 300% 00% % overloads o erload ov ads ad • Lead Lead free materials and RoHS compliant • Excellent inrush current withs withstanding capability stand ding gc ap pab bil i ity y at at high overloads • Halogen free • Thin body for space limiting ng applications app plic cation ns • Monolithic, multilayer design • Glass ceramic monolithic structure stru uctu ure e • High-temperature performance performanc • Silver fusing element and silve silver er termination terminatio on with nickel and tin plating temperature range • -55°C to +125°C operating tem (refers to: Brⱕ900ppm, Clⱕ900 Clⱕ900ppm, Br+Clⱕ1500ppm) 11 • RoHS compliant and lead-free -free e materials matte terials • Symmetrical design with marking markin ing on on both sides (optional) Applications • Laptops • Printers • Game systems • Digital cameras • DVD players • LCD monitors • Cell phones • Portable electronics • Scanners 81 Table FV1 Clear Time Characteristics for Very Fast-Acting Chip Fuses % of rated current 100% Clear time at 25°C 4 hours (min.) 200% 0.01 second (min.) 5 seconds (max.) 300% 0.001 second (min.) 0.2 seconds (max.) ectrical Characteristics and Dimensions for or Very or ry y Fast-Acting Fast-Ac Fa Table FV2 Typical Electrical Chip Fuses 0603 (1608 mm) Very y Fast-Acting Chip Fuses Typical Typ yp y pica cal El ca Electrical lectrrical Cha Characteristics aracter D Nominal Nomina al Cold Co old D DC DCR CR (Ω)* (Ω Ω)* No Nominal I2t (A2sec) Voltage (VDC) Current (A) 0603SFV050F/32-2 0603S 3SFV05 3S 50F/32 2-2 0.5 0.5 0.860 0.86 60 0.0093 0.0 32 50 0603SFV075F/32-2 0603S SFV07 75F/32 2-2 0.8 0.8 0.450 0.450 50 0.0191 0.0 32 50 0603SFV100F/32-2 0603S SFV10 00F/32 2-2 1.0 1.0 0.280 0.280 0.0360 0.0 32 50 0603SFV125F/32-2 0 060 60 03S SFV12 25F/32 2-2 1.3 0.205 0.205 0.0630 0.0 32 35 0603SFV150F/32-2 0 60 03S SFV15 50F/32 2-2 1.5 0.143 0.143 0.0950 0.0 32 35 Max Max x 0603SFV175F/32-2 060 03SFV17 V17 75F/32 2-2 1.8 1.8 0.095 0.09 095 95 0.1400 0. 32 35 0.95 0603SFV200F/32-2 060 03SFV20 V20 00F/32 2-2 2.0 2.0 0.073 0.2100 0.2 32 35 0603SFV250F/32-2 060 03SF S V25 50F/ F//32 3 2 32- 2.5 0.046 0.3000 0.3 32 35 0603SFV300F/32-2 060 03S SFV30 00F/3232 2 3.0 0.039 0.4600 0.4 32 35 0603SFV350F/32-2 060 03S SFV350F/3232 2 3.5 0.028 0.7300 0.7 32 35 0603SFV400F/32-2 060 06 603S 60 SFV400F/3232--2 4.0 4.0 0.023 1.1500 1. 32 35 0603SFV450F/32-2 0 060 3S SFV450F/ 0F F//32-2 F 4.5 0.019 1.6800 1.6 32 35 0603SFV500F/32-2 0603 3S V 3SF V50 V5 50 5 00F/32-2 5.0 0.015 2.6200 2.6 32 35 A Par art Nu ar art mb ber Part Number Shape and Dimensions mm (Inch) B C A Min mm in B Max 1.45 1.75 Min 0.22 C Max ax 0.48 48 Min 0.21 1 D Max ax ax 0.51 0. 51 Min Miin M n 0.65 65 6 5 Max. Interrupt Ratings Rated R ated Currentt (A ((A) A (0.057) (0.069) (0.009) (0.019) 19) (0.008) (0..008) (0.020) (0 0.0 020) (0.025) (0.0 025) (0.037) (0.03 37 3 7) * Me Measured easured at 10% of rated current and 25°C Figure FV1-FV2 Family ily Pe Performance erffor orma m nce C Curves urv ves for Very Fast-Acting Chip Fuses Figure FV1 Figure FV2 0603SFV Average erage eT Time ime Cur C Cu Current urre rren re e t Curves 0603SFV I²t vs. t Curves 0.0 5A 0.7 5 1.0 A 0 1. 2 A 5 1.5 A 1.7 0A 2.05 A 2. 5 0 A 3.0 0A 3.5 0A 4.0 0A 4.5 0A 5.0 0A 0A 11 100 1000 5.00A 4.50A 4.00A 3.50A 3.00A 2.50A 2.00A 1.75A 1.50A 1.25A 1.00A 0.75A 0.05A 100 10 10 1 I²t (A²s) Clear Time (s) 1 0.1 0.1 0.01 0.01 0.001 0.001 0.0001 1 10 Current (A) 100 0.0001 0.0001 Note: Curves are nominal  Please go to page 97 for more information for Very Fast-Acting Chip Fuses. 82 RoHS Compliant, ELV Compliant HF Halogen Free 0.001 0.01 0.1 Time (s) 1 10 Fast-acting chip fuses help provide rovide overcurrent protection on systems using DC power er sources up to 63VDC. The fuse’s monolithic, multilayerr design provides the highest hold current in the smallest footprint, reduces diffusionrelated aging, improves product resilience, duct reliability and resilience ce, ce e and enhances high-temperature ature performance in a wide wid de range of circuit designs. These RoHS-compliant surface-mount devices offer urface-mount nt devi nt vice vi es of o ffer e strong arc suppression characteristics racterist sttics and facilitate fa aciliita tate the t e th development of more reliable, eliablle, high high performance pe erforma man ma nce consumer electronics such ch ass laptops, lap pto ops,, multimedia mul u time edia a devices, cell phones, and other ther portable portabl ble electronics. electro ronics s. Benefits Surface-mount Fuses – Fast-Acting Chip Fuses Surface-mount rface-mount rface f mountt Fuses F Fast-Acting st-Acting st tA Acting ti g Chip Chip Fuses F Features • Small size with high-current ratings nt ra ating gs • Lead free materials and RoHS compliant • Excellent temperature stability bility • Halogen free • High reliability and resilience • Strong arc suppression characteristics (refers to: Brⱕ900ppm, Brⱕ900ppm Clⱕ900 Clⱕ900ppm, Br+Clⱕ1500ppm) • Monolithic, multilayer design 11 • High-temperature performance • -55°C to +125°C operating temperature range Applications • Laptops • Printers • Game systems • Digital cameras • DVD players • LCD monitors • Cell phones • Portable electronics • Scanners 83 Table FF1 Clear Time e Characteristics for Fast-Acting Chip Fu Fuses uses % of rated current 100% Clear time at 25°C 4 hours min. 250% 5 seconds max. 400% 0.05 seconds max. Table FF2 Typical Electrical ectrical Characteris Characteristics, sti tics c , Dimen Dimensions e siions en s and Re Recommended eco ommended Pad Layout for Fast-Acting g Chip Fuses 0402 (1005mm) Fast-Acting -Acting Chip F Fuses use es Shape and Dimensions Inch (mm) 4 0.020±0.004 (0.51±0.10)) Typical Typ T ypica al El Electrical lectric riical Character ric Characteristics 0.039±0.004 (1.00±0. ± 10) ±0. ±0 1 10 (1.00±0.10) Nominal Cold DCR (Ω)* No Nominal I2t (A2sec)† Voltage (VDC) Current (A) 0402SFF050F/24 040 02SF SFF050F/24 4 0.50 0.50 0.380 0.0043 0.0 24 35 0402SFF075F/24 0 040 02S SFF075F/24 4 0.75 0.210 0.0076 0.0 24 35 0402SFF100F/24 0 040 04 4 2S SFF100F/ F/2 /24 1.00 1.00 0.120 0.0170 0.0 24 35 0.063 3 (1.60) (1.60 0) 0402SFF150F/24 0402S SFF15 150F/24 1.50 0.056 0.0490 0.0 24 35 0.016 (0.40 (0.40) 0) 0402SFF200F/24 0402 2SFF200F/24 2.00 0.035 0.0700 0.0 24 35 0402SFF300F/24 040 402SFF300F/24 40 3.00 0.021 0.1250 0.1 24 35 0402SFF400F/24 4.00 0.014 0.2 0.2250 24 35 Par rt Nu N mbe be ber e Part Number 0.020±0. 0±0 0 0 004 0.020±0.004 (0.51±0.10) (0.51±0. 1±0 0 10) ±0.004 0.010±0.004 ±0.10) (0.25±0.10) Recommended Pad Layout Inch (mm) Max. Interrupt Ratings Ratted Rated Current Curr rentt (A (A) A) 0.028 8 (0.70) (0 0.70 0) 0) 0.024 (0.60) 0603 (1608mm) Fast-Acting Actting gC Chip hip Fuse Fuses es Typical Electrical Character Characteristics Shape and Dimensions Inch (mm) 0.031±0.006 (0.80±0.15) Nominal Cold DCR (Ω)* No Nominal I2t (A2sec)† Voltage (VDC) Current (A) 0603SFF050F/32 0.50 0.485 0.0 0.0029 32 50 0603SFF075F/32 S 0.75 0.254 0.0064 32 50 0603SFF100F/32 1.00 0.131 0.0160 32 50 0603SFF150F/32 1.50 0.059 0.0300 32 35 0603SFF200F/32 2.00 0.044 0.0600 32 35 0603SFF250F/32 2.50 0.032 0.1150 32 35 0603SFF300F/32 3.00 0.025 0.1900 32 35 0603SFF350F/32 3.50 0.024 0.2950 32 35 0603SFF400F/32 4.00 0.018 0.4000 32 35 0603SFF500F/32 5.00 0.013 0.7000 32 35 0603SFF600F/24 6.00 0.010 1.1250 24 35 Part Number 1206SFF050F/63 Rated Current (A) 0.50 Nominal Cold DCR (Ω)* 0.730 Nominal I2t (A2sec)† 0.0021 Voltage (VDC) 63 Current (A) 50 1206SFF075F/63 0.75 0.513 0.0052 63 50 1206SFF100F/63 1.00 0.220 0.0120 63 50 1206SFF150F/63 1.50 0.120 0.0250 63 50 1206SFF175F/63 1.75 0.100 0.0450 63 50 1206SFF200F/63 2.00 0.050 0.0700 63 50 1206SFF250F/32 2.50 0.035 0.1400 32 50 1206SFF300F/32 3.00 0.031 0.2200 32 50 1206SFF400F/32 4.00 0.022 0.3800 32 45 0.173 (4.40) 1206SFF500F/32 5.00 0.015 0.6000 32 45 0.059 (1.50) 1206SFF600F/32 6.00 0.013 1.0000 32 50 1206SFF700F/32 7.00 0.011 1.7500 32 50 1206SFF800F/32 8.00 0.008 2.5000 32 50 1206SFF600F/24 6.00 0.013 1.0000 24 45 1206SFF700F/24 7.00 0.011 1.7500 24 45 1206SFF800F/24 8.00 0.008 2.5000 24 45 Part Number 0.031±0.006 (0.80±0.15) (0 80±0 15) 0.014±0.006 (0.36±0.15) Recommended Pad Layout Inch (mm) 0.110 (2.80) 0.024 (0.60) 11 Max. Interrupt Ratings Rated Current (A) 0.063±0..006 0.063±0.006 (1.60±0 0.15) (1.60±0.15) 0.039 (1.00) 0.043 (1.09) 1206 (3216mm) Fast-Acting Chip Fuses Typical Electrical Characteristics Shape and Dimensions Inch (mm) 0.063±0.008 (1.60±0.20) 0.126±0.008 (3.20±0.20) 0.043±0.008 (1.10±0.20) 0.020±0.010 (0.51±0.25) Recommended Pad Layout Inch (mm) 0.071 (1.80) 0.057 (1.45) * Measured at ⱕ10% of rated current and 25°C ambient temperature. † Melting I2t at 0.001 sec clear time. 84 RoHS Compliant, ELV Compliant HF Halogen Free Max. Interrupt Ratings Figure FF1 Figure FF2 0402SFF 040 0 40 02SFF I² I²t ²t vs. t Curves 2. 0 A 3.0 4.0A A 0.5 A 0.7 5 1.0 A 1.5A A 0402SFF Average e Time Current Curves 1000 10 4.0A 3.0A 2.0A 1.5A 100 0 1.0A 0.75A 1 0.5A II²tt (A²s) (A²s) A s) Clear-Time (s) 10 0 0.1 1 0.1 1 0.01 Surface-mount Fuses – Fast-Acting Chip Fuses Figure FF1-FF6 Family Performance Curves for Fast-Acting Chip Fuses 0.01 01 0.001 0.1 1 10 0.001 0 .001 0.001 100 10 00 0.01 Current urrentt (A) (A) A) 0.1 1 10 Time (s) Note: Curves are nominal Figure FF3 Figure FF4 0.5 A 0.7 5 1.0 A A 1.5 2 . 0A 2. 5 A 3.0A 3. A 4.5A 5.00A 6 .0A A 0603SFF Average e Tim Time me Cur Cu Current re ent Curve en Curves es 0603SFF I²t vs. t Curves 10 10000 11 6.0A 5.0A 4.0A 3.5A 3.0A 2.5A 2.0A 1.5A 1.0A 0.75A 1000 1 10 0.5A I²t (A²s) Clear-Time (s) 100 0.1 1 0.1 0.01 0.01 0.001 0.1 1 10 Current (A) RoHS Compliant, ELV Compliant HF Halogen Free 100 0.001 0.001 Note: Curves are nominal 0.01 0.1 1 10 Time (s) 85 Figure FF1-FF6 Family ily Performance Curves for Fast-Acting Chip Fuses Fus ses Figure FF5 Cont’d Figure FF6 6 1206SFF Average erage Time Current Curves 0.5 A 0.7 5 1.0 A A 1.5 1.7 A 2.05 A 2. 5 A 3.0A 4.0A 5.0A 6 .0A 7.0 A 8 .0A A 1206SFF 120 206S SFF I²t vs. t Curves 10000 10 8.0A 7.0A 6.0A 5.0A 4.0A 3.0A 2.5A 2.0A 1.75A 1.5A 1.0A 1000 10 000 1 100 0.5A I²t (A²s) Clear-Time (s) 0.75A 10 0.1 1 0.1 0.1 0.01 0.01 0.001 0.1 1 10 0.001 0.001 100 Note: Curves are nominal  Please go to page 97 for more e iinformation nforrmation for Fast-Acting Chip Fuses. 11 86 RoHS Compliant, ELV Compliant HF Halogen Free 0.01 0.1 Time (s) Tim Current Cu urren en nt (A) (A) 1 10 The monolithic multilayer design of the TE Circuit Protection high-current-rated chip fuses helps to provide some of the highest current ratings available in the 1206 size and enhances nhances high-temperature performance in a wide range ange of circuit protection designs. The devices’ small all size, high reliability and strong arc suppression characteristics make them High-Current Rated Chip Fuses Surface-mount Fuses High-Current-Rated Chip Fuses suitable for overcurrent protection otection of power supplies, servers, communications equipment, quipment, voltage regulator modules, and other high-current, rrent, small size applications. Benefits • Glass ceramic monolithic structure provides struc ctu ure r p pr rov vide id des st sstability tabilitty in application cycling Features F eaturres • Lead Lead ffree rre ee materials and RoHS compliant • Halogen Hallogen free • High-current rating in a small mall package pa ackage ge allows ws more ws mo m ore e efficient use in system space ace • Monolithic multilayer design • Strong arc suppression in overcurrent ove erc currrent n conditions co ondit itions • High-temperature performance performanc (refers ((r refers to: Brⱕ900ppm, Clⱕ900 Clⱕ900ppm, Br+Clⱕ1500ppm) 11 temperature range • -55°C to +125°C operating tem Applications • Communications equipment ent • Voltage regulator modules • Power supplies • Servers 87 Table FH1 Clear Time e Characteristics for High-Current-Rated Chip pF Fuses uses 1206SFH Series % of rated current 100% 250% Table FH2 Clearr time at 25°C 4 hours (min.) 5 seconds econds (max.) Typical Electrical ectrical Characteristics, D Dimensions im men nsiions sa and nd Re nd Recommended eco omm mmended Pad Layout for High-Current-Rated ent-Rated Chip Fuses 1206 (3216mm) High-Current-Rated Current-Rated Chip p Fuse Fuses es Shape and Dimensions Inch (mm) 0.063±0.008 (1.60±0.20) Typ Typical picall E Electrical lectrical Characteristics Cha ha aracteristics Rate ed Nominal Rated Nominal N Curren en nt Current Cold DCR I2t (A)) (Ω)* (A2sec)† 0.126±0.008 0.126±0.00 08 (3.20±0.20) (3.2 3.2 20±0.20 0) Part Par rt Number Nu umbe m r 0.038±0.008 0.03 38±0 0.008 (0.97±0.20) (0..97±0. 0 20) 2 Voltage (VDC) Current (A) 1206SFH100F/24 120 06SFH100F/ 0F 24 10 0.010 9 24 100 120 206SFH120F/ 0F 24 24 1206SFH120F/24 12 12 0.008 14 24 100 12 206SFH15 50F/24 1206SFH150F/24 15 0.005 26 24 100 12 206SF FH200F/24 1206SFH200F/24 20 0.003 56 24 100 * Mea sured at ⱕ10% of rated current and 25°C ambien Measured ambient temperature. † Melting Melting I2t at 0.001 sec clear time. 0.020±0.010 0.020±0. ± 01 10 (0.51±0.25) (0.51± ±0.25) Recommended Pad Layout Inch (mm) Max. Interrupt Ratings 0.173 (4.40) 0.059 (1.50) 0.071 (1.80) 0.057 (1.45) Figure FH1-FH2 Family ily Pe P Performance erfformance Curves for High-Current-Rated Chip Fuses Fus Figure FH1 Figure FH2 1206SFH Average Time Current Curves A 1206SFH I²t vs. t Curves 20 10 A 12 A 15 A 11 10 10000 20A 15A 12A 10A 1000 I²t (A²s) Clear Time (s) 1 0.1 0.01 100 10 0.001 10 100 Current (A) 1000 1 0.001 Note: Curves are nominal  Please go to page 97 for more information for High-Current-Rated Chip Fuses. 88 RoHS Compliant, ELV Compliant HF Halogen Free 0.01 0.1 Time (s) 1 10 Surface-mount Fuses – Slow-Blow Chip Fuses Surface-mount Fuses Slow-Blow Chip Fuses Available in industry standard rd 1206 and 0603 chip sizes, TE Circuit Protection’s slow-blow low-blow chip fuses help provide overcurrent protection tection on systems that experience large and frequent ent current surges as part of their normal operation. The slow-blow chip fuse’s monolithic, multilayer design helps provide some of the he highest current ratings available in the 1206 and 0603 603 footprints and enhancess high-temperature performance nce in a wide range of circuit circu uit protection designs. The devices’ small size, size e, high hig gh reliability and strong arc suppression charac characteristics cterisstic ti s make them suitable for overcurrent rcurrent protection protec cti tio tion on n of power po ower supplies, capacitor filter banks, LCD Crystal D ((Liquid Liqu uid d Cr C rys ysta al Display) backlight inverters, ters, electric ele lectrric motors mot o o orrs and and d portable electronics. Benefits Features • Time-delayed design prevents openings ventts nuisance nuissanc n eo pe enings in pulsed and high inrush current applications currrent a ppl p ic catio ons ns • Lead free materials and RoHS compliant • Halogen free (refers to: Brⱕ900ppm, Clⱕ900 Clⱕ900ppm, Br+Clⱕ1500ppm) • Small size with high-current nt rati rratings a ing gs • Strong arc suppression characteristics haract c er eristiics • Monolithic multilayer design 11 • High-temperature performance performanc temperature range • -55°C to +125°C operating tem Applications • Small motors systems • Power over Ethernet (POE) • Computer drives • Portable electronics • Test equipment • Displays • Input power ports • POL converter protection • Printers 89 Table FS1 Clear Time e Characteristics for Slow-Blow Chip Fuses 0603SFS Series % of rated current 100% 200% 300% 800%(1.0A-1.5A) 800%(2.0A-5.0A) Table FS2 1206SFS Ser Series rie ies Clear ar time at 25°C 4 hours (min.) 1 second (min.) 0.1 1 second (min.) 120 seconds (max.) 3 seconds (max.) 0.0005 5 second (min.) 0.05 seconds (max.) 0.001 1 second (min.) 0.05 seconds (max.)) % of rated d ccurrent urrent 100% 10 100 1 0 % 200% % 300% % 800 800%(1.0A-1.5A) 0%(1 (1 1.0A-1.5 0 5A)) 800%(2.0A-8.0A) 800 0%((2.0A-8.0 0A)) C Clear lear time at 25°C 4 hou hours (min.) 1 seco second (min.) 0.1 1 seco second (min.) 120 seconds (max.) 3 seconds (max.) 0.0016 16 seco second (min.) 0.05 seconds (max.) 0.0 0. 0 0.002 .002 seco second (min.) 0.05 seconds (max.) Typical Electrical ectrical Characteri Characteristics, istic is cs, D Dimensions iim men men e siions s and d Re Recommended eco ommend ded Pad Layout for Slow-Blow w Chip Fuses 0603 (1608mm) Slow-Blow -Blow Chip Fuses s Shape and Dimensions Inch (mm) 0.031±0.006 .006 (0.80±0.15) 0.15) 0.063±0.006 0.063±0. 3 006 3±0 6 (1.60±0.15) (1.60±0. 0±0 0 15) Pa art Number Numbe mbe b r Part 0.031±0.0 006 0.031±0.006 1 (0.80±0.15) Max. Interrupt Ratings Voltage (VDC) Current (A) 0603SFS100F/32 06 603SF SFS100F/32 SF 1.0 0.200 0.093 32 50 0603SFS150F/32 060 603SFS150F/32 60 1.5 0.100 0.18 32 50 0603SFS200F/32 2.0 0.052 0.32 32 50 0603SFS250F/32 2.5 0.041 0.63 32 50 0.110 0.1 110 (2.8 (2.80) 80) 0603SFS300F/32 3.0 0.031 0.87 32 50 0.0 0.024 024 (0.60) (0.6 60) 0603SFS350F/32 3.5 0.021 1.20 32 50 0603SFS400F/32 4.0 0.017 2.30 32 50 0603SFS450F/32 4.5 0.015 2.70 32 50 0603SFS500F/32 5.0 0.013 3.20 32 50 0.014±0.006 0.014 4±0.006 4±0 (0.36±0.15) (0.3 36±0.15) Recommended Pad Layout Inch (mm) Typical Electric Electrical Characteristic Characteristics Nominal Rated Nominal I2t Current Cold DCR (A) (Ω)* (A2sec)† 0.039 0.03 .0 9 (1.00) (1.0 ((1 1 0) 0.043 43 (1.09) 9) 1206 (3216mm) Slow-Blow Blow Chip Fuses 11 Shape and Dimensions Inch (mm) 0.063±0.008 (1.60±0.20) 0.126±0.008 (3.20±0.20) Part Number Current (A) 1.0 0.360 0.11 63 50 1.25 0.200 0.22 63 50 1206SFS150F/63 1.5 0.150 0.23 63 50 1206SFS200F/63 2.0 0.088 0.63 63 50 1206SFS250F/32 2.5 0.065 0.90 32 50 1206SFS300F/32 3.0 0.034 1.20 32 50 1206SFS350F/32 3.5 0.028 1.60 32 50 0.173 (4.40) 1206SFS400F/32 4.0 0.024 2.20 32 50 0.059 (1.50) 1206SFS450F/32 4.5 0.020 3.60 32 50 1206SFS500F/32 5.0 0.016 5.30 32 50 1206SFS550F/24 5.5 0.014 6.40 24 50 1206SFS600F/24 6.0 0.011 8.50 24 60 1206SFS700F/24 7.0 0.010 10.00 24 60 1206SFS800F/24 8.0 0.009 16.90 24 60 0.071 (1.80) 0.057 (1.45) * Measured at ⱕ10% of rated current and 25°C ambient temperature. † Melting I2t at 0.001 sec clear time. RoHS Compliant, ELV Compliant Voltage (VDC) 1206SFS125F/63 0.020±0.010 (0.51±0.25) 90 Max. Interrupt Ratings 1206SFS100F/63 0.038±0.008 (0.97±0.20) Recommended Pad Layout Inch (mm) Typical Electrical Characteristics Rated Nominal Nominal Current Cold DCR I2t (A) (Ω)* (A2sec)† HF Halogen Free Surface-mount Fuses – Slow-Blow Chip Fuses Figure FS1-FS4 Family Performance Curves for Slow-Blow Chip Fuses Figure FS1 A 2. 5 3.0A A 3.5 A 4.0 A 4.5 A 5.0 A 2. 0 1.5 A 1.0 A 0603SFS Average Time Current Curves 100 Clear Time (s) 10 1 0.1 0.01 0.001 10 10 1 100 Current Cu urrent (A) Figure FS2 0603SFS 0 060 3SFS I²t vs. t Curves 10,000 5.0A 4.5A 4.0A 3.5A 3.0A 2.5A 2.0A 1.5A 1000 11 1.0A I2t (A2s) 100 10 1 0.1 0.01 0.001 0.01 0.1 1 10 100 Time (s) Note: Curves are nominal RoHS Compliant, ELV Compliant HF Halogen Free 91 Figure FS1-FS4 Family ily Performance Curves for Slow-Blow Chi Chip ip F Fuses us ses Cont’d Figure FS3 A A 3.0 3.5A 4.0 A 4.5A 5.0 A 5.5A 6 .0 A 7.0 A A 8 .0 A 2. 5 2. 0 1. 2 5A 1.5 A 1.0 A 1206SFS Average Time Curren Current nt Cu C Curves rv ves 100 10 Clear Time (s) 1 0.1 0.01 0.001 10 1 1000 100 Current (A) Figure FS4 1206SFS I²t vs. t Curves 100000 8.0A 7.0A 6.0A 5.5A 5.0A 4.5A 4.0A 3.5A 3.0A 2.5A 2.0A 1.5A 1.25A 1.0A 10000 11 1000 I2t (A2s) 100 10 1 0.1 0.01 0.001 0.01 0.1 1 Time (s) Note: Curves are nominal  Please go to page 97 for more information for Slow-Blow Chip Fuses. 92 RoHS Compliant, ELV Compliant HF Halogen Free 10 100 NEW The 2410(6125) is Wire-in Air SMD Fuse which is very suitable for secondary level vel overcurrent protection applications. These lead-free surface mount devices offer more reliability and have no end cap falling off risk. Straightt wire element in air performs orms consistent fusing and an nd cutting characteristics. Benefits Surface-mount Fuses – 2410 Very Fast-Acting Fuses Surface-mount rface mount Fuses rface-mount 2410 0 Very V yF Fast-Acting Fast tA Acting ti g Fuses F Features • Very fast acting at 200% overload overrloa ad current currrent ntt level n • Halogen free, RoHS compliant and 100% lead-free • Excellent inrush current withs withstanding capability sta t ndin ng c apability • Copper or copper alloy compo composite fuse link • High reliability and resilience nce • Fiberglass enforced epoxy fus fuse body • Strong arc suppression characteristics haracteristics • Wide range of current rating • Copper terminal with nickel and tin plated • -55°C to +125°C operating temperature range (with de-rating) 11 Applications • Industrial equipment • Power supplier • Game systems • LCD/PDP TV • Telecom system • White goods • Backlight inverter • Networking • Automotive 93 Table SFV1 Clear Time Characteristics for 2410 Very Fast-Acting Fuses % of rated current 100% Clear time at 25°C 4 hours (min.) 200% (0.5A-10.0A) 0.01 second (min.) 5 seconds (max.) 200% (12.0A-20.0A) 0.01 second (min.) 20 seconds (max.) Table SFV2 Typical Electrical Characteristics, Dimensions sa and nd d Reco Recommended omm mme en nded Pad Layout for 2410 Very ry Fast-Acting Fuses 2410 (6125 mm) Very Fast-Acting Fuse Shape and Dimensions mm (Inch) A D B C Recommended Pad Layout mm (Inch) D Min Max Min n Max Max Min n Max Max Min iin n Max Ma ax 6.86 (0.270) 5.95 6.25 1.96 6 2.36 2.36 36 36 0.97 0 .97 1.73 1. 1 73 2.34 2.64 2.6 64 2.95 (0.116) A C B mm m in (0.234) (0.246) (0.246 46) 46 (0.077) (0 0.07 77) (0.093) (0.0 093) (0.038) (0 0.038 8) (0.068) (0 0.068) (0.092) (0.092) (0.104) (0 0.10 04) 3.15 (0.124) 1.96 (0.077) Typ y ical El lecttriccal Characteristics Charracteristticss Typical Electrical Markin ng Marking Code e Rated ed d Rated Cu Cur C u rent Current (A) Nom min inal Nominal Co d DC Col D R Cold DCR (Ω)* * (Ω)* Nomina al Nominal I2t 2 ec) (A ssec) (VAC) (VDC) C 0.5 0.2310 3 0 31 0.2310 0.10 250 125 2410SFV0.63FM/125-2 S 0.6 6 0.1740 0.1740 7 0 0.16 250 125 2410SFV0.75FM/125-2 D 0.8 8 0.1480 0.1 1480 0.23 250 125 2410SFV1.00FM/125-2 E 1.0 0.0930 0.0930 0.59 250 125 2410SFV1.25FM/125-2 F 1.3 0.0700 0.96 250 125 2410SFV1.50FM/125-2 G 1.5 0.0620 1.19 125 125 2410SFV2.00FM/125-2 I 2.0 2.0 0.0420 2.75 125 125 2410SFV2.50FM/125-2 J 2.5 0.0310 1.21 125 125 2410SFV3.00FM/125-2 K 3.0 0.0249 1.73 125 125 2410SFV3.15FM/125-2 V 3.2 0.0232 2.20 125 125 2410SFV3.50FM/125-2 L 3.5 0.0220 2.50 125 125 2410SFV4.00FM/125-2 M 4.0 0.0172 4.10 125 125 2410SFV5.00FM/125-2 N 5.0 0.0143 5.90 125 125 Part Number 2410SFV0.50FM/125-2 11 Voltage 2410SFV6.30FM/125-2 O 6.3 0.0100 12.50 125 125 2410SFV7.00FM/125-2 P 7.0 0.0094 14.20 125 125 2410SFV8.00FM/125-2 R 8.0 0.0086 20.30 125 125 2410SFV10.0FM/125-2 Q 10.0 0.0066 29.20 125 125 2410SFV12.0FM/065-2 X 12.0 0.0053 49.20 65 65 2410SFV15.0FM/065-2 Y 15.0 0.0038 102.50 65 65 2410SFV20.0FM/065-2 Z 20.0 0.0034 126.20 65 65 * Measured at ⱕ10% of rated current and 25°C ambient temperature. 94 Max. Interrupt Ratings RoHS Compliant, ELV Compliant HF Halogen Free Current (A) 50A @ 250VAC 50A @ 125VDC 300A @ 32VDC 50A @ 125VAC 50A @ 125VDC 300A @ 32VDC 35A @ 125VAC 50A @ 125VDC 300A @ 32VDC 50A @ 65VAC 50A @ 65VDC 300A @ 32VDC 50A @ 65VAC 50A @ 65VDC 300A @ 32VDC Surface-mount Fuses – 2410 Very Fast-Acting Fuses Figure SFV1-SFV2 Family Performance Curves for 2410 Very Fast-Acting Fuses Figure SFV1 1.0 0A 1. 2 1.55 A 0A 2. 0 2. 5 0 A 0 3.0 A 3.1 0A 3.55 A 4.0 0A 5.0 0A 0A 6.3 7.0 0A 0 8 .0 A 10 0A . 12 0A . 15 0A .0A 20 .0A 3A 5A 0.7 0.6 0.5 0A 2410SFV Average Time Current Curves 100 10 Clear Time (s) 1 0.1 0.01 0.001 1 0.1 0 10 100 1000 Current Curr Cu ent (A) Figure SFV2 2410SFV I2T vs. t Curves 20.0A 15.0A 12.0A 10.0A 8.00A 7.00A 6.30A 5.00A 4.00A 3.50A 3.15A 3.00A 2.50A 2.00A 1.50A 1.25A 1.00A 0.75A 0.63A 0.50A 100,000 10,000 1000 I2t (A2s) 100 11 10 1 0.1 0.01 0.001 0.01 0.1 1 10 100 Time (s) Note: Curves are nominal  Please go to page 97 for more information for 2410 Fast-Acting Fuses. RoHS Compliant, ELV Compliant HF Halogen Free 95 11 96 Surface-mount Fuses - Specifications for All Fuses Specifications, Packaging Information, Agency Approvals and Part Numbering Systems for All Fuses Table F1 Environmental Specifications for All Fuses Operating temperature -55°C to +125°C Mechanical vibration Withstands 5-3000 Hz at 30 Gs when evaluated per Method 204 of MIL-STD-202 Mechanical shock Withstands 1500 Gs, 0.5 millisecond half-sine pulses when evaluated per Method 213 of MIL-STD-202 Thermal shock Withstands 100 cycles from -65°C to +125°C when evaluated per Method 107 of MIL-STD-202 Resistance to soldering heat Withstands 60 seconds at +260°C when evaluated per Method 210 of MIL-STD-202 Solderability Meets 95% minimum coverage requirement when evaluated per Method 208 of MIL-STD-202 Moisture resistance Withstands 10 cycles when evaluated per Method 106 of MIL-STD-202 Salt spray Storage temperature Storage humidity Withstands 48-hour exposure when evaluated per Method 101 of MIL-STD-202 ⱕ30°C/ 85% RH Per e MIL-STD-202F S 0 , Method et od 106F 06 Table F2 Material Specifications fications for All Fuses Construction body material Termination material Ceramic (1206/0603/0402); Fiberglass/Epoxy (2410) Silver, Nickel, Tin Fuse element Silver(1206/0603/0402); Copper/Copper Alloy (2410) 0)) 0 Figure F1 Thermal Derating ting Current for All Fuses 105 100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 -55 2410 241 24 2 410 Series Se Temperature Tem mpe eratture Effect Efffect on o Current Rating 110 0 105 5 11 100 0 95 5 90 0 De-rating % DeDe De ra rrati a ing at ng % De-rating 1206/0603/0402 603/0402 Series Temperature Effect ffect on Current Rating 85 5 80 75 70 65 5 60 55 -35 -15 5 25 45 65 5 85 105 5 125 145 50 -55 -35 Maximum Operating eratin ng Temperature Te emp pera p e atture tu u (˚C) ˚C C -15 5 25 45 65 85 105 125 Maximum Operating Temperature T (˚C) Table F3 Electrical Specifications cific cation ns fo fforr All Fuses Insulation resistance after opening g 20,000Ω 20,0 000Ω minimum @ rated voltage. Fuse clearing under low voltage condit conditions may result in lower post-clearing insulation values. Under normal fault conditions TE Circuit Protection fuses provide sufficient insulation resistance for circuit protection. Current carrying capacity RoHS Compliant, ELV Compliant Withstands 100% rated current at +25°C ambient for 4 hours when evaluated per MIL-PRF-23419. HF Halogen Free 97 Table F4 Packaging Information for All Fuses Size Reel Quantity (pcs) Reel Diameter Reel Width Carrier Tape Size Typ ype yp Tape Type Reels per Outside Shi Shipment Box Outside Shipment Boxes per Overpack 0402(1005) 10,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0.10mm Paper Pape a r 5 1 to 10 0603(1608) 4,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0.10mm Paper Pa 5 1 to 10 0603SFV(1608) 6,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0.10mm m Pa Paper perr 5 1 to 10 1206(3216) 3,000 178mm white plastic 9.0 ± 0.5mm 8.00 ± 0. 0.10mm .10 10m 1 0mm Pl P Plastic asticc 5 1 to 10 2410(6125) 2,000 178mm white plastic 13.4 ± 0.5mm 12.00 0 ± 0.10mm m Pla P Plastic laasticc 4 1 to 10 Figure F2 Recommended nded Soldering Tempera Temperature atture a eP Profile ro ofile e fo ffor or A All lll F Fuses use es p tp Crittical Zone Critical e TL to o Tp Tp up Ramp am u p Temperature Temperature re e TL tL T sMAX Ts T sMINN Ts ts s Preheat Prehe eat 25 Ramp down 25˚C Peak t 25 5˚C to P eakk Time Reflow Profile Reflo e w Pro eflo file Classification Reflow Prof Profiles file es Profile Feature Average ramp up rate (TsMAX o Tp) AX to Preheat • Temperature min. (TsMIN) • Temperature max. (TsMAX) • Time (tsMIN to tsMAX) Time maintained above: • Temperature (TL) 11 1206/0603/0402 3°C/second max. 2410 3°C/second max max. 150°C 200°C 60-180 60 180 seconds 150°C 200°C 40-100 40 100 seconds 217°C 200°C • Time (tL) Peak/Classification temperature (Tp) Time within 5°C of actual peak temperature 60-150 seconds 260°C max. 30-90 seconds 250°C max. Time (tp) From 25°C to preheating (150°C) Ramp down rate 20-40 seconds 8 minutes max. 4°C/second max. 30-40 seconds 40-100 seconds Natural cooling Recommended conditions for hand soldering: 1. Using hot air rework station that can reflow the solder on both terminations at the same time is strongly recommended, do not directly contact the chip termination with the tip of soldering iron. 2. Preheating: 150°C, 60s (min). Appropriate temperature (max) of soldering iron tip/soldering time (max): 280°C /10s or 350°C / 3s. 98 RoHS Compliant, ELV Compliant HF Halogen Free Dimension in inches (mm) Mark 0402 (1005) 0603 (1608) 1206 (3216) 0603SFV (1608) 2410 (6125) E1 0.069 ± 0.004 0.069 ± 0.004 0.069 ± 0.004 0.069 ± 0.004 0.069 ± 0.004 (1.75 ± 0.10) (1.75 ± 0.10) (1.75 ± 0.10) (1.75 ± 0.10) (1.75 ± 0.10) F 0.138 ± 0.002 0.138 ± 0.002 0.138 ± 0.002 0.138 ± 0.002 2 0.217 ± 0.004 (3.50 ± 0.05) (3.50 ± 0.05) (3.50 ± 0.05) (3.50 ± 0.05) 0.0 0 ..05) (5.50 ± 0.10) W 0.315 ± 0.004 0.315 ± 0.004 0.315 ± 0.004 0.315 5 ± 0.004 0.0 004 0.472 ± 0.004 (8.00 ± 0.10) (8.00 ± 0.10) (8.00 ± 0.10) (8.00 ((8 (8. 8 00 ± 0.10) (12.00 ± 0.10) P1 0.079 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.157 0.157 ± 0.004 0.0 004 0.157 ± 0.004 (2.00 ± 0.10) (4.00 ± 0.10) (4.00 ± 0.10) (4.00 (4.00 ± 0.10) 0.10) (4.00 ± 0.10) P0 0.157 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.157 0.157 57 ± 0.004 5 0.0 004 0.157 ± 0.004 (4.00 ± 0.10) (4.00 ± 0.10) (4.00 ± 0.10) 0.1 10) (4.00 00 ± 0.10) (4.00 ± 0.10) P2 0.079 ± 0.002 0.079 ± 0.002 0.079 ± 0.002 0.0 002 2 0.079 79 ± 0.002 0.0 002 0.079 ± 0.004 (2.00 ± 0.05) (2.00 ± 0.05) (2.00 (2 2.00 ± 0.05) 0.0 05) (2.00 00 ± 0.05) 0.0 05) (2.00 ± 0.10) D0 0.059 ± 0.004 0.059 ± 0.004 0.059 0.059 ± 0.004 0.0 0 004 4 0.059 59 ± 0.004 0.0 004 0.059 ± 0.004 (1.50+0.10/-0.00) (1.50+0.10/-0.00) (1.50+0.10 (1.50+0.10/-0.00) 0/-0.00 0) (1 (1.50+0.10/-0.00) 1.50+ +0.1 10/-0 0.00) (1.50+0.10/-0.00) — — 0.039 0.0 .03 .0 39 m max ax — 0.61 ± 0.004 — 0.010 ± 0.002 0.039 0.039 39 9 ± 0.004 0.112 ± 0.004 D1 (1.00 (1 1.00 0m max) ax) t (1.55 ± 0.10) — — 0.009 0.0 009 ± 0.001 0.0 A0 0.026 ± 0.004 0.039 0.0 03 39 ± 0.004 0.0 004 0.071 0.0 071 ± 0.004 0 04 0.0 4 (0.67 ± 0.10) (0.98 9 ± 0.10) 98 0.10 0) (1.80 ± 0.10) 0.1 0 . 0) (0.98 ± 0.10) (2.85 ± 0.10) B0 0.046 ± 0.004 0.071 71 ± 0.004 0.00 04 0.138 0.1 138 8 ± 0.004 0 04 0.0 0.071 ± 0.004 0.252 ± 0.004 (1.17 ± 0.10) (1.80 ( 80 (1. 0 ± 0.10) 0.1 10) (3.50 (3 3.50 0 ± 0.10) 0. 0) 0.1 (1.80 ± 0.10) (6.40 ± 0.10) K0 0.025 ± 0.004 0.037 0.0 . 37 7 ± 0.003 0.050 ± 0.004 0.0 004 0.024 ± 0.003 0.093 ± 0.004 (0.63 ± 0.10) (0.95 (0 0.95 5 ± 0.08) (1.27 ± 0.10) 0.1 10) (0.60 ± 0.08) (2.35 ± 0.10) (0.23 (0 0.23 ± 0.02) 0.0 (0.25 ± 0.05) Surface-mount Fuses - Specifications for All Fuses Table F5 Tape and Reel Specifications for All Fuses Figure F3 Component Tape e Dimensions Dim men e siions ffor or A All ll Fuses Paper P aperr Carrier Carrier Tape Specifications P0 D0 11 P2 E1 F W B0 P1 D1 A0 K0 Plastic Carrier Tape Specifications D0 P0 t P2 E1 F W B0 D1 RoHS Compliant, ELV Compliant HF Halogen Free P1 A0 K0 99 Figure F4 Reel Dimensions for All Fuses Dimension Description Hub outer diameter Dimension (mm) Mark 1206/0603/0402 2410 B 60 60.2 Reel inside width W1 9 13.4 Reel outside width W2 11.4 16 Tape width W2 B 8 W1 Agency Approvals for or All Fuses UL File # E197536 97536 Part Numbering System em for Fast-Acting, Slow Slow-Blow w-Blo ow A And nd d 060 0603 03 V Very ery Fa Fast-Acting ast st--A Acti Chip Fuses 1206 SF F 400 F / 24 4 -2 Packag Packaging gin ng -2 = Tape Tap T a e and and Reel Re eel Voltage Vo Volt ttag ag ge Rating Rating R 24 4 = 24V 24 4 DC Spe Special pe p ecia ial ia a Code Co Code F = RoHS RoHS HS S Compliant C mpliant Com nt nt FM = RoHS RoHS Compliant Comp mpl p iant + Marked Marrked Part Part Rated Current Rat ated at te ed dC urrrent urr entt 050 0.50 Amps 05 50 = 0. Amps mps 400 40 00 = 4 Amps Amps Fuse Fus usse Blow u B Blo Bl low Type Type pe p e F = Fast Fasst Acting Act ctt cting S = Slow w Blow Blow 11 SF = Surface Mount Fuse Size S e (1206, 0603, 0402) Siz Part Numbering System em for High-Current-Rated Chip Fuses 1206 SF H 100 F / 24 -2 Packaging -2 = Tape and Reel Voltage Rating 24 = 24VDC Special Code F = RoHS Compliant FM = RoHS Compliant + Marked Part Rated Current 100 = 10 Amps Fuse Blow Type H = High Current SF = Surface Mount Fuse Size (1206) 100 RoHS Compliant, ELV Compliant HF Halogen Free 2410 SF V 6.30 FM / 125 -2 Packaging -2 = Tape and Reel Voltage Rating 125 = 125VDC Special Code F = RoHS Compliant M = Marked Part Rated Current 6.30= 6.30 Amps Fuse Blow Type V = Very Fast Acting SF = Surface Mount Fuse Fus usse Size (0.24*0.10 0 inch) inch h) Surface-mount Fuses - Specifications for All Fuses Part Numbering System for 2410 Very Fast-Acting Fuses 11 Warning : All information, including illustrations, is believed to be accurate and reliable. Users, however, should independently evaluate the suitability of and test each product selected for their application. Tyco Electronics Corporation and/or its Affiliates in the TE Connectivity Ltd. family of companies (“TE”) makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use.TE’s only obligations are those in the TE Standard Terms and Conditions of Sale for this product, and in no case will TE be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In addition, TE reserves the right to make changes to materials or processing that do not affect compliance with any applicable specification without notification to Buyer. RoHS Compliant, ELV Compliant HF Halogen Free 101 11 102