AQ3400-02UTG

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - AQ3400 SP3014 Series AQ3400, 1pF, ±30kV Diode Array RoHS Pb GREEN Description The AQ3400 integrates 2 channels of low capacitance steering diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). The AQ3400 can safely absorb repetitive ESD strikes above the maximum contact level specified in IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The low off-state capacitance makes it ideal for protecting high-speed signal lines such as USB2.0 or USB 3.0 and 1Gb Ethernet with an extremely low dynamic resistance to protect the most sensitive, state of the art chipsets against ESD transients. Pinout Features • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air • ESD, ISO 10605, 330pF 330Ω, ±30kV contact, ±30kV air • EFT, IEC 61000-4-4, 80A (tP=5/50ns) • Lightning, 8A (8/20μs as defined in IEC 61000-4-5 2nd edition) Functional Block Diagram • Low capacitance of 1pF (TYP) per I/O • Small form factor μDFN (JEDEC MO-229) package provides flow through routing to simplify PCB layout • AEC-Q101 qualified • Moisture Sensitivity Level(MSL -1) • Halogen free, lead free and RoHS compliant • PPAP capable • Low leakage current of 0.01μA (TYP) at 5V Applications • LCD/PDP TVs • Ultrabooks/Notebooks • External Storages • Digital Cameras • DVD/Blu-ray Players • Portable Medical • Set Top Boxes • Automotive Electronics • Smartphones • Wearable Technology USB 2.0 Protection Application Example USB Port *Package is shown as transparent USB Controller VBUS D+ D- SP1003 IC AQ3400 SP3014 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications GND The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2019 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/14/19 SP3014-02UTG TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - AQ3400 SP3014 Series Absolute Maximum Ratings Symbol Parameter Value IPP Peak Current (tp=8/20μs) TOP TSTOR Units 8 A Operating Temperature -40 to 125 °C Storage Temperature -55 to 150 °C SP3012 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Symbol Test Conditions VRWM IR = 1μA Min Typ Units 5.0 V Breakdown Voltage VBR IR = 1mA Reverse Leakage Current ILEAK VR=5V, Any I/O to GND 0.01 0.5 µA IPP=1A, tp=8/20µs, Fwd 9.2 12 V IPP=8A, tp=8/20µs, Fwd 13 16 V Clamp Voltage1 VC Dynamic Resistance RDYN 2 ESD Withstand Voltage1 CI/O-GND CI/O-I/O 7.8 TLP, tp=100ns, I/O to GND VESD Diode Capacitance3 6.5 Max V 0.24 Ω IEC 61000-4-2 (Contact) ±30 kV IEC 61000-4-2 (Air) ±30 kV 1 Reverse Bias=0V, f= 3 GHz pF 0.5 Note: 1 Parameter is guaranteed by design and/or component characterization. 2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns. 3. Package sizes larger than 0201 can add parasitic capacitance, inductance and resistance. 8/20μs Pulse Waveform Clamping voltage vs. IPP for 8/20μs waveshape 110% 14 100% 12 Clamp Voltage (VC ) 90% Percent of IPP 80% 70% 60% 50% 40% 30% 20% 10% 8 6 4 2 0 0% 0.0 5.0 10.0 15.0 Time (μs) ©2019 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/14/19 10 20.0 25.0 30.0 0 2 4 6 8 Peak Pulse Current -IPP (A) SP3014-02UTG TVS Diode Arrays (SPA® Diodes) AQ3400 Series Low Capacitance ESD Protection - SP3014 Negative Transmission Line Pulsing (TLP) Plot 40 0 35 -5 30 -10 TLP Current (A) TLP Current (A) Positive Transmission Line Pulsing (TLP) Plot 25 -15 20 -20 15 -25 10 -30 5 -35 0 -40 0 5 10 15 TLP Voltage (V) -10 -8 -6 -4 -2 0 TLP Voltage (V) IEC 61000-4-2 +8 kV Contact ESD Clamping Voltage IEC 61000-4-2 -8 kV Contact ESD Clamping Voltage ISO 10605 (C:330pF, R:330Ω) contact discharge plot at +8KV ISO 10605 (C:330pF, R:330Ω) contact discharge plot at -8KV ©2019 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/14/19 SP3014-02UTG TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - AQ3400 SP3014 Series Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Lead Plating Pre-Plated Frame (µDFN) Lead Material Copper Alloy Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 G= Green Package U= µDFN-6L 02 = 2 channel 5 4 AKKD T= Tape & Reel Series Time Product Characteristics 6 AQ 3400 – xx x T G Number of Channels Critical Zone TL to TP Ramp-up Part Marking System Part Numbering System Automotive Grade TVS Diode Arrays (SPA® Diodes) tP TP Temperature Reflow Condition 1 2 3 AK : Part code K : Assembly code D : Date code Ordering Information Part Number Package Min. Order Qty. AQ3400-02UTG µDFN-6L 3000 ©2019 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/14/19 SP3014-02UTG TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - AQ3400 SP3014 Series Package Dimensions —µDFN-6L c F D bx2 5 6 4 b1 x 4 4 6 Package µDFN-6L JEDEC MO-229 Pins 6 E Millimeters Min Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 L R Pin1 1 2 3 3 Top View e e 1 Bottom View 0.40 0.005 REF b 0.35 0.45 0.014 0.018 b1 0.15 0.25 0.006 0.010 A A3 0.125 REF A3 1.35 0.30 0.20 0.30 0.15 Inches 0.05 REF A1 0.48 0.42 c 1.55 1.65 0.062 0.065 E 0.95 1.05 0.038 0.042 0.48 0.55 1.10 Side View 1 0.50 0.002 REF D 0.05 0.50 F 0.80 REF 0.031 REF e 0.50 REF 0.020 REF 0.125 REF R Package outline L Package center line Recommended soldering pad layout (Unit : mm) 0.33 0.43 0.005 REF 0.013 0.017 Drawing# : U03-A Embossed Carrier Tape & Reel Specification — µDFN-6L Symbol User Feeding Direction ,Ref. ,Ref. Inches Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P 3.90 4.10 0.154 0.161 10P0 Pin 1 Location Millimeters 40.0+/-0.20 1.574+/-0.008 W 7.90 8.30 0.311 P0 3.90 4.10 0.154 0.319 0.161 A0 1.15 1.25 0.045 0.049 B0 1.75 1.85 0.069 0.073 K0 0.65 0.75 0.026 0.03 t 0.22 max 0.009 max ,Ref. 8mm TAPE AND REEL Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. ©2019 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/14/19 SP3014-02UTG