TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - AQxx-02HTG Series
AQxx-02HTG Series 500W TVS Diode Array
RoHS
Pb GREEN
Description
The AQxx-02HTG Series TVS Diode Array is designed
to protect sensitive equipment from damage due to
electrostatic discharge (ESD), electrical fast transients
(EFT), and lightning induced surges.
This AQxx series can safely absorb repetitive ESD
strikes of ±30 kV (contact and air discharge as defined
in IEC 61000-4-2) without any performance degradation.
Additionally, the AQ05 can safely conduct a 33A 8/20 surge
event as defined in IEC 61000-4-5 2nd Edition at low voltage
clamping levels.
Pinout and Functional Block Diagram
Features
• ESD, IEC 61000-4-2,
±30kV contact, ±30kV air
• Low clamping voltage
• EFT, IEC 61000-4-4, 50A
(5/50ns)
• AEC-Q101 qualified
• Low leakage current
• Moisture Sensitivity Level
(MSL -1)
• Lightning, 33A (8/20μs as
defined in IEC 61000-4-5
2nd edition) for the AQ05
1
3
2
• Halogen free, lead free
and RoHS compliant
• Working voltages: 5V,
12V, 15V, 24V and 36V
• PPAP capable
ESD, ISO 10605, 330pF
330Ω, ±30kV contact,
±30kV air
Applications
• Legacy Ports
• Industrial Equipment
(RS-232, RS-485)
• Test and Medical
Equipment
• Security and Alarm
Systems
• Point-of-Sale Terminals
• Motor Controls
RS-232 Application Example
RS-232 Port
Transceiver
RD
TD
RTS
IC
CTS
DSR
DTR
AQ15 (x6)
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
Case GND
(bidirectional implementation)
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/17/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection
- AQxx-02HTG
AQxx-02HTG
Series Series
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
PPk
Peak Pulse Power (tp=8/20μs)
500
W
TOP
Operating Temperature
-40 to 150
°C
TSTOR
Storage Temperature
-55 to 150
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any
other conditions above those indicated in the operational sections of this specification is not implied.
AQ05 Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Test Conditions
VRWM
IR=1μA
Breakdown Voltage
VBR
IR=1mA
Reverse Leakage Current
ILEAK
VR=5V
Reverse Standoff Voltage
Clamp Voltage1
Dynamic Resistance
Peak Pulse Current
ESD Withstand Voltage1
Diode Capacitance1
6.0
Typ
Max
Units
5.0
V
1.0
μA
7.0
V
IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3
8.0
9.8
V
IPP=10A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3
10.5
13.0
V
RDYN
TLP, tp=100ns, Pin 1 or Pin 2 to Pin 3
0.19
IPP
tp=8/20µs
VC
2
Min
VESD
Ω
33
IEC 61000-4-2 (Contact Discharge)
±30
IEC 61000-4-2 (Air Discharge)
±30
A
kV
kV
CI/O-GND
Reverse Bias=0V, f=1MHz
290
350
pF
CI/O-I/O
Reverse Bias=0V, f=1MHz
145
180
pF
Min
Typ
Max
13.3
14.2
AQ12 Electrical Characteristics (TOP=25ºC)
Parameter
Reverse Standoff Voltage
Symbol
Test Conditions
VRWM
IR=1μA
Breakdown Voltage
VBR
IR=1mA
Reverse Leakage Current
ILEAK
VR=12V
Clamp Voltage1
Dynamic Resistance2
Peak Pulse Current
ESD Withstand Voltage1
Diode Capacitance1
12.0
Units
V
V
1.0
μA
IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3
16.0
18.5
V
IPP=10A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3
20.0
22.5
V
RDYN
TLP, tp=100ns, Pin 1 or Pin 2 to Pin 3
0.25
IPP
tp=8/20µs
VC
VESD
Ω
20
IEC 61000-4-2 (Contact Discharge)
±30
IEC 61000-4-2 (Air Discharge)
±30
A
kV
kV
CI/O-GND
Reverse Bias=0V, f=1MHz
110
135
pF
CI/O-I/O
Reverse Bias=0V, f=1MHz
55
85
pF
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/17/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection
- AQxx-02HTG
AQxx-02HTG
Series Series
AQ15 Electrical Characteristics (TOP=25ºC)
Parameter
Reverse Standoff Voltage
Symbol
Test Conditions
VRWM
IR=1μA
Breakdown Voltage
VBR
IR=1mA
Reverse Leakage Current
ILEAK
Clamp Voltage1
Dynamic Resistance2
Peak Pulse Current
ESD Withstand Voltage1
Diode Capacitance1
Min
Typ
16.7
18.5
Max
15.0
VR=15V
Units
V
V
1.0
μA
IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3
20.5
24.0
V
IPP=10A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3
26.6
30.0
V
RDYN
TLP, tp=100ns, Pin 1 or Pin 2 to Pin 3
0.30
IPP
tp=8/20µs
VC
VESD
Ω
15
A
IEC 61000-4-2 (Contact Discharge)
±30
kV
IEC 61000-4-2 (Air Discharge)
±30
kV
CI/O-GND
Reverse Bias=0V, f=1MHz
85
100
pF
CI/O-I/O
Reverse Bias=0V, f=1MHz
45
75
pF
Min
Typ
Max
Units
26.7
28
AQ24 Electrical Characteristics (TOP=25ºC)
Parameter
Reverse Standoff Voltage
Symbol
Test Conditions
VRWM
IR=1μA
Breakdown Voltage
VBR
IR=1mA
Reverse Leakage Current
ILEAK
Clamp Voltage1
Dynamic Resistance2
Peak Pulse Current
ESD Withstand Voltage1
Diode Capacitance1
24.0
1.0
μA
IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3
30.0
36.0
V
IPP=5A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3
36.0
42.0
RDYN
TLP, tp=100ns, Pin 1 or Pin 2 to Pin 3
0.50
IPP
tp=8/20µs
VC
VESD
VR=24V
V
V
9
IEC 61000-4-2 (Contact Discharge)
±30
IEC 61000-4-2 (Air Discharge)
±30
V
Ω
A
kV
kV
CI/O-GND
Reverse Bias=0V, f=1MHz
60
65
pF
CI/O-I/O
Reverse Bias=0V, f=1MHz
30
50
pF
Min
Typ
Max
40.0
41.8
AQ36 Electrical Characteristics (TOP=25ºC)
Parameter
Reverse Standoff Voltage
Symbol
Test Conditions
VRWM
IR=1μA
Breakdown Voltage
VBR
IR=1mA
Reverse Leakage Current
ILEAK
Clamp Voltage1
Dynamic Resistance2
Peak Pulse Current
ESD Withstand Voltage1
Diode Capacitance1
VC
RDYN
IPP
VESD
36.0
VR=36V
Units
V
V
1.0
μA
IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3
45.0
52.0
V
IPP=5A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3
58.5
62.0
TLP, tp=100ns, Pin 1 or Pin 2 to Pin 3
0.65
tp=8/20µs
7
IEC 61000-4-2 (Contact Discharge)
±30
IEC 61000-4-2 (Air Discharge)
±30
V
Ω
A
kV
kV
CI/O-GND
Reverse Bias=0V, f=1MHz
45
50
pF
CI/O-I/O
Reverse Bias=0V, f=1MHz
25
40
pF
Note:
1
Parameter is guaranteed by design and/or component characterization.
2
Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/17/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection
- AQxx-02HTG
AQxx-02HTG
Series Series
Capacitance vs. Reverse Bias (Pin1 or Pin2 to Pin3)
8/20μs Pulse Waveform
110%
300
100%
250
90%
200
Percent of IPP
Capacitance (pF)
80%
AQ05
150
100
70%
60%
50%
40%
30%
AQ12
50
20%
AQ15
AQ24
SD24C
AQ36
SD36C
0
10%
0%
0.0
4.0
8.0
12.0
16.0
20.0
Reverse Bias (V)
24.0
28.0
32.0
5.0
18
18
16
16
14
14
TLP Current (A)
20
12
10
8
4
2
2
0
8
10
0
12
0
5
10
TLP Voltage (V)
15
20
25
TLP Voltage (V)
AQ15 Transmission Line Pulsing(TLP) Plot
AQ24 Transmission Line Pulsing(TLP) Plot
20
20
18
18
16
16
14
14
TLP Current (A)
TLP Current (A)
30.0
8
6
6
25.0
10
4
4
20.0
12
6
2
15.0
AQ12 Transmission Line Pulsing(TLP) Plot
20
0
10.0
Time (μs)
AQ05 Transmission Line Pulsing(TLP) Plot
TLP Current (A)
0.0
36.0
12
10
8
6
12
10
8
6
4
4
2
2
0
0
5
10
15
TLP Voltage (V)
20
25
30
0
0
5
10
15
20
25
30
35
40
TLP Voltage (V)
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/17/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection
- AQxx-02HTG
AQxx-02HTG
Series Series
AQ36 Transmission Line Pulsing(TLP) Plot
Power Derating Curve
110
18
100
16
90
% of Rated Power I PP
20
TLP Current (A)
14
12
10
8
6
4
80
70
60
50
40
30
20
10
2
0
0
0
5
10
15
20
25
30
35
40
45
50
55
TLP Voltage (V)
0
25
50
75
100
125
150
Ambient Temperature - TA (oC)
ISO10605 (C:330pF, R:330Ω) contact discharge plot at +8KV
ISO10605 (C:330pF, R:330Ω) contact discharge plot at -8KV
ISO10605 (C:330pF, R:330Ω) contact discharge plot at +8KV
ISO10605 (C:330pF, R:330Ω) contact discharge plot at -8KV
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/17/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - AQxx-02HTG Series
ISO10605 (C:330pF, R:330Ω) contact discharge plot at +8KV
ISO10605 (C:330pF, R:330Ω) contact discharge plot at -8KV
ISO10605 (C:330pF, R:330Ω) contact discharge plot at +8KV
ISO10605 (C:330pF, R:330Ω) contact discharge plot at -8KV
ISO10605 (C:330pF, R:330Ω) contact discharge plot at +8KV
ISO10605 (C:330pF, R:330Ω) contact discharge plot at -8KV
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/17/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - AQxx-02HTG Series
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260
Time within 5°C of actual peak Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
+0/-5
Part Number
TL
T S(max)
tL
Ramp-dow
Ramp-down
Preheat
T S(min)
tS
°C
Ordering Information
Critical Zone
TL to TP
Ramp-up
60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max
TS(max) to TL - Ramp-up Rate
tP
TP
Temperature
Reflow Condition
25
time to peak temperature
Time
Product Characteristics
Package
Min. Order Qty.
AQ05-02HTG
SOT23-3
3000
AQ12-02HTG
SOT23-3
3000
AQ15-02HTG
SOT23-3
3000
AQ24-02HTG
SOT23-3
3000
AQ36-02HTG
SOT23-3
3000
Lead Plating
Lead Material
Lead Coplanarity
Substrate Material
Body Material
Flammability
Matte Tin
Copper Alloy
0.004 inches(0.102mm)
Silicon
Molded Compound
UL Recognized compound meeting
flammability rating V-0
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/17/19
TVS Diode Array (SPA® Diodes)
AQxx-02HTG
Series Series
General Purpose ESD Protection
- AQxx-02HTG
Part Marking System
Part Numbering System
AQ xx –02 H T G
TVS Diode Arrays
(SPA® Automotive
Grade Diodes)
Series
Working
Voltage
Mxx
D
θ1
Bottom View
bx3
e
Symbol
e1
Pin1
Bottom View
bx3
e
L1 (gauge plane)
A1
A
E
E1
Top View
Detail A
θ
L
e1
L
Detail A
Side View
Top View
0.60
L1 (gauge plane)
L
Min
Max
A
0.90
1.10
0.035
0.043
A1
0.03
0.09
0.001
0.004
b
0.37
0.51
0.015
0.020
D
2.80
3.04
0.110
0.120
E
2.10
2.64
0.083
0.104
E1
1.20
1.40
0.047
0.055
e
0.95 BSC
e1
1.90 BSC
0.30
Ɵ
0.037 BSC
0.075 BSC
0.55
0.012
0.25 BSC
0.022
0.010 BSC
0°
8°
Ɵ1
Detail A
0°
7° TYP
8°
7° TYP
0.80
Side View
Inches
Max
L1
2.90
θ
L
Millimeters
Min
L
1.30
Detail A
Package
H: SOT23-3
A1
Pin1
θ1
T= Tape & Reel
Number of
Channels
A
Package Dimensions — SOT23-3
E
xx is the number of
working voltage
E1
D
G= Green
0.60
1.30
2.90
0.80
1.30
2.50
Recommended soldering pad layout (unit :mm)
Drawing# : H01-B
Embossed Carrier Tape & Reel Specification — SOT23-3
1.30
2.50
Symbol
Recommended soldering pad layout (unit :mm)
Drawing# : H01-B
8mm TAPE AND REEL
GENERAL INFORMA
TION
1. 3000 PIECES PER REEL.
2. ORDER IN MUL TIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
ACCESS HOLE
14.4mm
SO T23-3 (8mm POCKET PITCH)
Millimeters
Inches
Min
Max
Min
Max
E
1.65
1.85
0.065
0.073
F
3.40
3.60
0.134
0.142
P2
1.90
2.10
0.075
0.083
0.063
D
1.40
1.60
0.055
P0
3.90
4.10
0.154
0.161
W
7.70
8.30
0.303
0.327
P
3.90
4.10
0.154
0.161
A0
3.05
3.25
0.120
0.128
B0
2.67
2.87
0.105
0.113
K0
1.12
1.32
0.044
0.052
t
0.22
0.24
0.009
0.009
13mm
60mm
180mm
USER DIRECTION OF FEED
PIN 1
8.4mm
8mm TAPE AND REEL
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are
not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/17/19
