56000001019

56000001019

  • 厂商:

    HAMLIN

  • 封装:

    FUSE-CLIP_D9.5X5.6MM_TM

  • 描述:

    保险丝座/夹子/盒 6.3A 250V FUSE-CLIP_D9.5X5.6MM_TM

  • 数据手册
  • 价格&库存
56000001019 数据手册
Fuse Block Datasheet 559/560 Series Fuse Blocks for TE5/TR5 Type Fuses RoHS Product Characteristics 560 Series Holder 559 Series Holder Additional Information 559 Series (Lead Free) 560 Series Compatible Fuses TR5/TE5 TR5/TE5 Materials Holder: Black Holder: Thermoplastic, Thermoplastic, UL94 V-0 UL 94 V-0 Metal Parts: Copper alloy; solderable tinned Electrical Data Rated Voltage: 250V (23ºC) Max. Current/Power: 6.3 A /1.6 W Mounting PC Board, 7.18 mm pin spacing PC Board, 5.08 mm pin spacing Solderability max. 260 ºC, 10 s (Wave) Minimum Cross Section Conducting path - 0.1 mm2 Unit Weight 0.63 g Ambient Temperature -40 °C to +85 °C 0.4 g Ordering Information Ordering Number Resources 559 Series Resources 560 Series Accessories 559 Series Samples 559 Series Accessories 560 Series 55900000001 “A” Height Options Packaging 6.5 mm (code 0001) 1000 Pcs Bulk 55900008011 10 mm (code 8011) 100 Pcs Bulk 56000001319 3.0 mm (code 1319) 500 Pcs Bulk 56000001009 4.3 mm (code 1009) 500 Pcs Bulk 56000001019 4.3 mm (code 1019) 1000 Pcs Bulk Samples 560 Series Dimensions (Units in mm) 559 Series Agency Approvals Ø 10 A N/A 40041024 3.8 N/A E14721 7.18 1.2 R0. 3 1±0.1 5.2±0.1 7.18 1.3±0.1 560 Series 0.5 559 Series 0.9 Mounting Dimensions 560 Series Ø 9.5 A 1.3 3.03 Application testing is strongly recommended.1 1.4 5.08 5.08 Ø1 Ø 0.5 R0.75 45 1±0.1 Agency Agency File Number Mounting Dimensions © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/17/21 Fuse Block Datasheet 559/560 Series Fuse Blocks for TE5/TR5 Type Fuses Soldering Parameters - Wave Soldering Recommended Process Parameters: 280 260 Wave Parameter 240 220 Lead-Free Recommendation Preheat: 200 (Depends on Flux Activation Temperature) 180 160 140 120 100 80 60 40 230 Time (Seconds) Cooling Time Preheat Time (Typical Industry Recommendation) Temperature Minimum: 100° C Temperature Maximum: 150° C Preheat Time: 60-180 seconds Solder Pot Temperature: 280° C Maximum Solder Dwell Time: 2-5 seconds Recommended Hand-Solder Parameters: Solder Iron Temperature: 350° C +/- 5°C Heating Time: 5 seconds max. 240 220 210 200 190 180 170 160 150 140 130 120 110 90 100 80 70 60 50 40 20 0 0 30 20 10 Temperature (°C) - Measured on bottom side of board 300 Dwell Time Note: These devices are not recommended for IR or Convection Reflow process. Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics. 2 © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/17/21
56000001019 价格&库存

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