450CC1210LR-C-2

POLYSWITCH® Resettable PTCs Surface Mount > LoRho Series LoRho SMD PTC for Charging Cable Protection Description The Littelfuse LoRho SMD PTC for Charging Cables provides protection from heat generated due to faults within the connector such as USB-C, microUSB, and many others. As connectors get smaller, their pin-to-pin spacings are shrinking which increases the opportunity for debris such as dust, dirt, or water to collect causing a fault. These faults can generate a tremendous amount of heat which will damage charging cables, the devices they charge, or people using them. Agency Approvals AGENCY AGENCY FILE NUMBER AMPERE RANGE E74889* 4.5A J 50313999* 4.5A * See Electrical Characteristic Table for approved part numbers. • SMD compatible with reflow soldering process • Ultra low internal resistance • Available in small 1206 and 1210 sizes • Reset automatically • Halogen-free, lead-free and RoHS compliant • Up to 21Vdc and 4.5A Ihold Applications • Over temperature (OT) protection for USB connectors and cables including: • Fast charging standards and protocols including: – USB Power Delivery (PD) † – Qualcomm Quick Charge (QC) † – USB Type-C – USB Micro-B – Mediatek Pump Express (PE) † – USB-A – Samsung Adaptive Fast Charging (AFC) † – Huawei/HiSilicon Fast Charging Protocol (FCP) † † Features Benefits • Surface mount design reduces assembly time and cost compared to leaded/strapped models • Well-suited for fastcharging applications up to 21Vdc and 4.5A Ihold • Saves PCB space in the USB-C connector and ensures that the USB-C plug meets USB-IF dimension specifications These charging protocols are the property of their respective owners. Electrical Characteristics Part Number nanoSMD350LR-C nanoSMD400LR-C microSMD450LR-C 400CC1206LR-C 450CC1210LR-C Marking P S S Y K Ihold 1 (A) Vmax 2 (Vdc) 3.50 4.00 4.50 4.00 4.50 12 12 12 21 21 Thermal Cut Off (TCO) - ºC @ 2A Min Max Min Max 75 85 90 85 90 100 110 115 110 115 60 70 75 70 75 85 95 100 95 100 Notes: 1. Ihold = Hold current: maximum current device will pass without tripping in 20°C still air 2. Vmax = Maximum voltage device can withstand without damage at rated current (Imax) 3. Pd = Power dissipated from device when in the tripped state at 20°C still air 4. Rmin = Minimum resistance of device in initial (un-soldered) state 5. R1max = Maximum resistance of device at 20°C measured one hour after tripping or reflow Soldering of 260°C for 20 seconds (Values specified were determined using PCBs with 0.115in x 1.0in ounce copper traces) Caution: Operation beyond the specified rating may result in damage and possible arcing and flame © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/19 Thermal Cut Off (TCO) - ºC @ 3A Pd3 typ. (W) 1.0 1.0 1.0 1.0 1.3 Resistance Rmin 4 (Ω) R1max 5 (Ω) 0.004 0.004 0.002 0.004 0.002 0.018 0.010 0.0085 0.010 0.008 Agency Approvals --- --- --- --- X X TCO and Pd Testing Method: Thermal Cut-Off Test– 1. Put the device into the thermostatic chamber controlled at room temperature or 25°C. 2. Apply the specified current to the device, and increase the chamber temperature at the rate of 2°C per minute. 3. Measure the device ambient temperature when the applied current has reduced to less than 20% of initial value. Power Dissipation– 1. Conduct thermal cut-off test at rated current/voltage. 2. After device trip, decrease the chamber temperature with keeping trip state. 3. Measure the tripped-state power dissipation when the device ambient temperature has reduced to 30°C or less. POLYSWITCH® Resettable PTCs Surface Mount > LoRho Series Temperature Rerating Ambient Operating Temperature -20°C 0°C Part Number 20°C 60°C 85°C 1.30 Hold Current (A) nanoSMD350LR-C 4.80 4.00 3.50 1.90 nanoSMD400LR-C 5.20 4.60 4.00 2.82 2.10 microSMD450LR-C 6.20 5.50 4.50 3.30 2.30 400CC1206LR-C 5.20 4.60 4.00 2.82 2.10 450CC1210LR-C 6.20 5.50 4.50 3.30 2.30 Note: The temperature rerating data is for reference only. Please contact Littelfuse technical support for detail temperature rerating information. Temperature Derating Curve Environmental Specifications Operating Temperature -20°C to +85°C Maximum Device Surface Temperature in Tripped State 125°C Passive Aging +85°C, 1000 hours -/+10% typical resistance change Humidity Aging +85°C, 85% R.H.,100 hours -/+15% typical resistance change MIL–STD–202, Method 215 No change Thermal Shock Vibration MIL–STD–883, Method 2007, Condition A No change Moisture Sensitivity Level Level 2a, J–STD–020 Physical Specifications Terminal Materials Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/JSTD-002, Category 3 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/19 POLYSWITCH® Resettable PTCs Surface Mount > LoRho Series Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 120 seconds Ramp-up TL Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow tP TP - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds tL TS(max) Temperature Profile Feature Ramp-do Ramp-down Preheat TS(min) tS 25 Peak Temperature (TP) 260°C Time within 5°C of actual peak Temperature (tp) 30 seconds max Ramp-down Rate 2°C/second max Time 25°C to peak Temperature (TP) 8 minutes max time to peak temperature Time Notes: • All temperature refer to topside of the package, measured on the package body surface. • If reflow temperature exceeds the recommended profile, devices may not meet the performance requirements. • Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead. • Recommended maximum paste thickness is 0.25 mm (0.010 inch). • Devices can be cleaned using standard industry methods and solvents. • Devices can be reworked using the standard industry practices. Dimensions microSMD450LR-C 450CC1210LR-C A E B P C Solder Pad Layout S nanoSMD350LR-C nanoSMD400LR-C 400CC1206LR-C A B C G F D D H F Marking code varies by device. See Electrical Characteristics table. Device Dimension Part Number A inch B mm inch Solder Pad C mm inch D mm inch E mm F inch mm Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max G H inch mm inch mm inch mm nanoSMD350LR-C 0.12 0.13 3.00 3.43 0.02 0.03 0.60 0.80 0.05 0.07 1.37 1.85 0.01 0.03 0.25 0.75 -- -- -- -- 0.04 1.10 0.08 2.00 0.07 1.75 nanoSMD400LR-C 0.12 0.13 3.00 3.43 0.02 0.03 0.60 0.80 0.05 0.07 1.37 1.85 0.01 0.03 0.25 0.75 -- -- -- -- 0.04 1.10 0.08 2.00 0.07 1.75 microSMD450LR-C 0.12 0.13 3.00 3.43 0.02 0.03 0.60 0.80 0.09 0.11 2.35 2.80 0.01 0.03 0.25 0.75 0.003 -- 0.076 -- 0.04 1.00 0.08 2.00 0.10 2.65 400CC1206LR-C 0.12 0.13 3.00 3.43 0.02 0.03 0.50 0.80 0.05 0.07 1.37 1.85 0.01 0.03 0.25 0.75 450CC1210LR-C 0.12 0.13 3.00 3.43 0.02 0.03 0.50 0.80 0.09 0.11 2.35 2.80 0.01 0.03 0.25 0.75 0.003 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/19 -- -- -- -- 0.04 1.00 0.08 2.00 0.10 2.65 -- 0.076 -- 0.04 1.00 0.08 2.00 0.10 2.65 POLYSWITCH® Resettable PTCs Surface Mount > LoRho Series Packaging Part Number Packaging Option Quantity Ordering IHOLD (A) IHOLD Code RF4610-000 3.50 350 nanoSMD400LR-C RF4611-000 4.00 400 microSMD450LR-C RF2515-000 4.50 450 400CC1206LR-C RF4798-000 4.00 400 15,000 450CC1210LR-C RF4800-000 4.50 450 15,000 nanoSMD350LR-C 15,000 15,000 Tape and Reel 15,000 Part Numbering System 400 CC 1206 LR-C -2 nano SMD 350 LR-C -2 SIZE Ihold CURRENT CODE SURFACE MOUNT DEVICE TYPE C TO TYPE C IHOLD CURRENT CODE SIZE LoRho FOR CHARGING CABLE APPLICATION TAPE/REEL LoRho FOR CHARGING CABLE APPLICATION TAPE/REEL Installation and Handling Guidelines • Operation of these devices beyond the stated maximum ratings could result in damage to the devices and lead to electrical arcing and/or fire. • These devices are intended to protect against the effects of temporary over-current or over-temperature conditions and are not intended to perform as protective devices where such conditions are expected to be repetitive or prolonged in duration. • Exposure to silicon-based oils, solvents, electrolytes, acids, and similar materials can adversely affect the performance of these PPTC devices. • These devices undergo thermal expansion under fault conditions, and thus shall be provided with adequate space and be protected against mechanical stresses. • Circuits with inductance may generate a voltage (L di/dt) above the rated voltage of the PPTC device. • Hand-soldering of PTC devices on boards is generally not recommended. Users shall define and verify this process if needed. • Consult Littelfuse when the device is to be applied with thermal processes other than reflow process on the circuit board, such as molding, encapsulation. User should evaluate molding materials used in the charging cable applications to ensure there are no adverse effect on the PTC devices. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/19 POLYSWITCH® Resettable PTCs Surface Mount > LoRho Series Tape and Reel Specifications P0 T Embossment P2 D0 E1 Cover Tape A0 B1 F W E2 K0 B0 T1 P1 Center lines of Cavity W2 (Measured at Hub) A Cover Tape N (hub dia.) W1 (Measured at Hub) Carrier Tape Embossed Cavity nanoSMD350LR-C nanoSMD400LR-C microSMD450LR-C W 8.0 ± 0.30 8.0 ± 0.30 P0 4.0 ± 0.10 4.0 ± 0.10 P1 4.0 ± 0.10 4.0 ± 0.10 P2 2.0 ± 0.05 2.0 ± 0.05 A0 1.95 ± 0.10 2.9 ± 0.10 B0 3.50 + 0.1/-0.08 3.55 ± 0.10 B1 max. 4.35 4.35 D0 1.55 ± 0.05 1.55 ± 0.05 F 3.50 ± 0.05 3.50 ± 0.05 E1 1.75 ± 0.10 1.75 ± 0.10 E2 min. 6.25 6.25 T max. 0.3 0.3 T1 max. 0.1 0.1 K0 0.89 ± 0.10 1.27 ± 0.10 A max. 179 179 N min. 53.5 53.5 W1 9.5 ± 0.5 9.5 ± 0.5 W2 max. 15 15 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/19 Standard Pack Quantity: 3,000 pcs Minimum Order Quantity: 15,000 pcs Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. 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