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JÓ{6 £°Êi>ÃÕÀi`Ê>ÌÊ£ä¯ÊœvÊÀ>Ìi`ÊVÕÀÀi˜Ì]ÊÓx¨ ° Ó°Êi>ÃÕÀi`Ê>ÌÊÀ>Ìi`ÊۜÌ>}i° ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/497.html for current information. 1 Revision: June 10, 2011 432 Series EC3109v1E-1106-CUST Surface Mount Fuses Thin Film > 0402 Size > Very Fast-Acting > 432 Series .375A .5A .75A 1A 1.25A 1.5A 1.75A 2A 2.5A 3A 3.5A 4A 5A Average Time Current Curves .25A Temperature Rerating Curve 100 TIME IN SECONDS 10 1 0.1 0.01 œÌi\ £°ÊiÀ>̈˜}Ê`i«ˆVÌi`ʈ˜Ê̅ˆÃÊVÕÀÛiʈÃʈ˜Ê>``ˆÌˆœ˜Ê̜Ê̅iÊÃÌ>˜`>À`Ê`iÀ>̈˜}ʜvÊÓx¯ÊvœÀÊ Vœ˜Ìˆ˜ÕœÕÃʜ«iÀ>̈œ˜° Ý>“«i\ 0.001 0.1 Ê œÀÊVœ˜Ìˆ˜ÕœÕÃʜ«iÀ>̈œ˜Ê>ÌÊÇäÊ`i}ÀiiÃÊViÃˆÕÃ]Ê̅iÊvÕÃiÊŜՏ`ÊLiÊ`iÀ>Ìi`>ÃÊvœœÜÃ\ Ê ÊrÊ­ä°Çx®­ä°nä®,
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/ 1 10 CURRENT IN AMPERES 100 Soldering Parameters *LÊqÊÀiiÊ>ÃÃi“LÞ Reflow Condition Pre Heat - Temperature Min (Ts(min)) £xäc Ê - Temperature Max (Ts(max)) Óääc - Time (Min to Max) (ts) ÈäÊqÊ£ÓäÊÃiVà Average ramp up rate (Liquidus Temp (TL) to peak xc ÉÃiVœ˜`ʓ>Ý TS(max) to TL - Ramp-up Rate xc ÉÃiVœ˜`ʓ>Ý Reflow - Temperature (TL) (Liquidus) Ó£Çc Ê - Temperature (tL) ÈäÊqÊ£xäÊÃiVœ˜`à Peak Temperature (TP) Óxä³äɇxÊc Time within 5°C of actual peak Temperature (tp) ÓäÊqÊ{äÊÃiVœ˜`à Ramp-down Rate xc ÉÃiVœ˜`ʓ>Ý Time 25°C to peak Temperature (TP) nʓˆ˜ÕÌiÃÊ>Ý° Do not exceed ÓÈäc Wave Soldering 432 Series EC3109v1E-1106-CUST ÓÈäc ]Ê£äÊÃiVœ˜`Ãʓ>Ý° 2 ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/497.html for current information. Surface Mount Fuses Thin Film > 0402 Size > Very Fast-Acting > 432 Series Product Characteristics Materials Body:Ê «œÝÞÊÉʏ>ÃÃÊ-ÕLÃÌÀ>ÌiÆÊ *>ÀÌÃÊ܈̅ʼ½ÊÃÕvwÝ\Ê>œ}i˜ÊÀiiÊ «œÝÞÊÉʏ>Ãà Terminations:Ê£ää¯Ê/ˆ˜ÊœÛiÀÊ ˆVŽiÊœÛiÀÊ œ««iÀ Device Weight:Êä°Î£È“} Terminal Strength ‡-/‡ÓäÓ]Êi̅œ`ÊÓ££
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vÌiÀÊ"«i˜ˆ˜}\ÊÀi>ÌiÀÊ̅>˜Ê£ä]äää"…“à Operating Temperature qxxc Ê̜ʙäc °Ê œ˜ÃՏÌÊÌi“«iÀ>ÌÕÀiÊÀiÀ>̈˜}ÊVÕÀÛiÊV…>ÀÌ°Ê œÀʜ«iÀ>̈œ˜Ê>LœÛiʙäc Ê«i>ÃiÊVœ˜Ì>VÌÊ ˆÌÌivÕÃi° Thermal Shock 7ˆÌ…ÃÌ>˜`ÃÊxÊVÞViÃʜvÊqxxc Ê̜ʣÓxc Vibration ‡-/‡ÓäÓ Part Marking System Dimensions A Marking code varies with amperage. Refer to Part Marking System chart. .991 +/- .051 (.039" +/- .002") B .508 +/- .051 (.020" +/- .002") .229 +/- .102 (.009" +/- .004") 0.330 +/- .102 (.013" +/- .004") C 0.292 +/- .102 (.012" +/- .004") D .2159 +/- .0889 (.0085" +/- .0035") Sn Reflow solder recommended mounting pad dimensions Cu .584 (.023" .381 (.015" .558 (.022") Part Numbering System 0432 002. K R HF A B C D ˆ˜V…Ê“ˆ˜ ä°äÎÇ ä°ä£n ä°ää™ ä°ääx ˆ˜V…Ê“>Ý ä°ä{£ ä°äÓÓ ä°ä£x ä°ä£Ó ““Ê“ˆ˜ 䰙{ ä°{xÇ ä°Óә ä°£ÓÇ ““Ê“>Ý £°ä{ ä°xx™ ä°În£ ä°Îäx SERIES AMP Code ,iviÀÊ̜Ê
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Ê,-‡{n£‡ÓÊ­ ÊÓnÈ]Ê«>ÀÌÊή £ääää , ©2008 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/series/497.html for current information. 3 432 Series EC3109v1E-1106-CUST