AQ05C-01FTG

TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - AQxxC SD-C Series Series AQxxC Series 450W Discrete Bidirectional TVS Diode RoHS Pb GREEN Description The bidirectional AQxxC series is designed to replace multilayer varistors (MLVs) in electronic equipment for low speed and DC applications. It will protect any sensitive equipment from damage due to electrostatic discharge (ESD) and other transient events. The AQxxC series can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC 61000-4-2) without performance degradation and safely dissipate 30A (AQ05C) of 8/20μs induced surge current (IEC 61000-4-5) with very low clamping voltages. Pinout and Functional Block Diagram Features • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air 1 • EFT, IEC 61000-4-4, 40A (5/50ns) • Lightning, IEC 610004-5 2nd edition, 30A (tP=8/20μs, AQ05C) • Low clamping voltage 2 • Test Equipment / Instrumentation Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2017 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 09/21/17 • Small SOD323 package fits 0805 footprints • AEC-Q101 qualified • Moisture Sensitivity Level(MSL -1) • Halogen free, lead free and RoHS compliant Applications • Switches / Buttons Life Support Note: • Low leakage current • Notebooks / Desktops / Servers • Computer Peripherals • Point-of-Sale Terminals • CAN Bus protection • Medical Equipment • Automotive applications TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - AQxxC SD-C Series Series Absolute Maximum Ratings Symbol Parameter Value Units Ppk Peak Pulse Power (tp=8/20μs) 450 W TOP Operating Temperature -40 to 150 °C TSTOR Storage Temperature -55 to 150 °C Notes: CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. AQ05C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR≤1μA VR IR=1mA ILEAK VR=5V 1.0 μA IPP=1A, tp=8/20µs, Fwd 10.0 V IPP=10A, tP=8/20μs, Fwd 14.5 V Reverse Voltage Drop Leakage Current Clamp Voltage1 VC Dynamic Resistance 2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance 1 RDYN TLP, tp=100ns, I/O to Ground Ipp tp=8/20µs VESD CD Min Typ Max Units 5.0 V 6.0 V 0.31 Ω 30.0 A IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Reverse Bias=0V, f=1MHz 200 pF Max Units 12.0 V AQ12C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR≤1μA VR IR=1mA Reverse Voltage Drop Leakage Current ILEAK Clamp Voltage1 VC Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance 1 Revision: 09/21/17 V 1.0 μA 18.5 V IPP=10A, tP=8/20μs, Fwd 23.0 V Ipp tp=8/20µs ©2017 Littelfuse, Inc. Specifications are subject to change without notice. 13.3 VR=12V TLP, tp=100ns, I/O to Ground CD-GND Typ IPP=1A, tp=8/20µs, Fwd RDYN VESD Min 0.41 Ω 17.0 A IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Reverse Bias=0V, f=1MHz 100 pF TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection -AQxxC SD-C Series Series AQ15C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR≤1μA VR IR=1mA Reverse Voltage Drop Leakage Current ILEAK VC Clamp Voltage1 Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance1 Max Units 15.0 V 16.7 V VR=15V 1.0 μA 24.0 V IPP=10A, tp=8/20µs, Fwd TLP, tp=100ns, I/O to Ground Ipp tp=8/20µs CI/O-GND Typ IPP=1A, tp=8/20µs, Fwd RDYN VESD Min 31.0 0.46 V Ω 12.0 A IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Reverse Bias=0V, f=1MHz 75 pF Max Units 24.0 V AQ24C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR≤1μA VR IR=1mA Reverse Voltage Drop Leakage Current ILEAK VC Clamp Voltage1 Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance1 26.7 V VR=24V 1.0 μA 36.0 V IPP=5A, tp=8/20µs, Fwd TLP, tp=100ns, I/O to Ground Ipp tp=8/20µs CI/O-GND Typ IPP=1A, tp=8/20µs, Fwd RDYN VESD Min 42.0 0.62 7.0 IEC 61000-4-2 (Contact Discharge) ±30 IEC 61000-4-2 (Air Discharge) ±30 V Ω A kV kV Reverse Bias=0V, f=1MHz 50 pF Max Units AQ36C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR≤1μA VR IR=1mA Reverse Voltage Drop Leakage Current ILEAK VC Clamp Voltage1 Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance 1 V V 1.0 μA V IPP=5A, tp=8/20µs, Fwd tp=8/20µs 62.0 0.68 V Ω 5.0 A IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Reverse Bias=0V, f=1MHz Note: 1. Parameter is guaranteed by design and/or component characterization. 2.Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns Revision: 09/21/17 40.0 52.0 Ipp ©2017 Littelfuse, Inc. Specifications are subject to change without notice. 36.0 VR=36V TLP, tp=100ns, I/O to Ground CI/O-GND Typ IPP=1A, tp=8/20µs, Fwd RDYN VESD Min 30 pF TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - AQxxC SD-C Series Series Non-Repetitive Peak Pulse Power vs. Pulse Time Capacitance vs. Bias 160 10 Capacitance (pF Peak Pulse Power - P pk (kW) 140 1 0.1 120 SD05C AQ05C 100 80 60 SD12C AQ12C 40 AQ15C SD15C SD24C AQ24C 20 0.01 0.1 1 10 100 3 6 9 12 15 18 21 24 27 30 33 36 8/20μs Pulse Waveform 110 110% 100 100% 90 90% 80 80% Percent of IPP 70 60 50 40 30 70% 60% 50% 40% 30% 20 20% 10 0 0 Bias Voltage (V Power Derating Curve % of Rated Power I PP 0 1000 Pulse Duration - t p (µs) AQ36C SD36C 10% 0 25 50 75 100 125 150 0% 0.0 5.0 10.0 (o Ambient Temperature - TA C) 20.0 25.0 30.0 AQ12C Transmission Line Pulsing(TLP) Plot 22 22 20 20 18 18 16 16 TLP Current (A) TLP Current (A) AQ05C Transmission Line Pulsing(TLP) Plot 14 12 10 14 12 10 8 8 6 6 4 4 2 2 0 0 0 2 4 6 8 10 TLP Voltage (V) ©2017 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 09/21/17 15.0 Time (μs) 12 14 16 18 0 2 4 6 8 10 12 14 16 TLP Voltage (V) 18 20 22 24 26 TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - AQxxC SD-C Series Series AQ24C Transmission Line Pulsing(TLP) Plot 22 22 20 20 18 18 16 16 TLP Current (A) TLP Current (A) AQ15C Transmission Line Pulsing(TLP) Plot 14 12 10 14 12 10 8 8 6 6 4 4 2 2 0 0 0 2 4 6 8 0 10 12 14 16 18 20 22 24 26 28 30 32 5 10 15 AQ36C Transmission Line Pulsing(TLP) Plot 20 18 TLP Current (A) 16 14 12 10 6 4 2 0 10 15 20 25 30 35 40 30 35 40 45 50 Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL Recognized epoxy meeting flammability rating V-0. 8 5 25 Product Characteristics 22 0 20 TLP Voltage (V) TLP Voltage (V) 45 50 55 60 65 TLP Voltage (V) Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters Pre Heat Pb – Free assembly 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C ©2017 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 09/21/17 +0/-5 tP TP - Temperature Min (Ts(min)) °C Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time TVS Diode Arrays (SPA®® Diodes) Series General Purpose ESD Protection - AQxxC SD-C Series Part Numbering System Automotive Grade TVS Diode Arrays (SPA® Diodes) Ordering Information AQ ** C – 01 F T G G= Green Voltage T= Tape & Reel Bidirectional Package Number of Channels F: SOD323 Part Number Package Marking Min. Order Qty. AQ05C-01FTG SOD323 G 3000 AQ12C-01FTG SOD323 G1 3000 AQ15C-01FTG SOD323 G2 3000 AQ24C-01FTG SOD323 G3 3000 AQ36C-01FTG SOD323 G4 3000 Part Marking System G* 2 1 Blank: AQ05C-01FTG Blank: SD05C-01FTG 1: AQ12C-01FTG 1: SD12C-01FTG 2: AQ15C-01FTG 2: SD15C-01FTG 3: AQ24C-01FTG 3: SD24C-01FTG 4: AQ36C-01FTG 4: SD36C-01FTG Package Dimensions -SOD323 E A1 SOD323 A2 D b Symbol A L1 Recommended Solder Pad 1.79 0.49 c 0.45 0.2 E1 1.14 2.28 2.77 Unit: mm ©2017 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 09/21/17 Millimeters Inches Min Max Min Max A 0.80 1.14 0.031 0.045 A1 0.00 0.10 0.000 0.004 A2 0.80 1.04 0.031 0.014 b 0.25 0.35 0.010 0.014 c 0.08 0.15 0.003 0.006 D 1.15 1.45 0.045 0.057 E 1.60 1.90 0.063 0.075 E1 2.44 2.70 0.096 0.106 L1 0.25 0.45 0.010 0.018 E Top Cover Tape TVS Diode Arrays (SPA®® Diodes) F A0 W General Purpose ESD Protection - SD-C AQxxCSeries Series 3° REF B0 K0 P1 Φ: 0.40±0.05 W1 Embossed Carrier Tape & Reel Specification — SOD323 S R K M N H W Component Orientation in Tape Pin1 Symbol Millimeters A0 1.36min/1.62max B0 2.90+/-0.10 W 8.0+0.3/-0.10 D0 1.50+0.10 D1 ø1.00min/ø1.25max E 1.75+/-0.10 E2 - F 3.50+/-0.05 P0 4.00+/-0.10 P 4.00+/-0.10 P1 2.00+/-0.05 K0 1.15min/1.45max T 0.254+/-0.13 8mm TAPE AND REEL Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. ©2017 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 09/21/17