AQ3118-01ETG

TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - AQ3118 Series AQ3118 Series 0.3pF 10 kV Bidirectional Discrete TVS RoHS Pb GREEN Description The AQ3118 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in IEC 61000-4-2 international standard without performance degradation. The back-to back configuration provides symmetrical ESD protection for data lines when. Pinout Features 1 2 • ESD protection of ±10kV contact discharge, ±15kV air discharge, (IEC 610004-2) • Low leakage current of 50nA (max) at 18V • E  FT protection, IEC 61000-4-4, 40A (tp=5/50ns) • AEC-Q101 qualified • Lightning, 2A (8/20μ as defined in IEC 61000-4-5 2nd edition) • Low capacitance of 0.3pF @ VR=0V Functional Block Diagram 1 • Space efficient 0402 footprint • Halogen free, lead free and RoHS compliant • Moisture Sensitivity Level(MSL -1) • PPAP capable Applications 2 • Tablets • MP3/ PMP • Ultrabook • Set Top Boxes • eReader • Portable Medical • Smart Phones • NFC and FeliCa • Digital Cameras • Automotive applications © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/16/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - AQ3118 Series Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 2.0 A TOP Operating Temperature -40 to 150 °C TSTOR Storage Temperature -55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min VBR IR=1mA 20 Breakdown Voltage Reverse Standoff Voltage VRWM Reverse Leakage Current ILEAK Clamp Voltage1 VESD Dynamic Resistance2 RDYN Max Units 30 V 18 V VR=18V with 1pin at GND 1 50 nA IPP=1A, tp=8/20µs, Fwd 31 35 V IPP=2A, tp=8/20µs, Fwd 34 38 VC ESD Withstand Voltage1 Typ IEC 61000-4-2 (Contact) ±10 IEC 61000-4-2 (Air) ±15 V kV kV TLP, tP=100ns, I/O to GND 0.75 Ω Note: 1. Parameter is guaranteed by design and/or component characterization. 2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns 8/20μs Pulse Waveform Capacitance vs. Reverse Bias 0.5 110% 100% 0.4 Capacitance (pF) 90% Percent of IPP 80% 70% 60% 50% 40% 30% 0.3 0.2 0.1 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 0 Time (μs) Transmission Line Pulsing (TLP) Plot 6 9 12 Bias Voltage (V) 15 18 0 -1 18 -2 Attenuation (dB) 16 TLP Current (A) 3 Insertion Loss (S21) 20 14 12 10 8 6 -3 -4 -5 -6 -7 4 -8 2 0 0 -9 0 5 10 15 20 25 30 35 40 45 50 55 60 TLP Voltage (V) -10 10 100 Frequency (MHz) 1000 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/16/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - AQ3118 Series Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max 3°C/second max TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Automotive Grade TVS Diode Arrays (SPA® Diodes) Series Number of Channels -01 = 1 Channel Part Marking System Critical Zone TL to TP Ramp-up TL T S(max) tL Ramp-dow Ramp-down Preheat T S(min) tS 25 time to peak temperature Time Product Characteristics Part Numbering System AQ 3118 tP TP Temperature Reflow Condition – 01 E T G G= Green Lead Plating Pre-Plated Frame Lead Material Copper Alloy Substrate material Silicon Body Material Molded Compound UL Recognized compound meeting flammability rating V-0 Flammability T= Tape & Reel Package E: SOD882 Ordering Information Part Number Package Min. Order Qty. AQ3118-01ETG SOD882 10000 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/16/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - AQ3118 Series D L1 h Package Dimensions — SOD882 Max 0.45 0.50 0.55 A1 0.00 0.02 0.20 0.25 L2 0.45 0.50 D 0.95 1.00 1.05 E 0.55 0.60 0.65 E L2 h PIN1 L1 Top View e PIN1 Top View 0.07 h e E Nor. A A L1 A1 D Min L2 Dimensions Symbol Bottom View Bottom View 0.55 0.65BSC 0.12 0.30 0.30 0.17 0.35 0.60 A1 A Side View 0.05 e Side View 0.30 0.35 1.00 0.60 Recommended Soldering Pad Layout (mm) Embossed Carrier Tape & Reel Specification — SOD882 Tape Dimensions P0 P2 1.00 T Φ2 : 1 .5 5 ± 0 .05 Recommended Soldering Pad Layout (mm) T op C o v er T ap e F A0 W 3° R E F E B0 Reel Size 7 Inch K0 P1 Φ: 0 .4 0 ± 0 .0 5 Symbol Millimetres Min Max A0 0.65 0.75 B0 1.10 1.20 K0 0.50 0.60 E 1.65 1.85 F 3.45 3.55 P0 3.90 4.10 P1 1.90 2.10 P2 1.95 2.05 T 1.95 2.05 W 7.90 8.10 W1 S R Reel Dimensions (Size Φ178) K M N H W D ev ic e O rien tatio n in T ap e Symbol Millimetres Min Max M 177.0 179.0 N 59.0 61.0 W 11.0 12.0 W1 8.5 9.5 H 12.5 13.5 S 1.9 2.1 K 10.8 11.2 R 0.95 1.05 T T T T T Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/16/19