AQHV12-01LTG-C

TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - AQHVxx-01LTG-C Series AQHVxx-01LTG-C Series, 300W Discrete Bidirectional TVS Diode RoHS Pb GREEN Description This AQHVxx-01LTG-C series provides a highly effective ESD, EFT, and lightning surge protection component. It is ideally suited for power interfaces, passenger charging interfaces, LED lighting modules, and low speed I/Os. Its rating of ±30kV ESD exceeds the maximum ESD rating requirements as defined in the IEC 61000-4-2 international standard without suffering any performance degradation. The AQHV12-C can withstand up to 10A of surge current as defined by IEC 61000-4-5 2nd edition providing low voltage clamping levels during lightning induced events. Pinout Features • ESD, IEC 61000-4-2, 1 ±30kV contact, ±30kV air • EFT, IEC 61000-4-4, 40A (5/50ns) • Lightning, 10A (8/20μs as defined in IEC 61000-4-5 2nd edition) for AQHV12-C • Low leakage current • AEC-Q101 qualified • Moisture Sensitivity Level(MSL -1) • Halogen free, lead free and RoHS compliant • Low clamping voltage 2 • PPAP capable This component is bidirectional Applications Functional Block Diagram 1 2 • LED Lighting Modules • RS232 / RS485 • Portable Instrumentation • CAN and LIN Bus • General Purpose I/O • Automotive application Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/08/19 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - AQHVxx-01LTG-C Series Absolute Maximum Ratings Symbol Parameter Value Ppk Peak Pulse Power (tp=8/20μs) 300 Units W TOP Operating Temperature -40 to 150 °C TSTOR Storage Temperature -55 to 150 °C Notes: CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. AQHV12-C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR=1μA Breakdown Voltage VBR IR=1mA Reverse Leakage Current ILEAK V V 50 21 V IPP=10A, tP=8/20μs, I/O to I/O 27 30 V 0.34 RDYN TLP, tp=100ns, I/O to I/O Ipp tp=8/20µs CI/O-I/O 12 5 Peak Pulse Current1 Diode Capacitance 15 Units 18 Dynamic Resistance2 1 13.3 Max VR=12V VC VESD Typ IPP=1A, tp=8/20µs, I/O to I/O Clamp Voltage1 ESD Withstand Voltage1 Min nA Ω 10 A IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Reverse Bias=0V, f=1MHz 27 30 pF AQHV15-C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ 16.7 19.5 Max Reverse Standoff Voltage VRWM IR=1μA Breakdown Voltage VBR IR=1mA Reverse Leakage Current ILEAK VR=15V 5 50 nA Clamp Voltage1 VC IPP=1A, tp=8/20µs, I/O to I/O 23.5 27 V IPP=7A, tp=8/20µs, I/O to I/O 33.5 37 Dynamic Resistance2 RDYN TLP, tp=100ns, I/O to I/O 0.36 Peak Pulse Current1 Ipp tp=8/20µs ESD Withstand Voltage1 VESD Diode Capacitance1 CI/O-I/O 15 ±30 IEC 61000-4-2 (Air Discharge) ±30 Reverse Bias=0V, f=1MHz V V V Ω 7 IEC 61000-4-2 (Contact Discharge) Units A kV kV 21 24 pF Typ Max Units 24.0 V AQHV24-C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR=1μA Min Breakdown Voltage VBR IR=1mA Reverse Leakage Current ILEAK VR=24V 5 50 nA Clamp Voltage1 VC IPP=1A, tp=8/20µs, I/O to I/O 35.5 40 V IPP=5A, tp=8/20µs, I/O to I/O 49.5 55 V 0.52 Dynamic Resistance RDYN TLP, tp=100ns, I/O to I/O Peak Pulse Current1 Ipp tp=8/20µs 2 ESD Withstand Voltage1 VESD Diode Capacitance1 CI/O-I/O 26.7 V Ω 5.0 IEC 61000-4-2 (Contact Discharge) ±25 IEC 61000-4-2 (Air Discharge) ±30 Reverse Bias=0V, f=1MHz 29.5 A kV kV 15 17 pF ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/08/19 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - AQHVxx-01LTG-C Series AQHV36-C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR=1μA Breakdown Voltage VBR IR=1mA Reverse Leakage Current ILEAK Clamp Voltage1 VC Dynamic Resistance2 RDYN Peak Pulse Current1 Ipp ESD Withstand Voltage1 VESD Diode Capacitance1 CI/O-I/O Min Typ Max Units 36.0 40 V 43.5 V VR=36V 5 50 nA IPP=1A, tp=8/20µs, I/O to I/O 52.5 58 V IPP=3A, tp=8/20µs, I/O to I/O 67 72 TLP, tp=100ns, I/O to I/O 1.27 V Ω tp=8/20µs 3.0 IEC 61000-4-2 (Contact Discharge) ±15 IEC 61000-4-2 (Air Discharge) ±20 A kV kV Reverse Bias=0V, f=1MHz 11.5 13 pF Note: 1 Parameter is guaranteed by design and/or component characterization. 2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns 8/20μs Pulse Waveform Capacitance vs. Reverse Bias 110% 30.0 100% 90% 80% 20.0 AQHV12-C 15.0 Percent of IPP Capacitance (pF) 25.0 AQHV15-C 10.0 AQHV24-C AQHV36-C 5.0 0.0 70% 60% 50% 40% 30% 20% 10% 0 4 8 12 16 20 24 28 32 36 Bias Voltage (V) 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) AQHV12-C Positive Transmission Line Pulsing(TLP) Plot AQHV12-C Negative Transmission Line Pulsing(TLP) Plot 20 0 15 -5 TLP Current (A) TLP Current (A) 0% 10 -10 -15 5 -20 0 0 5 10 15 20 TLP Voltage (V) 25 30 -30 -25 -20 -15 -10 -5 0 TLP Voltage (V) ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/08/19 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - AQHVxx-01LTG-C Series AQHV15-C NegativeTransmission Line Pulsing(TLP) Plot 20 0 15 -5 TLP Current (A) TLP Current (A) AQHV15-C Positive Transmission Line Pulsing(TLP) Plot 10 -10 -15 5 -20 0 0 5 10 15 20 25 30 35 -35 -25 TLP Voltage (V) -15 -10 -5 0 AQHV24-C Negative Transmission Line Pulsing(TLP) Plot 20 0 15 -5 TLP Current (A) TLP Current (A) AQHV24-C Positive Transmission Line Pulsing(TLP) Plot 10 -10 -15 5 -20 0 0 10 20 30 40 50 -50 -40 AQHV36-C Positive Transmission Line Pulsing(TLP) Plot -30 -20 -10 0 TLP Voltage (V) TLP Voltage (V) AQHV36-C Negative Transmission Line Pulsing(TLP) Plot 15 0 TLP Current (A) TLP Current (A) -20 TLP Voltage (V) 10 5 -5 -10 -15 0 0 20 40 TLP Voltage (V) 60 80 -80 -60 -40 -20 0 TLP Volatge (V) ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/08/19 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - AQHVxx-01LTG-C Series AQHV12-C +8kV Contact ESD Clamping Voltage AQHV12-C -8kV Contact ESD Clamping Voltage AQHV15-C +8kV Contact ESD Clamping Voltage AQHV15-C -8kV Contact ESD Clamping Voltage AQHV24-C +8kV Contact ESD Clamping Voltage AQHV24-C -8kV Contact ESD Clamping Voltage ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/08/19 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - AQHVxx-01LTG-C Series AQHV36-C +8kV Contact ESD Clamping Voltage AQHV36-C -8kV Contact ESD Clamping Voltage Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C 60 – 180 secs - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max +0/-5 °C Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Part Marking System 1 B* tP TP Temperature Reflow Condition TL TS(max) tL Preheat TS(min) 25 Critical Zone TL to TP Ramp-up Ramp-do Ramp-down tS time to peak temperature Time Product Characteristics 2 Lead Plating Matte Tin Lead Material Copper Alloy Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 2: AQHV12-C 5: AQHV15-C 4: AQHV24-C 6: AQHV36-C ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/08/19 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - AQHVxx-01LTG-C Series Part Numbering System Ordering Information AQHV ** – 01 L T G –C Part Number TVS Diode Arrays (SPA® Automotive Grade Diodes) E2 G= Green Voltage D AQHV15-01LTG-C T= Tape & Reel 2 AQHV24-01LTG-C Package b Number of Channels 1 Min. Order Qty. SOD523 5000 AQHV12-01LTG-C Bidirectional E Package AQHV36-01LTG-C L: SOD523 E1 Top View Package Dimensions — SOD-523 θ Max Min Max A 0.51 0.77 0.020 0.030 A1 0.50 0.70 0.020 0.028 b 0.25 0.35 0.010 0.014 c 0.08 0.15 0.003 0.006 D 0.70 0.90 0.028 0.035 E 1.10 1.30 0.043 0.051 E1 1.50 1.70 0.059 0.067 Side View 0.60mm E2 E D 1 2 b 0.50mm E2 1.40mm Inches Min A A1 Side View L c θ Millimeters Symbol Recommended Soldering pad layout E1 L Drawing#: L01-B Top View Ɵ 0.20 REF 0.01 0.001 REF 0.07 0.000 7O REF 0.003 7O REF θ c A A1 Embossed Carrier Tape & Reel Specification — SOD-523 θ L Symbol Side View 0.60mm 0.50mm 1.40mm Recommended Soldering pad layout Drawing#: L01-B ,Ref. ,Ref. Component Orientation in Tape ,Ref. Millimeters Inches Min Max Min Max A0 0.91 1.01 0.036 0.040 B0 1.89 1.99 0.074 0.078 D0 1.50 1.60 0.059 0.063 D1 0.40 0.60 0.016 0.024 E1 1.65 1.85 0.065 0.073 F 3.40 3.60 0.134 0.142 P0 3.90 4.10 0.154 0.161 P 1.90 2.10 0.075 0.083 P1 1.95 2.05 0.077 0.081 K0 0.68 0.78 0.027 0.031 T 0.17 0.23 0.007 0.009 W 7.90 8.30 0.311 0.327 Side View 8mm TAPE AND REEL Pin1 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/08/19