1812L750SLPR

1812L SL Series Pending Device Specification ELECTRICAL CHARACTERISTICS Part Number I hold (A) I trip (A) V max (Vdc) I max (A) Pd max (W) 1812L750SL 7.5 15.0 6 50 1.5 Note: Ihold Maximum Time-to-Trip Current Time (A) (Sec.) 37.5 2.0 Resistance R min (Ω) 0.001 R 1max (Ω) 0.006 = Hold current: maximum current device will pass without tripping in 20℃ still air. Itrip = Trip Current: minimum current at which the device will trip in 20℃ still air. Vmax = Maximum voltage device can withstand without damage at rated current (Imax) Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) Pd = Power dissipated from device when in the tripped state at 20℃ still air. Rmin = Minimum resistance of device in initial (un-soldered) state. R1max = Maximum resistance of device at 20℃ measured one hour after tripping or reflow soldering of 260℃ for 20 sec. Caution :Operation beyond the specified rating may result in damage and possible arcing and flame. Figure Solder Pad Layout (mm) A C 3.45 Marking D 3.15 B 1.78 E 1.78 PHYSICAL DIMENSIONS (mm) Part Number 1812L750SL A B C D E Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. 4.37 4.73 3.07 3.41 0.50 0.70 0.30 1.20 0.15 0.65 1812L SL Series Specifications are subject to change without notice. Revision: B THERMAL DERATING CHART – Ihold/Itrip (Amps) Recommended Data -40°C -20°C Ambient Operation Temperature 0°C 23°C 40°C 50°C 60°C Ihold 11.65 10.40 9.00 7.50 6.00 5.00 4.00 3.40 2.80 Itrip 23.30 20.80 18.00 15.00 12.00 10.00 8.00 6.80 5.60 Part Number 1812L750SL 1812L SL Series Specifications are subject to change without notice. 70°C 85°C Revision: B